Ping-Feng Lee

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Banciao City, TW

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Patents Grantslast 30 patents

Information Patent Grant
Chip heat dissipation structure and manufacturing method
- Patent number 7,427,807
- Issue date Sep 23, 2008
- Mitac Technology Corp.
- Ming-Hang Hwang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Heat Sink Fin Structure and Manufacturing Method Thereof
- Publication number 20070199677
- Publication date Aug 30, 2007
- Ming-Hang Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dissipation Heat Pipe Structure and Manufacturing Method Thereof
- Publication number 20070199681
- Publication date Aug 30, 2007
- Ming-Hang Hwang
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
Chip Heat Dissipation System and Manufacturing Method and Structure...
- Publication number 20070199679
- Publication date Aug 30, 2007
- Ming-Hang Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip Heat Dissipation System and Structure of Heat Exchange Device...
- Publication number 20070201207
- Publication date Aug 30, 2007
- Ming-Hang Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Air Blown Chip Dissipation Device and Manufacturing Method Thereof
- Publication number 20060256528
- Publication date Nov 16, 2006
- Ming-Hang Hwang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Chip heat dissipation structure and manufacturing method
- Publication number 20060205118
- Publication date Sep 14, 2006
- Ming-Hang Hwang
- H01 - BASIC ELECTRIC ELEMENTS