Pik Ling Lau

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Chuk Yuen North EST, HK

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Patents Grantslast 30 patents

Information Patent Grant
Metal foil laminated IC package
- Patent number 6,429,048
- Issue date Aug 6, 2002
- Asat LTD
- Neil McLellan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METAL FOIL LAMINATED IC PACKAGE
- Publication number 20020068378
- Publication date Jun 6, 2002
- ASAT Ltd.
- Neil McLellan
- H01 - BASIC ELECTRIC ELEMENTS