Pimpa Boonyatee

Follow

Person

Bangkok, TH

People

Patents Grantslast 30 patents

Information Patent Grant
Lead frame with partially-etched connecting bar
- Patent number 10,249,556
- Issue date Apr 2, 2019
- NXP B.V.
- Verapath Vareesantichai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of assembling semiconductor devices of varying thicknesses
- Patent number 9,812,339
- Issue date Nov 7, 2017
- NXP B.V.
- Pimpa Boonyatee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
NON-LEADED DEVICE SINGULATION
- Publication number 20190252256
- Publication date Aug 15, 2019
- NXP B.V.
- Pimpa Boonyatee
- H01 - BASIC ELECTRIC ELEMENTS