PING XU

Person

CUPERTINO, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Bi-layer capping of low-K dielectric films
- Patent number 7,598,183
- Issue date Oct 6, 2009
- Applied Materials, Inc.
- Ping Xu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of depositing low k barrier layers
- Patent number 7,319,068
- Issue date Jan 15, 2008
- Applied Materials, Inc.
- Li-Qun Xia
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of depositing dielectric materials including oxygen-doped si...
- Patent number 7,151,053
- Issue date Dec 19, 2006
- Applied Materials, Inc.
- Ju-Hyung Lee
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of depositing low K barrier layers
- Patent number 7,125,813
- Issue date Oct 24, 2006
- Applied Materials, Inc.
- Li-Qun Xia
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of depositing dielectric films
- Patent number 7,117,064
- Issue date Oct 3, 2006
- Applied Materials, Inc.
- Srinivas D Nemani
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of eliminating photoresist poisoning in damascene applications
- Patent number 7,034,409
- Issue date Apr 25, 2006
- Applied Materials Inc.
- Ping Xu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of depositing dielectric films
- Patent number 7,001,850
- Issue date Feb 21, 2006
- Applied Materials Inc.
- Srinivas D Nemani
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of depositing dielectric materials in damascene applications
- Patent number 6,890,850
- Issue date May 10, 2005
- Applied Materials, Inc.
- Ju-Hyung Lee
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Enhanced remote plasma cleaning
- Patent number 6,868,856
- Issue date Mar 22, 2005
- Applied Materials, Inc.
- Thomas Nowak
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of depositing a low k dielectric barrier film for copper dam...
- Patent number 6,849,562
- Issue date Feb 1, 2005
- Applied Materials, Inc.
- Chi-I Lang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method and apparatus for treating low k dielectric layers to reduce...
- Patent number 6,794,311
- Issue date Sep 21, 2004
- Applied Materials Inc.
- Kegang Huang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Fluorine-containing layers for damascene structures
- Patent number 6,777,171
- Issue date Aug 17, 2004
- Applied Materials, Inc.
- Ping Xu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of depositing dielectric films
- Patent number 6,764,958
- Issue date Jul 20, 2004
- Applied Materials Inc.
- Srinivas D Nemani
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of depositing low k barrier layers
- Patent number 6,759,327
- Issue date Jul 6, 2004
- Applied Materials Inc.
- Li-Qun Xia
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plasma treatment for copper oxide reduction
- Patent number 6,734,102
- Issue date May 11, 2004
- Applied Materials Inc.
- Sudha Rathi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for depositing a low k dielectric film (K>3.5) for h...
- Patent number 6,699,784
- Issue date Mar 2, 2004
- Applied Materials Inc.
- Li-Qun Xia
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of eliminating photoresist poisoning in damascene applications
- Patent number 6,656,837
- Issue date Dec 2, 2003
- Applied Materials, Inc.
- Ping Xu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Reduction of plasma edge effect on plasma enhanced CVD processes
- Patent number 6,553,932
- Issue date Apr 29, 2003
- Applied Materials, Inc.
- Kuo-Shih Liu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method and apparatus for controlling the deposition of a fluorinate...
- Patent number 6,035,803
- Issue date Mar 14, 2000
- Applied Materials, Inc.
- Stuardo Robles
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
BI-LAYER CAPPING OF LOW-K DIELECTRIC FILMS
- Publication number 20100022100
- Publication date Jan 28, 2010
- Applied Materials, Inc.
- Ping Xu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
BI-LAYER CAPPING OF LOW-K DIELECTRIC FILMS
- Publication number 20080070421
- Publication date Mar 20, 2008
- Ping Xu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF DEPOSITING LOW K BARRIER LAYERS
- Publication number 20070042610
- Publication date Feb 22, 2007
- Li-Qun Xia
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method of eliminating photoresist poisoning in damascene applications
- Publication number 20060205206
- Publication date Sep 14, 2006
- APPLIED MATERIALS, INC.
- Ping Xu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method of depositing dielectric films
- Publication number 20060141805
- Publication date Jun 29, 2006
- APPLIED MATERIALS, INC.
- Srinivas D. Nemani
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method of depositing dielectric materials in damascene applications
- Publication number 20050233576
- Publication date Oct 20, 2005
- Ju-Hyung Lee
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method of depositing dielectric films
- Publication number 20050020048
- Publication date Jan 27, 2005
- Srinivas D. Nemani
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method of depositing low K barrier layers
- Publication number 20040198070
- Publication date Oct 7, 2004
- Li-Qun Xia
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method of eliminating photoresist poisoning in damascene applications
- Publication number 20040106278
- Publication date Jun 3, 2004
- APPLIED MATERIALS, INC.
- Ping Xu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Methods for depositing dielectric material
- Publication number 20030194496
- Publication date Oct 16, 2003
- APPLIED MATERIALS, INC.
- Ping Xu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method of depositing a low k dielectric barrier film for copper dam...
- Publication number 20030165618
- Publication date Sep 4, 2003
- APPLIED MATERIALS, INC.
- Chi-I Lang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method of depositing dielectric materials in damascene applications
- Publication number 20030129827
- Publication date Jul 10, 2003
- APPLIED MATERIALS, INC.
- Ju-Hyung Lee
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method for depositing a low k dielectric film (k<3.5) for hard mask...
- Publication number 20030113995
- Publication date Jun 19, 2003
- APPLIED MATERIALS, INC.
- Li-Qun Xia
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SILICON CARBIDE DEPOSITION FOR USE AS A BARRIER LAYER AND AN ETCH STOP
- Publication number 20030089992
- Publication date May 15, 2003
- SUDHA RATHI
- C30 - CRYSTAL GROWTH
Information Patent Application
Method of eliminating photoresist poisoning in damascene applications
- Publication number 20030077916
- Publication date Apr 24, 2003
- APPLIED MATERIALS, INC.
- Ping Xu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method of depositing low k barrier layers
- Publication number 20030068881
- Publication date Apr 10, 2003
- APPLIED MATERIALS, INC.
- Li-Qun Xia
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Plasma treatment for copper oxide reduction
- Publication number 20030022509
- Publication date Jan 30, 2003
- APPLIED MATERIALS, INC.
- Sudha Rathi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Enhanced remote plasma cleaning
- Publication number 20030010355
- Publication date Jan 16, 2003
- APPLIED MATERIALS, INC.
- Thomas Nowak
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Fluorine-containing layers for damascene structures
- Publication number 20020155386
- Publication date Oct 24, 2002
- APPLIED MATERIALS, INC.
- Ping Xu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method and apparatus for treating low k dielectric layers to reduce...
- Publication number 20020016085
- Publication date Feb 7, 2002
- Kegang Huang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PLASMA TREATMENT FOR COOPER OXIDE REDUCTION
- Publication number 20010049181
- Publication date Dec 6, 2001
- SUDHA RATHI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Reduction of plasma edge effect on plasma enhanced CVD processes
- Publication number 20010042511
- Publication date Nov 22, 2001
- APPLIED MATERIALS, INC.
- Kuo-Shih Liu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Person

Patents Grantslast 30 patents

Bi-layer capping of low-K dielectric films

Method of depositing low k barrier layers

Method of depositing dielectric materials including oxygen-doped si...

Method of depositing low K barrier layers

Method of depositing dielectric films

Method of eliminating photoresist poisoning in damascene applications

Method of depositing dielectric films

Method of depositing dielectric materials in damascene applications

Enhanced remote plasma cleaning

Method of depositing a low k dielectric barrier film for copper dam...

Method and apparatus for treating low k dielectric layers to reduce...

Fluorine-containing layers for damascene structures

Method of depositing dielectric films

Method of depositing low k barrier layers

Plasma treatment for copper oxide reduction

Method for depositing a low k dielectric film (K&#x0003E;3.5) for h...

Method of eliminating photoresist poisoning in damascene applications

Reduction of plasma edge effect on plasma enhanced CVD processes

Method and apparatus for controlling the deposition of a fluorinate...

Patents Applicationslast 30 patents

BI-LAYER CAPPING OF LOW-K DIELECTRIC FILMS

BI-LAYER CAPPING OF LOW-K DIELECTRIC FILMS

METHOD OF DEPOSITING LOW K BARRIER LAYERS

Method of eliminating photoresist poisoning in damascene applications

Method of depositing dielectric films

Method of depositing dielectric materials in damascene applications

Method of depositing dielectric films

Method of depositing low K barrier layers

Method of eliminating photoresist poisoning in damascene applications

Methods for depositing dielectric material

Method of depositing a low k dielectric barrier film for copper dam...

Method of depositing dielectric materials in damascene applications

Method for depositing a low k dielectric film (k<3.5) for hard mask...

SILICON CARBIDE DEPOSITION FOR USE AS A BARRIER LAYER AND AN ETCH STOP

Method of eliminating photoresist poisoning in damascene applications

Method of depositing low k barrier layers

Plasma treatment for copper oxide reduction

Enhanced remote plasma cleaning

Fluorine-containing layers for damascene structures

Method and apparatus for treating low k dielectric layers to reduce...

PLASMA TREATMENT FOR COOPER OXIDE REDUCTION

Reduction of plasma edge effect on plasma enhanced CVD processes

Method for depositing a low k dielectric film (K>3.5) for h...