Ping Huang

Person

Beaverton, OR, US

People

Patents Grantslast 30 patents

Information Patent Grant
UV-curable resins used for chemical mechanical polishing pads
- Patent number 11,807,710
- Issue date Nov 7, 2023
- CMC Materials, Inc.
- Chen-Chih Tsai
- B24 - GRINDING POLISHING
Information Patent Grant
Low density polishing pad
- Patent number 10,946,495
- Issue date Mar 16, 2021
- CMC Materials, Inc.
- Ping Huang
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Polishing pad having polishing surface with continuous protrusions
- Patent number 10,293,459
- Issue date May 21, 2019
- Cabot Microelectronics Corporation
- Paul Andre Lefevre
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing pad having polishing surface with continuous protrusions...
- Patent number 10,160,092
- Issue date Dec 25, 2018
- Cabot Microelectronics Corporation
- Paul Andre Lefevre
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing pad having polishing surface with continuous protrusions
- Patent number 9,649,742
- Issue date May 16, 2017
- NexPlanar Corporation
- Paul Andre Lefevre
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing pad with polishing surface layer having an aperture or op...
- Patent number 9,597,769
- Issue date Mar 21, 2017
- NexPlanar Corporation
- Paul Andre Lefevre
- B24 - GRINDING POLISHING
Information Patent Grant
Homogeneous polishing pad for eddy current end-point detection
- Patent number 9,597,777
- Issue date Mar 21, 2017
- NexPlanar Corporation
- William C. Allison
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing pad with multi-modal distribution of pore diameters
- Patent number 9,555,518
- Issue date Jan 31, 2017
- NexPlanar Corporation
- Ping Huang
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing pad with homogeneous body having discrete protrusions the...
- Patent number 9,296,085
- Issue date Mar 29, 2016
- NexPlanar Corporation
- Rajeev Bajaj
- B24 - GRINDING POLISHING
Information Patent Grant
Soft polishing pad for polishing a semiconductor substrate
- Patent number 9,156,124
- Issue date Oct 13, 2015
- NexPlanar Corporation
- William Allison
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing pad for eddy current end-point detection
- Patent number 9,028,302
- Issue date May 12, 2015
- NexPlanar Corporation
- William C. Allison
- B24 - GRINDING POLISHING
Information Patent Grant
CMP pad with local area transparency
- Patent number 9,017,140
- Issue date Apr 28, 2015
- NexPlanar Corporation
- William Allison
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing pad with multi-modal distribution of pore diameters
- Patent number 8,702,479
- Issue date Apr 22, 2014
- NexPlanar Corporation
- Ping Huang
- B24 - GRINDING POLISHING
Information Patent Grant
Homogeneous polishing pad for eddy current end-point detection
- Patent number 8,657,653
- Issue date Feb 25, 2014
- NexPlanar Corporation
- William C. Allison
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing pad for eddy current end-point detection
- Patent number 8,628,384
- Issue date Jan 14, 2014
- NexPlanar Corporation
- William C. Allison
- B24 - GRINDING POLISHING
Information Patent Grant
Method of fabricating a polishing pad with an end-point detection r...
- Patent number 8,439,994
- Issue date May 14, 2013
- NexPlanar Corporation
- William C. Allison
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
UV-CURABLE RESINS FOR CHEMICAL MECHANICAL POLISHING PADS
- Publication number 20230406984
- Publication date Dec 21, 2023
- CMC Materials LLC
- Ping HUANG
- B24 - GRINDING POLISHING
Information Patent Application
UV-CURABLE RESINS USED FOR CHEMICAL MECHANICAL POLISHING PADS
- Publication number 20220119586
- Publication date Apr 21, 2022
- CMC Materials, Inc.
- Chen-Chih TSAI
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
CHEMICAL MECHANICAL PLANARIZATION PADS VIA VAT-BASED PRODUCTION
- Publication number 20200353586
- Publication date Nov 12, 2020
- Cabot Microelectronics Corporation
- Eric S. MOYER
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Application
POLISHING PAD HAVING POLISHING SURFACE WITH CONTINUOUS PROTRUSIONS
- Publication number 20170203409
- Publication date Jul 20, 2017
- NexPlanar Corporation
- Paul Andre Lefevre
- B24 - GRINDING POLISHING
Information Patent Application
LOW DENSITY POLISHING PAD
- Publication number 20160221145
- Publication date Aug 4, 2016
- Ping Huang
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
SOFT POLISHING PAD FOR POLISHING A SEMICONDUCTOR SUBSTRATE
- Publication number 20150343595
- Publication date Dec 3, 2015
- William C. Allison
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
POLISHING PAD WITH HOMOGENEOUS BODY HAVING DISCRETE PROTRUSIONS THE...
- Publication number 20150056900
- Publication date Feb 26, 2015
- Rajeev Bajaj
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
LOW DENSITY POLISHING PAD
- Publication number 20150038066
- Publication date Feb 5, 2015
- NexPlanar Corporation
- Ping Huang
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING PAD HAVING POLISHING SURFACE WITH CONTINUOUS PROTRUSIONS...
- Publication number 20140273777
- Publication date Sep 18, 2014
- NexPlanar Corporation
- Paul Andre Lefevre
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING PAD HAVING POLISHING SURFACE WITH CONTINUOUS PROTRUSIONS
- Publication number 20140206268
- Publication date Jul 24, 2014
- NexPlanar Corporation
- Paul Andre Lefevre
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING PAD WITH MULTI-MODAL DISTRIBUTION OF PORE DIAMETERS
- Publication number 20140167305
- Publication date Jun 19, 2014
- Ping Huang
- B24 - GRINDING POLISHING
Information Patent Application
HOMOGENEOUS POLISHING PAD FOR EDDY CURRENT END-POINT DETECTION
- Publication number 20140123563
- Publication date May 8, 2014
- NexPlanar Corporation
- William C. Allison
- B24 - GRINDING POLISHING
Information Patent Application
Polishing Pad for Eddy Current End-Point Detection
- Publication number 20140102010
- Publication date Apr 17, 2014
- William C. Allison
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING PAD WITH POLISHING SURFACE LAYER HAVING AN APERTURE OR OP...
- Publication number 20130324020
- Publication date Dec 5, 2013
- Paul Andre Lefevre
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING PAD WITH HOMOGENEOUS BODY HAVING DISCRETE PROTRUSIONS THE...
- Publication number 20120302148
- Publication date Nov 29, 2012
- Rajeev Bajaj
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
POLISHING PAD WITH MULTI-MODAL DISTRIBUTION OF PORE DIAMETERS
- Publication number 20120094586
- Publication date Apr 19, 2012
- Ping Huang
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING PAD FOR EDDY CURRENT END-POINT DETECTION
- Publication number 20120083191
- Publication date Apr 5, 2012
- William C. Allison
- B24 - GRINDING POLISHING
Information Patent Application
HOMOGENEOUS POLISHING PAD FOR EDDY CURRENT END-POINT DETECTION
- Publication number 20120083192
- Publication date Apr 5, 2012
- William C. Allison
- B24 - GRINDING POLISHING
Information Patent Application
METHOD OF FABRICATING A POLISHING PAD WITH AN END-POINT DETECTION R...
- Publication number 20120079773
- Publication date Apr 5, 2012
- William C. Allison
- B24 - GRINDING POLISHING
Information Patent Application
SOFT POLISHING PAD FOR POLISHING A SEMICONDUCTOR SUBSTRATE
- Publication number 20120009855
- Publication date Jan 12, 2012
- William Allison
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
CMP pad with local area transparency
- Publication number 20110171883
- Publication date Jul 14, 2011
- NexPlanar Corporation
- William Allison
- B24 - GRINDING POLISHING

Person

Patents Grantslast 30 patents

UV-curable resins used for chemical mechanical polishing pads

Low density polishing pad

Polishing pad having polishing surface with continuous protrusions

Polishing pad having polishing surface with continuous protrusions...

Polishing pad having polishing surface with continuous protrusions

Polishing pad with polishing surface layer having an aperture or op...

Homogeneous polishing pad for eddy current end-point detection

Polishing pad with multi-modal distribution of pore diameters

Polishing pad with homogeneous body having discrete protrusions the...

Soft polishing pad for polishing a semiconductor substrate

Polishing pad for eddy current end-point detection

CMP pad with local area transparency

Polishing pad with multi-modal distribution of pore diameters

Homogeneous polishing pad for eddy current end-point detection

Polishing pad for eddy current end-point detection

Method of fabricating a polishing pad with an end-point detection r...

Patents Applicationslast 30 patents

UV-CURABLE RESINS FOR CHEMICAL MECHANICAL POLISHING PADS

UV-CURABLE RESINS USED FOR CHEMICAL MECHANICAL POLISHING PADS

CHEMICAL MECHANICAL PLANARIZATION PADS VIA VAT-BASED PRODUCTION

POLISHING PAD HAVING POLISHING SURFACE WITH CONTINUOUS PROTRUSIONS

LOW DENSITY POLISHING PAD

SOFT POLISHING PAD FOR POLISHING A SEMICONDUCTOR SUBSTRATE

POLISHING PAD WITH HOMOGENEOUS BODY HAVING DISCRETE PROTRUSIONS THE...

LOW DENSITY POLISHING PAD

POLISHING PAD HAVING POLISHING SURFACE WITH CONTINUOUS PROTRUSIONS...

POLISHING PAD HAVING POLISHING SURFACE WITH CONTINUOUS PROTRUSIONS

POLISHING PAD WITH MULTI-MODAL DISTRIBUTION OF PORE DIAMETERS

HOMOGENEOUS POLISHING PAD FOR EDDY CURRENT END-POINT DETECTION

Polishing Pad for Eddy Current End-Point Detection

POLISHING PAD WITH POLISHING SURFACE LAYER HAVING AN APERTURE OR OP...

POLISHING PAD WITH HOMOGENEOUS BODY HAVING DISCRETE PROTRUSIONS THE...

POLISHING PAD WITH MULTI-MODAL DISTRIBUTION OF PORE DIAMETERS

POLISHING PAD FOR EDDY CURRENT END-POINT DETECTION

HOMOGENEOUS POLISHING PAD FOR EDDY CURRENT END-POINT DETECTION

METHOD OF FABRICATING A POLISHING PAD WITH AN END-POINT DETECTION R...

SOFT POLISHING PAD FOR POLISHING A SEMICONDUCTOR SUBSTRATE

CMP pad with local area transparency