Pil Soon BAE

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Icheon-si Gyeonggi-do, KR

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Patents Grantslast 30 patents

Information Patent Grant
Methods of stacking semiconductor dies
- Patent number 10,497,691
- Issue date Dec 3, 2019
- SK hynix Inc.
- Chanho Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level packages and electronics system including the same
- Patent number 9,837,360
- Issue date Dec 5, 2017
- SK hynix Inc.
- Hyeong Seok Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 8,889,481
- Issue date Nov 18, 2014
- SK Hynix Inc.
- Jong Hoon Kim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHODS OF STACKING SEMICONDUCTOR DIES
- Publication number 20190333910
- Publication date Oct 31, 2019
- SK HYNIX INC.
- Chanho SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTORS, PACKAGES, WAFER LEVEL PACKAGES, AND METHODS OF MANU...
- Publication number 20170170127
- Publication date Jun 15, 2017
- SK HYNIX INC.
- Hyeong Seok CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES, METHODS OF FABRICATING THE SAME, MEMORY CAR...
- Publication number 20160225744
- Publication date Aug 4, 2016
- SK HYNIX INC.
- Jong Hyun NAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20140145343
- Publication date May 29, 2014
- SK HYNIX INC.
- Jong Hoon KIM
- H01 - BASIC ELECTRIC ELEMENTS