Ping Liang TU

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Hong Kong, CN

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Patents Grantslast 30 patents

Information Patent Grant
Method of bonding semiconductor devices utilizing solder balls
- Patent number 8,012,866
- Issue date Sep 6, 2011
- ASM Assembly Automation LTD
- Ping Liang Tu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing process and apparatus therefor utilizing reducing gas
- Patent number 7,648,901
- Issue date Jan 19, 2010
- ASM Assembly Automation LTD
- Ping Liang Tu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF BONDING SEMICONDUCTOR DEVICES UTILIZING SOLDER BALLS
- Publication number 20090298278
- Publication date Dec 3, 2009
- Ping Liang TU
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING PROCESS AND APPARATUS THEREFOR UTILIZING REDUCING GAS
- Publication number 20080078145
- Publication date Apr 3, 2008
- Ping Liang TU
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR