Pieter Vorenkamp

Person

Aliso Viejo, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Thin recon interposer package without TSV for fine input/output pit...
- Patent number 10,615,110
- Issue date Apr 7, 2020
- Avago Technologies International Sales Pte. Limited
- Sam Ziqun Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin recon interposer package without TSV for fine input/output pit...
- Patent number 10,008,439
- Issue date Jun 26, 2018
- Avago Technologies General IP (Singapore) Pte. Ltd.
- Sam Ziqun Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic-core three-dimensional (3D) inductors and packaging integr...
- Patent number 9,693,461
- Issue date Jun 27, 2017
- Avago Technologies General IP (Singapore) Pte. Ltd.
- Sam Ziqun Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor interposer having a cavity for intra-interposer die
- Patent number 9,548,251
- Issue date Jan 17, 2017
- Broadcom Corporation
- Rezaur Rahman Khan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with a bridge interposer
- Patent number 9,431,371
- Issue date Aug 30, 2016
- Broadcom Corporation
- Sampath K. Karikalan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power control system with performance monitoring
- Patent number 9,429,973
- Issue date Aug 30, 2016
- Broadcom Corporation
- Neil Y. Kim
- G05 - CONTROLLING REGULATING
Information Patent Grant
Stacked packaging using reconstituted wafers
- Patent number 9,293,393
- Issue date Mar 22, 2016
- Broadcom Corporation
- Kevin Kunzhong Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power supply integrated circuit with feedback control
- Patent number 9,285,815
- Issue date Mar 15, 2016
- Broadcom Corporation
- Neil Y. Kim
- G05 - CONTROLLING REGULATING
Information Patent Grant
On-board power supply monitor and power control system
- Patent number 9,281,718
- Issue date Mar 8, 2016
- Broadcom Corporation
- Pieter Vorenkamp
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
System-in-package with integrated socket
- Patent number 9,275,976
- Issue date Mar 1, 2016
- Broadcom Corporation
- Sam Ziqun Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for multipoint detection in power-over-etherne...
- Patent number 9,189,043
- Issue date Nov 17, 2015
- Broadcom Corporation
- Pieter Vorenkamp
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Semiconductor package with improved testability
- Patent number 9,153,507
- Issue date Oct 6, 2015
- Broadcom Corporation
- Sam Ziqun Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with a bridge interposer
- Patent number 9,059,179
- Issue date Jun 16, 2015
- Broadcom Corporation
- Sampath K. V. Karikalan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Programmable interposer with conductive particles
- Patent number 9,041,171
- Issue date May 26, 2015
- Broadcom Corporation
- Sam Ziqun Zhao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package with ultra-thin interposer without through-se...
- Patent number 9,013,041
- Issue date Apr 21, 2015
- Broadcom Corporation
- Sampath K. V. Karikalan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Touch sensitive panel detecting hovering finger
- Patent number 9,007,331
- Issue date Apr 14, 2015
- Broadcom Corporation
- David A. Sobel
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Variable gain amplifier for low voltage applications
- Patent number 8,971,832
- Issue date Mar 3, 2015
- Broadcom Corporation
- Klaas Bult
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Semiconductor package with integrated electromagnetic shielding
- Patent number 8,928,128
- Issue date Jan 6, 2015
- Broadcom Corporation
- Sampath K. V. Karikalan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages with integrated heat spreaders
- Patent number 8,872,321
- Issue date Oct 28, 2014
- Broadcom Corporation
- Sam Ziqun Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power supply integrated circuit with feedback control
- Patent number 8,868,935
- Issue date Oct 21, 2014
- Broadcom Corporation
- Neil Y. Kim
- G05 - CONTROLLING REGULATING
Information Patent Grant
Hand-held gaming device with configurable touch sensitive panel(s)
- Patent number 8,845,424
- Issue date Sep 30, 2014
- Broadcom Corporation
- David A. Sobel
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Increasing efficiency of wireless power transfer
- Patent number 8,816,638
- Issue date Aug 26, 2014
- Broadcom Corporation
- Pieter Vorenkamp
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Increasing efficiency of wireless power transfer
- Patent number 8,803,476
- Issue date Aug 12, 2014
- Broadcom Corporation
- Pieter Vorenkamp
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Semiconductor package having an interposer configured for magnetic...
- Patent number 8,791,533
- Issue date Jul 29, 2014
- Broadcom Corporation
- Xiangdong Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with integrated selectively conductive film i...
- Patent number 8,749,072
- Issue date Jun 10, 2014
- Broadcom Corporation
- Sam Ziqun Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Digital IF demodulator for video applications
- Patent number 8,711,288
- Issue date Apr 29, 2014
- Broadcom Corporation
- Pieter Vorenkamp
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Method and system for direct digital up-conversion in a cable modem
- Patent number 8,677,434
- Issue date Mar 18, 2014
- Broadcom Corporation
- Pieter Vorenkamp
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Power control system
- Patent number 8,639,473
- Issue date Jan 28, 2014
- Broadcom Corporation
- Neil Y. Kim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Remote control for multimedia system having touch sensitive panel f...
- Patent number 8,614,621
- Issue date Dec 24, 2013
- Broadcom Corporation
- David A. Sobel
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Scalable integrated circuit high density capacitors
- Patent number 8,570,707
- Issue date Oct 29, 2013
- Broadcom Corporation
- Victor Chiu-Kit Fong
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
THIN RECON INTERPOSER PACKAGE WITHOUT TSV FOR FINE INPUT/OUTPUT PIT...
- Publication number 20180308791
- Publication date Oct 25, 2018
- Avago Technologies General IP (Singapore) PTE. LTD.
- Sam Ziqun ZHAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Portable Communication Device with Multi-Tiered Power Save Operation
- Publication number 20170026869
- Publication date Jan 26, 2017
- BROADCOM CORPORATION
- Chun-ying Chen
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Thin Recon Interposer Package Without TSV for Fine Input/Output Pit...
- Publication number 20170011993
- Publication date Jan 12, 2017
- BROADCOM CORPORATION
- Sam Ziqun ZHAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED PACKAGING USING RECONSTITUTED WAFERS
- Publication number 20160155728
- Publication date Jun 2, 2016
- BROADCOM CORPORATION
- Sam Ziqun Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRELESS DEVICE POWERED BY MEMS WITH ADAPTIVE COMMUNICATIONS
- Publication number 20150341842
- Publication date Nov 26, 2015
- BROADCOM CORPORATION
- Pieter Vorenkamp
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
MAGNETIC-CORE THREE-DIMENSIONAL (3D) INDUCTORS AND PACKAGING INTEGR...
- Publication number 20150302974
- Publication date Oct 22, 2015
- BROADCOM CORPORATION
- Sam Ziqun ZHAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH A BRIDGE INTERPOSER
- Publication number 20150235992
- Publication date Aug 20, 2015
- BROADCOM CORPORATION
- Sampath K. KARIKALAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Supply Integrated Circuit With Feedback Control
- Publication number 20150032280
- Publication date Jan 29, 2015
- BROADCOM CORPORATION
- Neil Y. Kim
- G05 - CONTROLLING REGULATING
Information Patent Application
STACKED PACKAGING USING RECONSTITUTED WAFERS
- Publication number 20140151900
- Publication date Jun 5, 2014
- BROADCOM CORPORATION
- Kevin Kunzhong Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Control System with Performance Monitoring
- Publication number 20140111272
- Publication date Apr 24, 2014
- BROADCOM CORPORATION
- Neil Y. Kim
- G01 - MEASURING TESTING
Information Patent Application
Variable Gain Amplifier for Low Voltage Applications
- Publication number 20140002194
- Publication date Jan 2, 2014
- Klaas Bult
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
ARTICLE OF CLOTHING INCLUDING BIO-MEDICAL UNITS
- Publication number 20130289382
- Publication date Oct 31, 2013
- BROADCOM CORPORATION
- Ahmadreza (Reza) Rofougaran
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
HAND-HELD GAMING DEVICE WITH CONFIGURABLE TOUCH SENSITIVE PANEL(S)
- Publication number 20130237322
- Publication date Sep 12, 2013
- BROADCOM CORPORATION
- David A. Sobel
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Semiconductor Package with Integrated Electromagnetic Shielding
- Publication number 20130221499
- Publication date Aug 29, 2013
- BROADCOM CORPORATION
- Sampath K.V. Karikalan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System-In-Package with Integrated Socket
- Publication number 20130221500
- Publication date Aug 29, 2013
- BROADCOM CORPORATION
- Sam Ziqun Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package with Integrated Selectively Conductive Film I...
- Publication number 20130221525
- Publication date Aug 29, 2013
- BROADCOM CORPORATION
- Sam Ziqun Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and Method for Multipoint Detection in Power-Over-Etherne...
- Publication number 20130227313
- Publication date Aug 29, 2013
- BROADCOM CORPORATION
- Pieter Vorenkamp
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Semiconductor Packages with Integrated Heat Spreaders
- Publication number 20130221506
- Publication date Aug 29, 2013
- BROADCOM CORPORATION
- Sam Ziqun Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INCREASING EFFICIENCY OF WIRELESS POWER TRANSFER
- Publication number 20130214743
- Publication date Aug 22, 2013
- BROADCOM CORPORATION
- Pieter Vorenkamp
- B60 - VEHICLES IN GENERAL
Information Patent Application
INCREASING EFFICIENCY OF WIRELESS POWER TRANSFER
- Publication number 20130214742
- Publication date Aug 22, 2013
- BROADCOM CORPORATION
- Pieter Vorenkamp
- B60 - VEHICLES IN GENERAL
Information Patent Application
Semiconductor Package with Improved Testability
- Publication number 20130193996
- Publication date Aug 1, 2013
- BROADCOM CORPORATION
- Sam Ziqun Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package Having an Interposer Configured for Magnetic...
- Publication number 20130193587
- Publication date Aug 1, 2013
- BROADCOM CORPORATION
- Xiangdong Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Interposer Having a Cavity for Intra-Interposer Die
- Publication number 20130181354
- Publication date Jul 18, 2013
- BROADCOM CORPORATION
- Rezaur Rahman Khan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package with Ultra-Thin Interposer Without Through-Se...
- Publication number 20130168860
- Publication date Jul 4, 2013
- BROADCOM CORPORATION
- Sampath K.V. Karikalan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package with a Bridge Interposer
- Publication number 20130168854
- Publication date Jul 4, 2013
- BROADCOM CORPORATION
- Sampath K.V. Karikalan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Programmable Interposer with Conductive Particles
- Publication number 20130168841
- Publication date Jul 4, 2013
- BROADCOM CORPORATION (IRVINE, CA)
- Sam Ziqun Zhao
- B82 - NANO-TECHNOLOGY
Information Patent Application
Stacked Packaging Using Reconstituted Wafers
- Publication number 20130154106
- Publication date Jun 20, 2013
- BROADCOM CORPORATION
- Kevin Kunzhong Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Performance Monitor and Power Control System
- Publication number 20130124137
- Publication date May 16, 2013
- BROADCOM CORPORATION
- Neil Y. Kim
- G01 - MEASURING TESTING
Information Patent Application
Portable Communication Device with Multi-Tiered Power Save Operation
- Publication number 20120329533
- Publication date Dec 27, 2012
- BROADCOM CORPORATION
- Chun-ying Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Scalable Integrated Circuit High Density Capacitors
- Publication number 20120018843
- Publication date Jan 26, 2012
- BROADCOM CORPORATION
- Victor Chiu-Kit Fong
- H01 - BASIC ELECTRIC ELEMENTS

Pieter Vorenkamp

Person

Patents Grantslast 30 patents

Thin recon interposer package without TSV for fine input/output pit...

Thin recon interposer package without TSV for fine input/output pit...

Magnetic-core three-dimensional (3D) inductors and packaging integr...

Semiconductor interposer having a cavity for intra-interposer die

Semiconductor package with a bridge interposer

Power control system with performance monitoring

Stacked packaging using reconstituted wafers

Power supply integrated circuit with feedback control

On-board power supply monitor and power control system

System-in-package with integrated socket

Apparatus and method for multipoint detection in power-over-etherne...

Semiconductor package with improved testability

Semiconductor package with a bridge interposer

Programmable interposer with conductive particles

Semiconductor package with ultra-thin interposer without through-se...

Touch sensitive panel detecting hovering finger

Variable gain amplifier for low voltage applications

Semiconductor package with integrated electromagnetic shielding

Semiconductor packages with integrated heat spreaders

Power supply integrated circuit with feedback control

Hand-held gaming device with configurable touch sensitive panel(s)

Increasing efficiency of wireless power transfer

Increasing efficiency of wireless power transfer

Semiconductor package having an interposer configured for magnetic...

Semiconductor package with integrated selectively conductive film i...

Digital IF demodulator for video applications

Method and system for direct digital up-conversion in a cable modem

Power control system

Remote control for multimedia system having touch sensitive panel f...

Scalable integrated circuit high density capacitors

Patents Applicationslast 30 patents

THIN RECON INTERPOSER PACKAGE WITHOUT TSV FOR FINE INPUT/OUTPUT PIT...

Portable Communication Device with Multi-Tiered Power Save Operation

Thin Recon Interposer Package Without TSV for Fine Input/Output Pit...

STACKED PACKAGING USING RECONSTITUTED WAFERS

WIRELESS DEVICE POWERED BY MEMS WITH ADAPTIVE COMMUNICATIONS

MAGNETIC-CORE THREE-DIMENSIONAL (3D) INDUCTORS AND PACKAGING INTEGR...

SEMICONDUCTOR PACKAGE WITH A BRIDGE INTERPOSER

Power Supply Integrated Circuit With Feedback Control

STACKED PACKAGING USING RECONSTITUTED WAFERS

Power Control System with Performance Monitoring

Variable Gain Amplifier for Low Voltage Applications

ARTICLE OF CLOTHING INCLUDING BIO-MEDICAL UNITS

HAND-HELD GAMING DEVICE WITH CONFIGURABLE TOUCH SENSITIVE PANEL(S)

Semiconductor Package with Integrated Electromagnetic Shielding

System-In-Package with Integrated Socket

Semiconductor Package with Integrated Selectively Conductive Film I...

Apparatus and Method for Multipoint Detection in Power-Over-Etherne...

Semiconductor Packages with Integrated Heat Spreaders

INCREASING EFFICIENCY OF WIRELESS POWER TRANSFER

INCREASING EFFICIENCY OF WIRELESS POWER TRANSFER

Semiconductor Package with Improved Testability

Semiconductor Package Having an Interposer Configured for Magnetic...

Semiconductor Interposer Having a Cavity for Intra-Interposer Die

Semiconductor Package with Ultra-Thin Interposer Without Through-Se...

Semiconductor Package with a Bridge Interposer

Programmable Interposer with Conductive Particles

Stacked Packaging Using Reconstituted Wafers

Performance Monitor and Power Control System

Portable Communication Device with Multi-Tiered Power Save Operation

Scalable Integrated Circuit High Density Capacitors