Ping Ha YEUNG

Person

Singapore, SG

People

Patents Grantslast 30 patents

Information Patent Grant
Alloyed 2N copper wires for bonding in microelectronics devices
- Patent number 9,589,694
- Issue date Mar 7, 2017
- Heraeus Deutschland GmbH & Co. KG
- Murali Sarangapani
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of polishing nickel-phosphorous
- Patent number 8,247,326
- Issue date Aug 21, 2012
- Cabot Microelectronics Corporation
- Venkataramanan Balasubramaniam
- G11 - INFORMATION STORAGE
Information Patent Grant
Composition and method for polishing nickel-phosphorous-coated alum...
- Patent number 7,922,926
- Issue date Apr 12, 2011
- Cabot Microelectronics Corporation
- Selvaraj Palanisamy Chinnathambi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
COPPER BONDING WIRE WITH ANGSTROM (Å) THICK SURFACE OXIDE LAYER
- Publication number 20170154863
- Publication date Jun 1, 2017
- Heraeus Deutschland GmbH & Co. KG
- Murali SARANGAPANI
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
COPPER BOND WIRE AND METHOD OF MAKING THE SAME
- Publication number 20160078980
- Publication date Mar 17, 2016
- HERAEUS MATERIALS SINGAPORE PTE., LTD.
- Murali SARANGAPANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3N COPPER WIRES WITH TRACE ADDITIONS FOR BONDING IN MICROELECTRONIC...
- Publication number 20130142568
- Publication date Jun 6, 2013
- HERAEUS MATERIALS TECHNOLOGY GMBH & CO. KG
- Murali SARANGAPANI
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Secondary Alloyed 1N Copper Wires for Bonding in Microelectronics D...
- Publication number 20130140068
- Publication date Jun 6, 2013
- HERAEUS MATERIALS TECHNOLOGY GMBH & CO. KG
- Murali SARANGAPANI
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
DOPED 4N COPPER WIRES FOR BONDING IN MICROELECTRONICS DEVICES
- Publication number 20130142567
- Publication date Jun 6, 2013
- HERAEUS MATERIALS TECHNOLOGY GMBH & CO. KG
- Murali SARANGAPANI
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Alloyed 2N Copper Wires for Bonding in Microelectronics Devices
- Publication number 20130140084
- Publication date Jun 6, 2013
- HERAEUS MATERIALS TECHNOLOGY GMBH & CO. KG
- Murali SARANGAPANI
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
METHOD OF POLISHING NICKEL-PHOSPHOROUS
- Publication number 20100009537
- Publication date Jan 14, 2010
- Cabot Microelectronics Corporation
- Venkataramanan Balasubramaniam
- G11 - INFORMATION STORAGE
Information Patent Application
COMPOSITION AND METHOD FOR POLISHING NICKEL-PHOSPHOROUS-COATED ALUM...
- Publication number 20090173717
- Publication date Jul 9, 2009
- Cabot Microelectronics Corporation
- Selvaraj Palanisamy Chinnathambi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Ping Ha YEUNG

Person

Patents Grantslast 30 patents

Alloyed 2N copper wires for bonding in microelectronics devices

Method of polishing nickel-phosphorous

Composition and method for polishing nickel-phosphorous-coated alum...

Patents Applicationslast 30 patents

COPPER BONDING WIRE WITH ANGSTROM (Å) THICK SURFACE OXIDE LAYER

COPPER BOND WIRE AND METHOD OF MAKING THE SAME

3N COPPER WIRES WITH TRACE ADDITIONS FOR BONDING IN MICROELECTRONIC...

Secondary Alloyed 1N Copper Wires for Bonding in Microelectronics D...

DOPED 4N COPPER WIRES FOR BONDING IN MICROELECTRONICS DEVICES

Alloyed 2N Copper Wires for Bonding in Microelectronics Devices

METHOD OF POLISHING NICKEL-PHOSPHOROUS

COMPOSITION AND METHOD FOR POLISHING NICKEL-PHOSPHOROUS-COATED ALUM...