Ping-Kang Huang

Person

Chiayi City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Method for etching etch layer
- Patent number 12,362,203
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Manish Kumar Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor package
- Patent number 12,283,541
- Issue date Apr 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chi-Ming Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 12,170,237
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer cleaning apparatus and method
- Patent number 12,165,887
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jieh-Chau Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual-polarized antenna and related antenna module and electronic de...
- Patent number 12,126,088
- Issue date Oct 22, 2024
- Cyntec Co., Ltd.
- Sheng-Ju Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional integrated circuit structures and methods of form...
- Patent number 12,113,027
- Issue date Oct 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Yu Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assembled light emitting diode display device
- Patent number 12,039,924
- Issue date Jul 16, 2024
- Macroblock, Inc.
- Ping-Kai Huang
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Giga interposer integration through Chip-On-Wafer-On-Substrate
- Patent number 11,967,546
- Issue date Apr 23, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shang-Yun Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 11,916,009
- Issue date Feb 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chi-Ming Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of forming same
- Patent number 11,810,793
- Issue date Nov 7, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chung-Yu Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for etching etch layer
- Patent number 11,784,065
- Issue date Oct 10, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Manish Kumar Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer cleaning apparatus and method
- Patent number 11,764,081
- Issue date Sep 19, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jieh-Chau Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Giga interposer integration through chip-on-wafer-on-substrate
- Patent number 11,728,254
- Issue date Aug 15, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shang-Yun Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Board substrates, three-dimensional integrated circuit structures a...
- Patent number 11,728,278
- Issue date Aug 15, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Yu Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,715,675
- Issue date Aug 1, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of manufacturing the same
- Patent number 11,552,054
- Issue date Jan 10, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Ting Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of forming the same
- Patent number 11,545,438
- Issue date Jan 3, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Yen Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of removing an etch mask
- Patent number 11,495,684
- Issue date Nov 8, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Han Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semicondutor packages and methods of forming same
- Patent number 11,495,472
- Issue date Nov 8, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chung-Yu Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 11,373,946
- Issue date Jun 28, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chi-Ming Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,302,600
- Issue date Apr 12, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna structure
- Patent number 11,217,894
- Issue date Jan 4, 2022
- Cyntec Co., Ltd.
- Sheng-Ju Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packages with interposers and methods for forming the same
- Patent number 11,152,312
- Issue date Oct 19, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sao-Ling Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer cleaning apparatus and method
- Patent number 11,056,358
- Issue date Jul 6, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jieh-Chau Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D packages and methods for forming the same
- Patent number 10,854,567
- Issue date Dec 1, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shang-Yun Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of removing an etch mask
- Patent number 10,636,908
- Issue date Apr 28, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Han Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of removing an etch mask
- Patent number 10,553,720
- Issue date Feb 4, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Han Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D packages and methods for forming the same
- Patent number 10,529,679
- Issue date Jan 7, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shang-Yun Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for etching etch layer and wafer etching apparatus
- Patent number 10,283,384
- Issue date May 7, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Manish Kumar Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LED failure detecting device
- Patent number 10,117,304
- Issue date Oct 30, 2018
- Macroblock, Inc.
- Ping-Kai Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250218922
- Publication date Jul 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Ming Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGES WITH DOUBLE-SIDE METAL PILLARS AND THE METHODS FORMING THE...
- Publication number 20250210461
- Publication date Jun 26, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yao-Jen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME
- Publication number 20250149486
- Publication date May 8, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yao-Jen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250069980
- Publication date Feb 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL INTEGRATED CIRCUIT STRUCTURES AND METHODS OF FORM...
- Publication number 20240371782
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Yu Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GIGA INTERPOSER INTEGRATION THROUGH CHIP-ON-WAFER-ON-SUBSTRATE
- Publication number 20240222242
- Publication date Jul 4, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shang-Yun Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER CONVERTER HAVING HIGH-SIDE DRIVING MECHANISM CONSUMING LOW POWER
- Publication number 20240162807
- Publication date May 16, 2024
- ANPEC ELECTRONICS CORPORATION
- PING-YU HUANG
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE
- Publication number 20240153861
- Publication date May 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Ming Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Assembled Light Emitting Diode Display Device
- Publication number 20240071298
- Publication date Feb 29, 2024
- Macroblock, Inc.
- Ping-Kai Huang
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
WAFER CLEANING APPARATUS AND METHOD
- Publication number 20240021446
- Publication date Jan 18, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jieh-Chau HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR ETCHING ETCH LAYER
- Publication number 20230377912
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Manish Kumar SINGH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL INTEGRATED CIRCUIT STRUCTURES AND METHODS OF FORM...
- Publication number 20230335502
- Publication date Oct 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Yu Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230326826
- Publication date Oct 12, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dual-polarized antenna and related antenna module and electronic de...
- Publication number 20230117822
- Publication date Apr 20, 2023
- CYNTEC CO., LTD.
- Sheng-Ju Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20230062572
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Wei CHANG
- B08 - CLEANING
Information Patent Application
Semiconductor Packages and Methods of Forming Same
- Publication number 20220367208
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Yu Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GIGA INTERPOSER INTEGRATION THROUGH CHIP-ON-WAFER-ON-SUBSTRATE
- Publication number 20220359355
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shang-Yun Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF FORMING THE SAME
- Publication number 20220336362
- Publication date Oct 20, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Yen Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20220293508
- Publication date Sep 15, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Ming Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20220189844
- Publication date Jun 16, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210407963
- Publication date Dec 30, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Ting Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Giga Interposer Integration through Chip-On-Wafer-On-Substrate
- Publication number 20210366814
- Publication date Nov 25, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shang-Yun Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUTOR PACKAGES AND METHODS OF FORMING SAME
- Publication number 20210327723
- Publication date Oct 21, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Yu Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20210305145
- Publication date Sep 30, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chi-Ming Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF FORMING THE SAME
- Publication number 20210202389
- Publication date Jul 1, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Yen Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20210193550
- Publication date Jun 24, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTENNA STRUCTURE
- Publication number 20200381835
- Publication date Dec 3, 2020
- CYNTEC CO., LTD.
- Sheng-Ju Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOARD SUBSTRATES, THREE-DIMENSIONAL INTEGRATED CIRCUIT STRUCTURES A...
- Publication number 20200312770
- Publication date Oct 1, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Yu Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Removing an Etch Mask
- Publication number 20200259017
- Publication date Aug 13, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Han Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D Packages and Methods for Forming the Same
- Publication number 20200126938
- Publication date Apr 23, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shang-Yun Hou
- H01 - BASIC ELECTRIC ELEMENTS

Ping-Kang Huang

Person

Patents Grantslast 30 patents

Method for etching etch layer

Manufacturing method of semiconductor package

Semiconductor structure and manufacturing method thereof

Wafer cleaning apparatus and method

Dual-polarized antenna and related antenna module and electronic de...

Three-dimensional integrated circuit structures and methods of form...

Assembled light emitting diode display device

Giga interposer integration through Chip-On-Wafer-On-Substrate

Semiconductor package and manufacturing method thereof

Semiconductor packages and methods of forming same

Method for etching etch layer

Wafer cleaning apparatus and method

Giga interposer integration through chip-on-wafer-on-substrate

Board substrates, three-dimensional integrated circuit structures a...

Semiconductor device and manufacturing method thereof

Package structure and method of manufacturing the same

Semiconductor packages and methods of forming the same

Method of removing an etch mask

Semicondutor packages and methods of forming same

Semiconductor package and manufacturing method thereof

Semiconductor device and manufacturing method thereof

Antenna structure

Packages with interposers and methods for forming the same

Wafer cleaning apparatus and method

3D packages and methods for forming the same

Method of removing an etch mask

Method of removing an etch mask

3D packages and methods for forming the same

Method for etching etch layer and wafer etching apparatus

LED failure detecting device

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE

PACKAGES WITH DOUBLE-SIDE METAL PILLARS AND THE METHODS FORMING THE...

SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

THREE-DIMENSIONAL INTEGRATED CIRCUIT STRUCTURES AND METHODS OF FORM...

GIGA INTERPOSER INTEGRATION THROUGH CHIP-ON-WAFER-ON-SUBSTRATE

POWER CONVERTER HAVING HIGH-SIDE DRIVING MECHANISM CONSUMING LOW POWER

MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE

Assembled Light Emitting Diode Display Device

WAFER CLEANING APPARATUS AND METHOD

METHOD FOR ETCHING ETCH LAYER

THREE-DIMENSIONAL INTEGRATED CIRCUIT STRUCTURES AND METHODS OF FORM...

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

Dual-polarized antenna and related antenna module and electronic de...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

Semiconductor Packages and Methods of Forming Same

GIGA INTERPOSER INTEGRATION THROUGH CHIP-ON-WAFER-ON-SUBSTRATE

SEMICONDUCTOR PACKAGES AND METHODS OF FORMING THE SAME

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME

Giga Interposer Integration through Chip-On-Wafer-On-Substrate

SEMICONDUTOR PACKAGES AND METHODS OF FORMING SAME

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGES AND METHODS OF FORMING THE SAME

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

ANTENNA STRUCTURE

BOARD SUBSTRATES, THREE-DIMENSIONAL INTEGRATED CIRCUIT STRUCTURES A...

Method of Removing an Etch Mask

3D Packages and Methods for Forming the Same