Ping-Jung Yang

Person

Hsinchu, TW

People

Patents Grantslast 30 patents

Information Patent Grant
3D chip package based on vertical-through-via connector
- Patent number 12,176,278
- Issue date Dec 24, 2024
- iCometrue Company Ltd.
- Ping-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package
- Patent number 12,062,618
- Issue date Aug 13, 2024
- Ping-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package
- Patent number 11,894,306
- Issue date Feb 6, 2024
- Ping-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package
- Patent number 11,538,763
- Issue date Dec 27, 2022
- Ping-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package
- Patent number 11,107,768
- Issue date Aug 31, 2021
- Ping-Jung Yang
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method for fabricating glass substrate package
- Patent number 10,622,310
- Issue date Apr 14, 2020
- Ping-Jung Yang
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Method for fabricating glass substrate package
- Patent number 10,453,819
- Issue date Oct 22, 2019
- Ping-Jung Yang
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Method for fabricating glass substrate package
- Patent number 10,096,565
- Issue date Oct 9, 2018
- Ping-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display and bracket for backlight module
- Patent number 9,715,061
- Issue date Jul 25, 2017
- AU Optronics Corp.
- Chun-Chi Huang
- G02 - OPTICS
Information Patent Grant
Method for fabricating glass substrate package
- Patent number 9,615,453
- Issue date Apr 4, 2017
- Ping-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit chip using top post-passivation technology and b...
- Patent number 9,612,615
- Issue date Apr 4, 2017
- QUALCOMM Incorporated
- Mou-Shiung Lin
- G11 - INFORMATION STORAGE
Information Patent Grant
Data capture device and method thereof
- Patent number 8,913,472
- Issue date Dec 16, 2014
- Sunplus Technology Co., Ltd.
- Chang-Jin Song
- G11 - INFORMATION STORAGE
Information Patent Grant
Defect monitoring for resist layer
- Patent number 8,852,673
- Issue date Oct 7, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Che-Rong Laing
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Waveguide structures for signal and/or power transmission in a semi...
- Patent number 8,837,872
- Issue date Sep 16, 2014
- QUALCOMM Incorporated
- Ping-Jung Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Iterative rinse for semiconductor fabrication
- Patent number 8,476,003
- Issue date Jul 2, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Yao Lee
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Integrated circuit chip using top post-passivation technology and b...
- Patent number 8,456,856
- Issue date Jun 4, 2013
- Megica Corporation
- Mou-Shiung Lin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Wafer level processing method and structure to manufacture semicond...
- Patent number 8,431,977
- Issue date Apr 30, 2013
- Megica Corporation
- Ping-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for detecting burst cutting area on optical disc
- Patent number 8,130,607
- Issue date Mar 6, 2012
- Sunplus Technology Co., Ltd.
- Chia-Ming Chang
- G11 - INFORMATION STORAGE

Patents Applicationslast 30 patents

Information Patent Application
CHIP PACKAGE
- Publication number 20240379566
- Publication date Nov 14, 2024
- Ping-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE
- Publication number 20240120281
- Publication date Apr 11, 2024
- Ping-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE
- Publication number 20230073104
- Publication date Mar 9, 2023
- Ping-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D CHIP PACKAGE BASED ON VERTICAL-THROUGH-VIA CONNECTOR
- Publication number 20220384326
- Publication date Dec 1, 2022
- iCometrue Company Ltd.
- Ping-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO HEAT PIPE FOR USE IN SEMICONDUCTOR IC CHIP PACKAGE
- Publication number 20220223494
- Publication date Jul 14, 2022
- iCometrue Company Ltd.
- Jin-Yuan Lee
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
CHIP PACKAGE
- Publication number 20210335714
- Publication date Oct 28, 2021
- Ping-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING GLASS SUBSTRATE PACKAGE
- Publication number 20200161245
- Publication date May 21, 2020
- Ping-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING GLASS SUBSTRATE PACKAGE
- Publication number 20190027459
- Publication date Jan 24, 2019
- Ping-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING GLASS SUBSTRATE PACKAGE
- Publication number 20170207188
- Publication date Jul 20, 2017
- Ping-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING GLASS SUBSTRATE PACKAGE
- Publication number 20170047313
- Publication date Feb 16, 2017
- Ping-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY
- Publication number 20150301273
- Publication date Oct 22, 2015
- AU OPTRONICS CORP.
- Chun-Chi Huang
- G02 - OPTICS
Information Patent Application
METHOD FOR FABRICATING GLASS SUBSTRATE PACKAGE
- Publication number 20140085842
- Publication date Mar 27, 2014
- Ping-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT CHIP USING TOP POST-PASSIVATION TECHNOLOGY AND B...
- Publication number 20130242500
- Publication date Sep 19, 2013
- MEGICA Corporation
- Mou-Shiung Lin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
DATA CAPTURE DEVICE AND METHOD THEREOF
- Publication number 20130235712
- Publication date Sep 12, 2013
- Sunplus Technology Co., Ltd.
- Chang-Jin Song
- G11 - INFORMATION STORAGE
Information Patent Application
DEFECT MONITORING FOR RESIST LAYER
- Publication number 20130108775
- Publication date May 2, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Che-Rong Laing
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
ITERATIVE RINSE FOR SEMICONDUCTOR FABRICATION
- Publication number 20120231395
- Publication date Sep 13, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd., ("TSMC")
- Yung-Yao Lee
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
Multichip Packages
- Publication number 20120193785
- Publication date Aug 2, 2012
- MEGICA CORPORATION
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAVEGUIDE STRUCTURES FOR SIGNAL AND/OR POWER TRANSMISSION IN A SEMI...
- Publication number 20120170887
- Publication date Jul 5, 2012
- MEGICA CORPORATION
- Ping-Jung Yang
- G02 - OPTICS
Information Patent Application
WAFER LEVEL PROCESSING METHOD AND STRUCTURE TO MANUFACTURE SEMICOND...
- Publication number 20110304008
- Publication date Dec 15, 2011
- Magica Corporation
- Ping-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ERASURE INFORMATION MARKING METHOD FOR BURST CUTTING AREA OF BLU-RA...
- Publication number 20110044146
- Publication date Feb 24, 2011
- Sunplus Technology Co., Ltd.
- Chia-Ming Chang
- G11 - INFORMATION STORAGE
Information Patent Application
INTEGRATED CIRCUIT CHIP USING TOP POST-PASSIVATION TECHNOLOGY AND B...
- Publication number 20100246152
- Publication date Sep 30, 2010
- MEGICA Corporation
- Mou-Shiung Lin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD AND APPARATUS FOR DETECTING BURST CUTTING AREA ON OPTICAL DISC
- Publication number 20100135137
- Publication date Jun 3, 2010
- Sunplus Technology Co., Ltd.
- Chia-Ming Chang
- G11 - INFORMATION STORAGE

Ping-Jung Yang

Person

Patents Grantslast 30 patents

3D chip package based on vertical-through-via connector

Chip package

Chip package

Chip package

Chip package

Method for fabricating glass substrate package

Method for fabricating glass substrate package

Method for fabricating glass substrate package

Display and bracket for backlight module

Method for fabricating glass substrate package

Integrated circuit chip using top post-passivation technology and b...

Data capture device and method thereof

Defect monitoring for resist layer

Waveguide structures for signal and/or power transmission in a semi...

Iterative rinse for semiconductor fabrication

Integrated circuit chip using top post-passivation technology and b...

Wafer level processing method and structure to manufacture semicond...

Method and apparatus for detecting burst cutting area on optical disc

Patents Applicationslast 30 patents

CHIP PACKAGE

CHIP PACKAGE

CHIP PACKAGE

3D CHIP PACKAGE BASED ON VERTICAL-THROUGH-VIA CONNECTOR

MICRO HEAT PIPE FOR USE IN SEMICONDUCTOR IC CHIP PACKAGE

CHIP PACKAGE

METHOD FOR FABRICATING GLASS SUBSTRATE PACKAGE

METHOD FOR FABRICATING GLASS SUBSTRATE PACKAGE

METHOD FOR FABRICATING GLASS SUBSTRATE PACKAGE

METHOD FOR FABRICATING GLASS SUBSTRATE PACKAGE

DISPLAY

METHOD FOR FABRICATING GLASS SUBSTRATE PACKAGE

INTEGRATED CIRCUIT CHIP USING TOP POST-PASSIVATION TECHNOLOGY AND B...

DATA CAPTURE DEVICE AND METHOD THEREOF

DEFECT MONITORING FOR RESIST LAYER

ITERATIVE RINSE FOR SEMICONDUCTOR FABRICATION

Multichip Packages

WAVEGUIDE STRUCTURES FOR SIGNAL AND/OR POWER TRANSMISSION IN A SEMI...

WAFER LEVEL PROCESSING METHOD AND STRUCTURE TO MANUFACTURE SEMICOND...

ERASURE INFORMATION MARKING METHOD FOR BURST CUTTING AREA OF BLU-RA...

INTEGRATED CIRCUIT CHIP USING TOP POST-PASSIVATION TECHNOLOGY AND B...

METHOD AND APPARATUS FOR DETECTING BURST CUTTING AREA ON OPTICAL DISC