Ping-Heng WU

Person

Hefei, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Capacitance structure and forming method thereof
- Patent number 12,132,076
- Issue date Oct 29, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Ping-Heng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for manufacturing same
- Patent number 12,119,234
- Issue date Oct 15, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Ping-Heng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure with conductive plug and capacitor array
- Patent number 12,068,239
- Issue date Aug 20, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Ping-Heng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrate and method of forming the same, package structure...
- Patent number 12,027,379
- Issue date Jul 2, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Ping-Heng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for forming semiconductor structure
- Patent number 12,009,324
- Issue date Jun 11, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Ping-Heng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact window structure, metal plug and forming method thereof, an...
- Patent number 12,002,748
- Issue date Jun 4, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Jie Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure
- Patent number 11,990,390
- Issue date May 21, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Ping-Heng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for manufacturing semiconductor...
- Patent number 11,961,798
- Issue date Apr 16, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Ping-Heng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact window structure and method for forming contact window stru...
- Patent number 11,929,280
- Issue date Mar 12, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Ping-Heng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure, redistribution layer (RDL) structure, and...
- Patent number 11,798,904
- Issue date Oct 24, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Ping-Heng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redistribution layer (RDL) structure, semiconductor device and manu...
- Patent number 11,605,605
- Issue date Mar 14, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Ping-Heng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Distribution layer structure and manufacturing method thereof, and...
- Patent number 11,587,893
- Issue date Feb 21, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Ping-Heng Wu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
WAFER AND METHOD OF MAKING, AND SEMICONDUCTOR DEVICE
- Publication number 20230230936
- Publication date Jul 20, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC
- PING-HENG WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER AND METHOD OF MAKING, AND SEMICONDUCTOR DEVICE
- Publication number 20230215815
- Publication date Jul 6, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC
- PING-HENG WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20230126464
- Publication date Apr 27, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- PING-HENG WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE AND METHOD OF FORMING THE SAME, PACKAGE STRUCTURE...
- Publication number 20220351984
- Publication date Nov 3, 2022
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Ping-Heng WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
A Semiconductor Device and a Method Making the Same
- Publication number 20220262750
- Publication date Aug 18, 2022
- CHANGXIN MEMORY TECHNOLOGIES, INC
- PING-HENG WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING SEMICONDUCTOR...
- Publication number 20220165644
- Publication date May 26, 2022
- CHANGXIN MEMORY TECHNOLOGIES, INC
- PING-HENG WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING SAME
- Publication number 20220157620
- Publication date May 19, 2022
- Changxin Memory Technologies, Inc.
- PING-HENG WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
A Semiconductor Device and A Manufacturing Method
- Publication number 20220157830
- Publication date May 19, 2022
- CHANGXIN MEMORY TECHNOLOGIES, INC
- PING-HENG WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITANCE STRUCTURE AND FORMING METHOD THEREOF
- Publication number 20220149148
- Publication date May 12, 2022
- CHANGXIN MEMORY TECHNOLOGIES, INC
- PING-HENG WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPENING STRUCTURE AND FORMING METHOD THEREOF, CONTACT PLUG STRUCTUR...
- Publication number 20220139721
- Publication date May 5, 2022
- CHANGXIN MEMORY TECHNOLOGIES, INC
- PING-HENG WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS AND MANUFACTURING METHOD THEREOF, AND THREE...
- Publication number 20220139808
- Publication date May 5, 2022
- CHANGXIN MEMORY TECHNOLOGIES, INC
- PING-HENG WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, SEMICONDUCTOR STRUCTURE AND FORMATION METHOD...
- Publication number 20220122987
- Publication date Apr 21, 2022
- CHANGXIN MEMORY TECHNOLOGIES, INC
- PING-HENG WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE STRUCTURE, SEMICONDUCTOR STRUCTURE AND MANUFACTURING MET...
- Publication number 20220115295
- Publication date Apr 14, 2022
- CHANGXIN MEMORY TECHNOLOGIES, INC
- PING-HENG WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20220093506
- Publication date Mar 24, 2022
- CHANGXIN MEMORY TECHNOLOGIES, INC
- PING-HENG WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT WINDOW STRUCTURE, METAL PLUG AND FORMING METHOD THEREOF, AN...
- Publication number 20220093509
- Publication date Mar 24, 2022
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Jie Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT WINDOW STRUCTURE AND METHOD FOR FORMING CONTACT WINDOW STRU...
- Publication number 20220093454
- Publication date Mar 24, 2022
- CHANGXIN MEMORY TECHNOLOGIES, INC
- PING-HENG WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING SEMICONDUCTOR...
- Publication number 20220084934
- Publication date Mar 17, 2022
- CHANGXIN MEMORY TECHNOLOGIES, INC
- PING-HENG WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING PAD STRUCTURE, SEMICONDUCTOR STRUCTURE, SEMICONDUCTOR PACKA...
- Publication number 20220084966
- Publication date Mar 17, 2022
- CHANGXIN MEMORY TECHNOLOGIES, INC
- PING-HENG WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND FORMING METHOD THEREOF
- Publication number 20220028796
- Publication date Jan 27, 2022
- Changxin Memory Technologies, Inc.
- PING-HENG WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING SEMICONDUCTOR STRUCTURE
- Publication number 20220028810
- Publication date Jan 27, 2022
- Changxin Memory Technologies, Inc.
- PING-HENG WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20220005747
- Publication date Jan 6, 2022
- Changxin Memory Technologies, Inc.
- PING-HENG WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, FABRICATION METHOD THEREOF, PACKAGE AND FABRI...
- Publication number 20210280563
- Publication date Sep 9, 2021
- Changxin Memory Technologies, Inc.
- Ping-Heng WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND FABRICATING METHOD THEREOF
- Publication number 20210265199
- Publication date Aug 26, 2021
- Changxin Memory Technologies, Inc.
- Ping-Heng WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE, REDISTRIBUTION LAYER (RDL) STRUCTURE, AND...
- Publication number 20210242149
- Publication date Aug 5, 2021
- Changxin Memory Technologies, Inc.
- Ping-Heng WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDISTRIBUTION LAYER (RDL) STRUCTURE, SEMICONDUCTOR DEVICE AND MANU...
- Publication number 20210225787
- Publication date Jul 22, 2021
- Changxin Memory Technologies, Inc.
- Ping-Heng WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISTRIBUTION LAYER STRUCTURE AND MANUFACTURING METHOD THEREOF, AND...
- Publication number 20210091019
- Publication date Mar 25, 2021
- Changxin Memory Technologies, Inc.
- Ping-Heng WU
- H01 - BASIC ELECTRIC ELEMENTS

Ping-Heng WU

Person

Patents Grantslast 30 patents

Capacitance structure and forming method thereof

Semiconductor structure and method for manufacturing same

Semiconductor structure with conductive plug and capacitor array

Package substrate and method of forming the same, package structure...

Semiconductor structure and method for forming semiconductor structure

Contact window structure, metal plug and forming method thereof, an...

Semiconductor structure

Semiconductor structure and method for manufacturing semiconductor...

Contact window structure and method for forming contact window stru...

Semiconductor structure, redistribution layer (RDL) structure, and...

Redistribution layer (RDL) structure, semiconductor device and manu...

Distribution layer structure and manufacturing method thereof, and...

Patents Applicationslast 30 patents

WAFER AND METHOD OF MAKING, AND SEMICONDUCTOR DEVICE

WAFER AND METHOD OF MAKING, AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

PACKAGE SUBSTRATE AND METHOD OF FORMING THE SAME, PACKAGE STRUCTURE...

A Semiconductor Device and a Method Making the Same

SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING SEMICONDUCTOR...

SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING SAME

A Semiconductor Device and A Manufacturing Method

CAPACITANCE STRUCTURE AND FORMING METHOD THEREOF

OPENING STRUCTURE AND FORMING METHOD THEREOF, CONTACT PLUG STRUCTUR...

SEMICONDUCTOR APPARATUS AND MANUFACTURING METHOD THEREOF, AND THREE...

SEMICONDUCTOR DEVICE, SEMICONDUCTOR STRUCTURE AND FORMATION METHOD...

CONDUCTIVE STRUCTURE, SEMICONDUCTOR STRUCTURE AND MANUFACTURING MET...

SEMICONDUCTOR STRUCTURE

CONTACT WINDOW STRUCTURE, METAL PLUG AND FORMING METHOD THEREOF, AN...

CONTACT WINDOW STRUCTURE AND METHOD FOR FORMING CONTACT WINDOW STRU...

SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING SEMICONDUCTOR...

BONDING PAD STRUCTURE, SEMICONDUCTOR STRUCTURE, SEMICONDUCTOR PACKA...

SEMICONDUCTOR STRUCTURE AND FORMING METHOD THEREOF

SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING SEMICONDUCTOR STRUCTURE

SEMICONDUCTOR STRUCTURE

SEMICONDUCTOR DEVICE, FABRICATION METHOD THEREOF, PACKAGE AND FABRI...

SEMICONDUCTOR DEVICE AND FABRICATING METHOD THEREOF

SEMICONDUCTOR STRUCTURE, REDISTRIBUTION LAYER (RDL) STRUCTURE, AND...

REDISTRIBUTION LAYER (RDL) STRUCTURE, SEMICONDUCTOR DEVICE AND MANU...

DISTRIBUTION LAYER STRUCTURE AND MANUFACTURING METHOD THEREOF, AND...