Ping Kwong Seto

Person

Madison, AL, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method for producing circuit board assemblies using surface mount c...
- Patent number 6,545,229
- Issue date Apr 8, 2003
- International Business Machines Corporation
- Bao-Tong Ma
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing circuit board assemblies using surface mount c...
- Patent number 6,167,615
- Issue date Jan 2, 2001
- International Business Machines Corporation
- Bao-Tong Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for attaching heat sinks directly to chip carrier modules...
- Patent number 5,785,799
- Issue date Jul 28, 1998
- International Business Machines Corporation
- Thomas Moran Culnane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip carrier modules with heat sinks attached by flexible-epoxy
- Patent number 5,744,863
- Issue date Apr 28, 1998
- International Business Machines Corporation
- Thomas Moran Culnane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing circuit board assemblies using surface mount c...
- Patent number 5,742,483
- Issue date Apr 21, 1998
- International Business Machines Corporation
- Bao-Tong Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for attaching heat sinks directly to chip carrier modules us...
- Patent number 5,672,548
- Issue date Sep 30, 1997
- International Business Machines Corporation
- Thomas Moran Culnane
- H01 - BASIC ELECTRIC ELEMENTS

Ping Kwong Seto

Person

Patents Grantslast 30 patents

Method for producing circuit board assemblies using surface mount c...

Method for producing circuit board assemblies using surface mount c...

Apparatus for attaching heat sinks directly to chip carrier modules...

Chip carrier modules with heat sinks attached by flexible-epoxy

Method for producing circuit board assemblies using surface mount c...

Method for attaching heat sinks directly to chip carrier modules us...