Ping HUANG

Person

Shanghai, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Diabetes detection device and method for forensic identification
- Patent number 12,002,209
- Issue date Jun 4, 2024
- Academy of Forensic Science
- Ji Zhang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Image sensor, signal acquisition method and circuit of image sensor...
- Patent number 11,190,722
- Issue date Nov 30, 2021
- Shanghai Harvest Intelligence Technology Co., Ltd.
- Ya-Hsiang Tai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Downstream node setup
- Patent number 10,880,008
- Issue date Dec 29, 2020
- Cisco Technology, Inc.
- Huang Ping
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Automated intelligent node for hybrid fiber-coaxial (HFC) networks
- Patent number 10,771,269
- Issue date Sep 8, 2020
- Cisco Technology, Inc.
- John Holobinko
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Downstream node setup
- Patent number 10,594,399
- Issue date Mar 17, 2020
- Cisco Technology, Inc.
- Huang Ping
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Method, apparatus and system for exchanging sensor information with...
- Patent number 10,581,971
- Issue date Mar 3, 2020
- Intel Corporation
- Yao Sun
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Vertical gallium nitride Schottky diode
- Patent number 10,573,762
- Issue date Feb 25, 2020
- Alpha and Omega Semiconductor Incorporated
- TingGang Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Termination structure for gallium nitride Schottky diode including...
- Patent number 10,333,006
- Issue date Jun 25, 2019
- Alpha and Omega Semiconductor Incorporated
- TingGang Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Downstream node setup
- Patent number 10,187,149
- Issue date Jan 22, 2019
- Cisco Technology, Inc.
- Huang Ping
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Termination structure for gallium nitride Schottky diode
- Patent number 10,038,106
- Issue date Jul 31, 2018
- Alpha and Omega Semiconductor Incorporated
- TingGang Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Preparation method of a thin power device
- Patent number 9,854,686
- Issue date Dec 26, 2017
- Alpha and Omega Semiconductor (Cayman) LTD
- Yuping Gong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Termination structure for gallium nitride schottky diode
- Patent number 9,728,655
- Issue date Aug 8, 2017
- Alpha and Omega Semiconductor Incorporated
- TingGang Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protection circuit including vertical gallium nitride schottky diod...
- Patent number 9,406,661
- Issue date Aug 2, 2016
- Alpha and Omega Semiconductor Incorporated
- TingGang Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for packaging a power device with bottom source electrode
- Patent number 9,391,005
- Issue date Jul 12, 2016
- Alpha and Omega Semiconductor Incorporated
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging structure of a semiconductor device
- Patent number 9,281,265
- Issue date Mar 8, 2016
- Alpha and Omega Semiconductor Incorporated
- Yueh-Se Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for preparing semiconductor devices applied in flip chip tec...
- Patent number 9,196,534
- Issue date Nov 24, 2015
- Alpha and Omega Semiconductor Incorporated
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bottom source substrateless power MOSFET
- Patent number 9,136,379
- Issue date Sep 15, 2015
- Alpha & Omega Semiconductor, Inc.
- Yueh-Se Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrateless power device packages
- Patent number 9,136,154
- Issue date Sep 15, 2015
- Alpha and Omega Semiconductor Incorporated
- Tao Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin power device and preparation method thereof
- Patent number 9,006,901
- Issue date Apr 14, 2015
- Alpha & Omega Semiconductor, Inc.
- Yuping Gong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical gallium nitride Schottky diode
- Patent number 8,994,140
- Issue date Mar 31, 2015
- Alpha and Omega Semiconductor Incorporated
- TingGang Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrateless power device packages
- Patent number 8,987,878
- Issue date Mar 24, 2015
- Alpha and Omega Semiconductor Incorporated
- Tao Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and fabrication method thereof
- Patent number 8,865,523
- Issue date Oct 21, 2014
- Alpha & Omega Semiconductor, Inc.
- Yueh-Se Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging method with backside wafer dicing
- Patent number 8,785,296
- Issue date Jul 22, 2014
- Alpha & Omega Semiconductor, Inc.
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging method of molded wafer level chip scale package (WLCSP)
- Patent number 8,778,735
- Issue date Jul 15, 2014
- Alpha & Omega Semiconductor, Inc.
- Yan Xun Xue
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Vertical gallium nitride Schottky diode
- Patent number 8,772,144
- Issue date Jul 8, 2014
- Alpha and Omega Semiconductor Incorporated
- TingGang Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level package structure and the fabrication method thereof
- Patent number 8,642,385
- Issue date Feb 4, 2014
- Alpha & Omega Semiconductor, Inc.
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer level package (WLP) and method of manufacture t...
- Patent number 8,642,397
- Issue date Feb 4, 2014
- Alpha & Omega Semiconductor, Inc.
- Yuping Gong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and entities using IPSec ESP to support security functional...
- Patent number 8,639,936
- Issue date Jan 28, 2014
- Alcatel Lucent
- Zhiyuan Hu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Bottom source power MOSFET with substrateless and manufacturing met...
- Patent number 8,569,169
- Issue date Oct 29, 2013
- Alpha & Omega Semiconductor, Inc.
- Yueh-Se Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging method of molded wafer level chip scale package (WLCSP)
- Patent number 8,563,361
- Issue date Oct 22, 2013
- Alpha & Omega Semiconductor, Inc.
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INFORMATION OUTPUT METHODS AND APPARATUSES, COMPUTER EQUIPMENT AND...
- Publication number 20240095654
- Publication date Mar 21, 2024
- ZHEJIANG KOUBEI NETWORK TECHNOLOGY CO., LTD.
- Yun JI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
DIABETES DETECTION DEVICE AND METHOD FOR FORENSIC IDENTIFICATION
- Publication number 20240029255
- Publication date Jan 25, 2024
- ACADEMY OF FORENSIC SCIENCE
- Ji Zhang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Image Sensor, Signal Acquisition Method And Circuit Of Image Sensor...
- Publication number 20200358974
- Publication date Nov 12, 2020
- SHANGHAI HARVEST INTELLIGENCE TECHNOLOGY CO., LTD
- YA-Hsiang TAI
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Downstream Node Setup
- Publication number 20200220622
- Publication date Jul 9, 2020
- Cisco Technology, Inc.
- Huang Ping
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
VERTICAL GALLIUM NITRIDE SCHOTTKY DIODE
- Publication number 20190296157
- Publication date Sep 26, 2019
- ALPHA & OMEGA SEMICONDUCTOR INCORPORATED
- TingGang Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Automated Intelligent Node for Hybrid Fiber-Coaxial (HFC) Networks
- Publication number 20190280886
- Publication date Sep 12, 2019
- Cisco Technology, Inc.
- John Holobinko
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Downstream Node Setup
- Publication number 20190149235
- Publication date May 16, 2019
- Cisco Technology, Inc.
- Huang Ping
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Downstream Node Setup
- Publication number 20180323876
- Publication date Nov 8, 2018
- Cisco Technology, Inc.
- Huang Ping
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
TERMINATION STRUCTURE FOR GALLIUM NITRIDE SCHOTTKY DIODE INCLUDING...
- Publication number 20180323315
- Publication date Nov 8, 2018
- ALPHA & OMEGA SEMICONDUCTOR, INC
- TingGang Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TERMINATION STRUCTURE FOR GALLIUM NITRIDE SCHOTTKY DIODE
- Publication number 20170301800
- Publication date Oct 19, 2017
- ALPHA & OMEGA SEMICONDUCTOR INCORPORATED
- TingGang Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD, APPARATUS AND SYSTEM FOR EXCHANGING SENSOR INFORMATION WITH...
- Publication number 20170163735
- Publication date Jun 8, 2017
- Intel Corporation
- Yao SUN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Termination structure for gallium nitride schottky diode
- Publication number 20160372610
- Publication date Dec 22, 2016
- ALPHA & OMEGA SEMICONDUCTOR INCORPORATED
- TingGang Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PACKAGING A POWER DEVICE WITH BOTTOM SOURCE ELECTRODE
- Publication number 20160155688
- Publication date Jun 2, 2016
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATELESS POWER DEVICE PACKAGES
- Publication number 20150340301
- Publication date Nov 26, 2015
- ALPHA & OMEGA SEMICONDUCTOR INCORPORATED
- Tao Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROTECTION CIRCUIT INCLUDING VERTICAL GALLIUM NITRIDE SCHOTTKY DIO...
- Publication number 20150228729
- Publication date Aug 13, 2015
- ALPHA & OMEGA SEMICONDUCTOR INCORPORATED
- TingGang Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PREPARATION METHOD OF A THIN POWER DEVICE
- Publication number 20150189764
- Publication date Jul 2, 2015
- Alpha and Omega Semiconductor (Cayman), Ltd
- Yuping Gong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PACKAGING A POWER DEVICE WITH BOTTOM SOURCE ELECTRODE
- Publication number 20150087114
- Publication date Mar 26, 2015
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATELESS POWER DEVICE PACKAGES
- Publication number 20150056752
- Publication date Feb 26, 2015
- ALPHA & OMEGA SEMICONDUCTOR INCORPORATED
- Tao Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN POWER DEVICE AND PREPARATION METHOD THEREOF
- Publication number 20150021780
- Publication date Jan 22, 2015
- Yuping Gong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING STRUCTURE OF A SEMICONDUCTOR DEVICE
- Publication number 20150021753
- Publication date Jan 22, 2015
- Alpha and Omega Semiconductor Incorporated
- Yueh-Se Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOTTOM SOURCE SUBSTRATELESS POWER MOSFET
- Publication number 20140319601
- Publication date Oct 30, 2014
- Yueh-Se Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package And Fabrication Method Thereof
- Publication number 20140264805
- Publication date Sep 18, 2014
- Yueh-Se Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL GALLIUM NITRIDE SCHOTTKY DIODE
- Publication number 20140252372
- Publication date Sep 11, 2014
- ALPHA & OMEGA SEMICONDUCTOR INCORPORATED
- TingGang Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PREPARING SEMICONDUCTOR DEVICES APPLIED IN FLIP CHIP TEC...
- Publication number 20140242756
- Publication date Aug 28, 2014
- ALPHA & OMEGA SEMICONDUCTOR INCORPORATED
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING METHOD OF MOLDED WAFER LEVEL CHIP SCALE PACKAGE (WLCSP)
- Publication number 20130210195
- Publication date Aug 15, 2013
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING METHOD WITH BACKSIDE WAFER DICING
- Publication number 20130210215
- Publication date Aug 15, 2013
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PACKAGING ULTRA-THIN CHIP WITH SOLDER BALL THERMO-COMPRE...
- Publication number 20130130443
- Publication date May 23, 2013
- Jun Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Vertical Gallium Nitride Schottky Diode
- Publication number 20130119393
- Publication date May 16, 2013
- Alpha and Omega Semiconductor Inc.
- TingGang Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL PACKAGING METHOD OF ENCAPSULATING THE BOTTOM AND SIDE O...
- Publication number 20130095612
- Publication date Apr 18, 2013
- Ping Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL PACKAGE STRUCTURE AND THE FABRICATION METHOD THEREOF
- Publication number 20130037935
- Publication date Feb 14, 2013
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Diabetes detection device and method for forensic identification

Image sensor, signal acquisition method and circuit of image sensor...

Downstream node setup

Automated intelligent node for hybrid fiber-coaxial (HFC) networks

Downstream node setup

Method, apparatus and system for exchanging sensor information with...

Vertical gallium nitride Schottky diode

Termination structure for gallium nitride Schottky diode including...

Downstream node setup

Termination structure for gallium nitride Schottky diode

Preparation method of a thin power device

Termination structure for gallium nitride schottky diode

Protection circuit including vertical gallium nitride schottky diod...

Method for packaging a power device with bottom source electrode

Packaging structure of a semiconductor device

Method for preparing semiconductor devices applied in flip chip tec...

Bottom source substrateless power MOSFET

Substrateless power device packages

Thin power device and preparation method thereof

Vertical gallium nitride Schottky diode

Substrateless power device packages

Semiconductor package and fabrication method thereof

Packaging method with backside wafer dicing

Packaging method of molded wafer level chip scale package (WLCSP)

Vertical gallium nitride Schottky diode

Wafer level package structure and the fabrication method thereof

Semiconductor wafer level package (WLP) and method of manufacture t...

Methods and entities using IPSec ESP to support security functional...

Bottom source power MOSFET with substrateless and manufacturing met...

Packaging method of molded wafer level chip scale package (WLCSP)

Patents Applicationslast 30 patents

INFORMATION OUTPUT METHODS AND APPARATUSES, COMPUTER EQUIPMENT AND...

DIABETES DETECTION DEVICE AND METHOD FOR FORENSIC IDENTIFICATION

Image Sensor, Signal Acquisition Method And Circuit Of Image Sensor...

Downstream Node Setup

VERTICAL GALLIUM NITRIDE SCHOTTKY DIODE

Automated Intelligent Node for Hybrid Fiber-Coaxial (HFC) Networks

Downstream Node Setup

Downstream Node Setup

TERMINATION STRUCTURE FOR GALLIUM NITRIDE SCHOTTKY DIODE INCLUDING...

TERMINATION STRUCTURE FOR GALLIUM NITRIDE SCHOTTKY DIODE

METHOD, APPARATUS AND SYSTEM FOR EXCHANGING SENSOR INFORMATION WITH...

Termination structure for gallium nitride schottky diode

METHOD FOR PACKAGING A POWER DEVICE WITH BOTTOM SOURCE ELECTRODE

SUBSTRATELESS POWER DEVICE PACKAGES

PROTECTION CIRCUIT INCLUDING VERTICAL GALLIUM NITRIDE SCHOTTKY DIO...

PREPARATION METHOD OF A THIN POWER DEVICE

METHOD FOR PACKAGING A POWER DEVICE WITH BOTTOM SOURCE ELECTRODE

SUBSTRATELESS POWER DEVICE PACKAGES

THIN POWER DEVICE AND PREPARATION METHOD THEREOF

PACKAGING STRUCTURE OF A SEMICONDUCTOR DEVICE

BOTTOM SOURCE SUBSTRATELESS POWER MOSFET

Semiconductor Package And Fabrication Method Thereof

VERTICAL GALLIUM NITRIDE SCHOTTKY DIODE

METHOD FOR PREPARING SEMICONDUCTOR DEVICES APPLIED IN FLIP CHIP TEC...

PACKAGING METHOD OF MOLDED WAFER LEVEL CHIP SCALE PACKAGE (WLCSP)

PACKAGING METHOD WITH BACKSIDE WAFER DICING

METHOD FOR PACKAGING ULTRA-THIN CHIP WITH SOLDER BALL THERMO-COMPRE...

Vertical Gallium Nitride Schottky Diode

WAFER LEVEL PACKAGING METHOD OF ENCAPSULATING THE BOTTOM AND SIDE O...

WAFER LEVEL PACKAGE STRUCTURE AND THE FABRICATION METHOD THEREOF