Pin-Yin Shin

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Taichang, TW

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Patents Grantslast 30 patents

Information Patent Grant
Bonding apparatus and method
- Patent number 10,312,118
- Issue date Jun 4, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Pei-Shan Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for controlling the quality of a photoresist s...
- Patent number 6,203,659
- Issue date Mar 20, 2001
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yun-Hung Shen
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY

Patents Applicationslast 30 patents

Information Patent Application
BONDING APPARATUS AND METHOD
- Publication number 20150200118
- Publication date Jul 16, 2015
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Pei-Shan WU
- H01 - BASIC ELECTRIC ELEMENTS