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Patents Grantslast 30 patents

Information Patent Grant
Method of forming material layer
- Patent number 12,334,357
- Issue date Jun 17, 2025
- Samsung Electronics Co., Ltd.
- Kyung-Eun Byun
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE COMPRISING TWO-DIMENSIONAL MATERIAL AND METHOD...
- Publication number 20230275128
- Publication date Aug 31, 2023
- Samsung Electronics Co., Ltd.
- Junyoung KWON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING MATERIAL LAYER
- Publication number 20220254643
- Publication date Aug 11, 2022
- Samsung Electronics Co., Ltd.
- Kyung-Eun BYUN
- H01 - BASIC ELECTRIC ELEMENTS