PING-CHOU YANG

Person

Yonghe City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
LED chip package structure using sedimentation and method for makin...
- Patent number 8,623,680
- Issue date Jan 7, 2014
- Harvatek Corporation
- Bily Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Strip LED
- Patent number D660259
- Issue date May 22, 2012
- Harvatek Corporation
- Bily Wang
- D13 - Equipment for production, distribution, or transformation of energy
Information Patent Grant
Reflection-type light-emitting module with high heat-dissipating an...
- Patent number 8,079,737
- Issue date Dec 20, 2011
- Harvatek Corporation
- Bily Wang
- F21 - LIGHTING
Information Patent Grant
LED chip package structure with an embedded ESD function and method...
- Patent number 7,964,420
- Issue date Jun 21, 2011
- Harvatek Corporation
- Bily Wang
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
LED chip package structure with an embedded ESD function and method...
- Patent number 7,876,593
- Issue date Jan 25, 2011
- Harvatek Corporation
- Bily Wang
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Light emitting diode
- Patent number D595675
- Issue date Jul 7, 2009
- Harvatek Corporation
- Bily Wang
- D13 - Equipment for production, distribution, or transformation of energy
Information Patent Grant
Light emitting diode
- Patent number D595674
- Issue date Jul 7, 2009
- Harvatek Corporation
- Bily Wang
- D13 - Equipment for production, distribution, or transformation of energy

Patents Applicationslast 30 patents

Information Patent Application
LED CHIP PACKAGE STRUCTURE USING SEDIMENTATION AND METHOD FOR MAKIN...
- Publication number 20120003765
- Publication date Jan 5, 2012
- HARVATEK CORPORATION
- BILY WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LED CHIP PACKAGE STRUCTURE WITH AN EMBEDDED ESD FUNCTION AND METHOD...
- Publication number 20110003409
- Publication date Jan 6, 2011
- HARVATEK CORPORATION
- BILY WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REFLECTION-TYPE LIGHT-EMITTING MODULE WITH HIGH HEAT-DISSIPATING AN...
- Publication number 20100264797
- Publication date Oct 21, 2010
- Bily WANG
- F21 - LIGHTING
Information Patent Application
Led chip package structure using sedimentation and method for makin...
- Publication number 20100006880
- Publication date Jan 14, 2010
- Bily Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LED CHIP PACKAGE STRUCTURE WITH AN EMBEDDED ESD FUNCTION AND METHOD...
- Publication number 20090316315
- Publication date Dec 24, 2009
- HARVATEK CORPORATION
- BILY WANG
- H01 - BASIC ELECTRIC ELEMENTS

PING-CHOU YANG

Person

Patents Grantslast 30 patents

LED chip package structure using sedimentation and method for makin...

Strip LED

Reflection-type light-emitting module with high heat-dissipating an...

LED chip package structure with an embedded ESD function and method...

LED chip package structure with an embedded ESD function and method...

Light emitting diode

Light emitting diode

Patents Applicationslast 30 patents

LED CHIP PACKAGE STRUCTURE USING SEDIMENTATION AND METHOD FOR MAKIN...

LED CHIP PACKAGE STRUCTURE WITH AN EMBEDDED ESD FUNCTION AND METHOD...

REFLECTION-TYPE LIGHT-EMITTING MODULE WITH HIGH HEAT-DISSIPATING AN...

Led chip package structure using sedimentation and method for makin...

LED CHIP PACKAGE STRUCTURE WITH AN EMBEDDED ESD FUNCTION AND METHOD...