Ping-Huang Chiang

Person

Hsinchu, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor structure and fabrication method thereof
- Patent number 12,342,585
- Issue date Jun 24, 2025
- United Microelectronics Corp.
- Chia-Ling Wang
Information Patent Grant
Manufacturing method of high voltage semiconductor device
- Patent number 12,342,592
- Issue date Jun 24, 2025
- United Microelectronics Corp.
- Hsin-Han Wu
Information Patent Grant
Semiconductor structure and fabrication method thereof
- Patent number 12,310,071
- Issue date May 20, 2025
- United Microelectronics Corp.
- Chia-Ling Wang
Information Patent Grant
Manufacturing method of semiconductor device
- Patent number 12,183,809
- Issue date Dec 31, 2024
- United Microelectronics Corp.
- Wei-Lun Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of fabricating the same
- Patent number 12,100,624
- Issue date Sep 24, 2024
- United Microelectronics Corp.
- Ta-Wei Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and forming method thereof
- Patent number 12,046,596
- Issue date Jul 23, 2024
- United Microelectronics Corp.
- Wei-Lun Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High voltage semiconductor device and manufacturing method thereof
- Patent number 11,923,435
- Issue date Mar 5, 2024
- United Microelectronics Corp.
- Hsin-Han Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High voltage semiconductor device and manufacturing method thereof
- Patent number 10,903,334
- Issue date Jan 26, 2021
- United Microelectronics Corp.
- Shih-Yin Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High voltage semiconductor device and manufacturing method thereof
- Patent number 10,629,697
- Issue date Apr 21, 2020
- United Microelectronics Corp.
- Shih-Yin Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming transistor with dual spacer
- Patent number 10,475,903
- Issue date Nov 12, 2019
- United Microelectronics Corp.
- Chia-Ling Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transistor with dual spacer and forming method thereof
- Patent number 10,453,938
- Issue date Oct 22, 2019
- United Microelectronics Corp.
- Chia-Ling Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,411,088
- Issue date Sep 10, 2019
- United Microelectronics Corp.
- Chang-Po Hsiung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-voltage metal-oxide-semiconductor transistor and fabrication m...
- Patent number 9,985,129
- Issue date May 29, 2018
- United Microelectronics Corp.
- Shih-Yin Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Communications method and apparatus for carrier aggregation
- Patent number 9,973,254
- Issue date May 15, 2018
- Mediatek Inc.
- Po-Ying Chen
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Semiconductor device and method of forming the same
- Patent number 9,972,678
- Issue date May 15, 2018
- United Microelectronics Corp.
- Chang-Po Hsiung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-voltage metal-oxide-semiconductor transistor and fabrication m...
- Patent number 9,859,417
- Issue date Jan 2, 2018
- United Microelectronics Corp.
- Shih-Yin Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for forming the same
- Patent number 9,741,850
- Issue date Aug 22, 2017
- United Microelectronics Corp.
- Shih-Yin Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating semiconductor MOS device
- Patent number 9,577,069
- Issue date Feb 21, 2017
- United Microelectronics Corp.
- Shih-Chieh Pu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Communications method and apparatus for carrier aggregation
- Patent number 9,553,652
- Issue date Jan 24, 2017
- Mediatek Inc.
- Po-Ying Chen
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Structure for semiconductor package for improving the efficiency of...
- Patent number 5,903,052
- Issue date May 11, 1999
- Industrial Technology Research Institute
- Lung-Tai Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder paste inter-layer alignment apparatus for area-array on-boar...
- Patent number 5,695,109
- Issue date Dec 9, 1997
- Industrial Technology Research Institute
- Ping-Huang Chiang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR STRUCTURE WITH FLUSH SHALLOW TRENCH ISOLATION AND GAT...
- Publication number 20240395883
- Publication date Nov 28, 2024
- UNITED MICROELECTRONICS CORP.
- Ta-Wei Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20240355873
- Publication date Oct 24, 2024
- UNITED MICROELECTRONICS CORP.
- Chia-Ling Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PERFORMING AIRTIME FAIRNESS CONTROL OF MESH NETWORK, AND...
- Publication number 20240306193
- Publication date Sep 12, 2024
- MEDIATEK INC.
- Ping-Hsien Chiang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Communication Apparatus and Method for Handling Radio Link Monitoring
- Publication number 20240276255
- Publication date Aug 15, 2024
- MEDIATEK INC.
- Chii-Horng Chen
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20240243004
- Publication date Jul 18, 2024
- UNITED MICROELECTRONICS CORP.
- Chia-Ling Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTER-BUNDLE CHANNEL ESTIMATION AND SYNCHRONIZATION FOR DOWNLINK DA...
- Publication number 20240224254
- Publication date Jul 4, 2024
- MEDIATEK INC.
- Sheng-Hua Yang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
MANUFACTURING METHOD OF HIGH VOLTAGE SEMICONDUCTOR DEVICE
- Publication number 20240154027
- Publication date May 9, 2024
- UNITED MICROELECTRONICS CORP.
- Hsin-Han Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH VOLTAGE SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20230307524
- Publication date Sep 28, 2023
- UNITED MICROELECTRONICS CORP.
- Hsin-Han Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20230231035
- Publication date Jul 20, 2023
- UNITED MICROELECTRONICS CORP.
- Wei-Lun Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Special Dual CTS Mode For Improvement In Collision Avoidance
- Publication number 20230224963
- Publication date Jul 13, 2023
- MEDIATEK INC.
- Tsung-Hsuan Wu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20230223306
- Publication date Jul 13, 2023
- UNITED MICROELECTRONICS CORP.
- Ta-Wei Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20230207620
- Publication date Jun 29, 2023
- UNITED MICROELECTRONICS CORP.
- Chia-Ling Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor structure and forming method thereof
- Publication number 20230080968
- Publication date Mar 16, 2023
- UNITED MICROELECTRONICS CORP.
- Wei-Lun Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH VOLTAGE SEMICONDUCTOR DEVICE
- Publication number 20210119014
- Publication date Apr 22, 2021
- UNITED MICROELECTRONICS CORP.
- Shih-Yin Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH VOLTAGE SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20200212201
- Publication date Jul 2, 2020
- UNITED MICROELECTRONICS CORP.
- Shih-Yin Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSISTOR WITH DUAL SPACER AND FORMING METHOD THEREOF
- Publication number 20190157418
- Publication date May 23, 2019
- UNITED MICROELECTRONICS CORP.
- Chia-Ling Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING TRANSISTOR WITH DUAL SPACER
- Publication number 20190157421
- Publication date May 23, 2019
- UNITED MICROELECTRONICS CORP.
- Chia-Ling Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR TRANSISTOR DEVICE
- Publication number 20190103460
- Publication date Apr 4, 2019
- United Microelectronics Corp.
- Chang-Po Hsiung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20180233556
- Publication date Aug 16, 2018
- United Microelectronics Corp.
- Chang-Po Hsiung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH VOLTAGE SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20180114842
- Publication date Apr 26, 2018
- UNITED MICROELECTRONICS CORP.
- Shih-Yin Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME
- Publication number 20180102408
- Publication date Apr 12, 2018
- United Microelectronics Corp.
- Chang-Po Hsiung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-VOLTAGE METAL-OXIDE-SEMICONDUCTOR TRANSISTOR AND FABRICATION M...
- Publication number 20180097104
- Publication date Apr 5, 2018
- UNITED MICROELECTRONICS CORP.
- Shih-Yin Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-VOLTAGE METAL-OXIDE-SEMICONDUCTOR TRANSISTOR AND FABRICATION M...
- Publication number 20170345926
- Publication date Nov 30, 2017
- UNITED MICROELECTRONICS CORP.
- Shih-Yin Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMMUNICATIONS METHOD AND APPARATUS FOR CARRIER AGGREGATION
- Publication number 20170111100
- Publication date Apr 20, 2017
- MEDIATEK INC.
- Po-Ying CHEN
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
COMMUNICATIONS METHOD AND APPARATUS
- Publication number 20150229383
- Publication date Aug 13, 2015
- MEDIATEK INC.
- Po-Ying CHEN
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Ping-Huang Chiang

Person

Patents Grantslast 30 patents

Semiconductor structure and fabrication method thereof

Manufacturing method of high voltage semiconductor device

Semiconductor structure and fabrication method thereof

Manufacturing method of semiconductor device

Semiconductor device and method of fabricating the same

Semiconductor structure and forming method thereof

High voltage semiconductor device and manufacturing method thereof

High voltage semiconductor device and manufacturing method thereof

High voltage semiconductor device and manufacturing method thereof

Method of forming transistor with dual spacer

Transistor with dual spacer and forming method thereof

Semiconductor device

High-voltage metal-oxide-semiconductor transistor and fabrication m...

Communications method and apparatus for carrier aggregation

Semiconductor device and method of forming the same

High-voltage metal-oxide-semiconductor transistor and fabrication m...

Semiconductor device and method for forming the same

Method of fabricating semiconductor MOS device

Communications method and apparatus for carrier aggregation

Structure for semiconductor package for improving the efficiency of...

Solder paste inter-layer alignment apparatus for area-array on-boar...

Patents Applicationslast 30 patents

SEMICONDUCTOR STRUCTURE WITH FLUSH SHALLOW TRENCH ISOLATION AND GAT...

SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF

METHOD FOR PERFORMING AIRTIME FAIRNESS CONTROL OF MESH NETWORK, AND...

Communication Apparatus and Method for Handling Radio Link Monitoring

SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF

INTER-BUNDLE CHANNEL ESTIMATION AND SYNCHRONIZATION FOR DOWNLINK DA...

MANUFACTURING METHOD OF HIGH VOLTAGE SEMICONDUCTOR DEVICE

HIGH VOLTAGE SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

Special Dual CTS Mode For Improvement In Collision Avoidance

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF

Semiconductor structure and forming method thereof

HIGH VOLTAGE SEMICONDUCTOR DEVICE

HIGH VOLTAGE SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

TRANSISTOR WITH DUAL SPACER AND FORMING METHOD THEREOF

METHOD OF FORMING TRANSISTOR WITH DUAL SPACER

SEMICONDUCTOR TRANSISTOR DEVICE

SEMICONDUCTOR DEVICE

HIGH VOLTAGE SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME

HIGH-VOLTAGE METAL-OXIDE-SEMICONDUCTOR TRANSISTOR AND FABRICATION M...

HIGH-VOLTAGE METAL-OXIDE-SEMICONDUCTOR TRANSISTOR AND FABRICATION M...

COMMUNICATIONS METHOD AND APPARATUS FOR CARRIER AGGREGATION

COMMUNICATIONS METHOD AND APPARATUS