Ping-Yin Liu

Person

Yonghe City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Simultaneous bonding approach for high quality wafer stacking
- Patent number 12,211,727
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Xin-Hua Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
MEMS device having a metallization structure embedded in a dielectr...
- Patent number 11,932,534
- Issue date Mar 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Hua Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Dual facing BSI image sensors with wafer level stacking
- Patent number 11,894,408
- Issue date Feb 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ping-Yin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrate rinse module in hybrid bonding platform
- Patent number 11,854,795
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Xin-Hua Huang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Patterning a transparent wafer to form an alignment mark in the tra...
- Patent number 11,854,999
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Xin-Hua Huang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Deposition system for high accuracy patterning
- Patent number 11,818,944
- Issue date Nov 14, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ping-Yin Liu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Apparatus for bond wave propagation control
- Patent number 11,742,321
- Issue date Aug 29, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Xin-Hua Huang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Patterning a transparent wafer to form an alignment mark in the tra...
- Patent number 11,721,637
- Issue date Aug 8, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Xin-Hua Huang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Simultaneous bonding approach for high quality wafer stacking appli...
- Patent number 11,621,186
- Issue date Apr 4, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Xin-Hua Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fingerprint recognition and related fingerprint sensing c...
- Patent number 11,551,472
- Issue date Jan 10, 2023
- NOVATEK Microelectronics Corp.
- Ping Liu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Low contamination chamber for surface activation
- Patent number 11,508,562
- Issue date Nov 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ping-Yin Liu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for performing fingerprint sensing, electronic module capabl...
- Patent number 11,436,855
- Issue date Sep 6, 2022
- Novatek Microelectronics Corp.
- Ping Liu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for controlling display panel and control circuit using the...
- Patent number 11,302,102
- Issue date Apr 12, 2022
- NOVATEK Microelectronics Corp.
- Ping Liu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for manufacturing a MEMS device by first hybrid bonding a CM...
- Patent number 11,279,615
- Issue date Mar 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Hua Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integrate rinse module in hybrid bonding platform
- Patent number 11,282,697
- Issue date Mar 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Xin-Hua Huang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for alignment, process tool and method for wafer-level align...
- Patent number 11,189,515
- Issue date Nov 30, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ching-Hung Wang
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor structure and associated manufacturing method
- Patent number 11,127,725
- Issue date Sep 21, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Ping-Yin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Simultaneous bonding approach for high quality wafer stacking appli...
- Patent number 11,094,575
- Issue date Aug 17, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Xin-Hua Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual facing BSI image sensors with wafer level stacking
- Patent number 11,037,978
- Issue date Jun 15, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ping-Yin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for bond wave propagation control
- Patent number 11,031,369
- Issue date Jun 8, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Xin-Hua Huang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming semiconductor package and semiconductor package
- Patent number 11,014,805
- Issue date May 25, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-wen Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Operating method of an optical fingerprint capture apparatus and op...
- Patent number 10,990,782
- Issue date Apr 27, 2021
- Novatek Microelectronics Corp.
- Chun-Yen Lin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Fingerprint recognition apparatus
- Patent number 10,970,509
- Issue date Apr 6, 2021
- Novatek Microelectronics Corp.
- Ping Liu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Approach for ultra thin-film transfer and handling
- Patent number 10,962,878
- Issue date Mar 30, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ping-Yin Liu
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
3D integrated circuit and methods of forming the same
- Patent number 10,790,189
- Issue date Sep 29, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsun-Chung Kuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor structure
- Patent number 10,781,098
- Issue date Sep 22, 2020
- Taiwan Semiconductor Manufacturing Company Ltd.
- Hung-Hua Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integrate rinse module in hybrid bonding platform
- Patent number 10,665,449
- Issue date May 26, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Xin-Hua Huang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for alignment, process tool and method for wafer-level align...
- Patent number 10,636,688
- Issue date Apr 28, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ching-Hung Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked LED structure and associated manufacturing method
- Patent number 10,622,342
- Issue date Apr 14, 2020
- Taiwan Semiconductor Manufacturing Company Ltd.
- Ping-Yin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Approach for ultra thin-film transfer and handling
- Patent number 10,509,312
- Issue date Dec 17, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ping-Yin Liu
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY

Patents Applicationslast 30 patents

Information Patent Application
DUAL FACING BSI IMAGE SENSORS WITH WAFER LEVEL STACKING
- Publication number 20240178263
- Publication date May 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ping-Yin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTONIC INTEGRATED CIRCUIT STRUCTURE
- Publication number 20240134123
- Publication date Apr 25, 2024
- ProMOS Technologies Inc.
- Ping Ming Liu
- G02 - OPTICS
Information Patent Application
PHOTONIC INTEGRATED CIRCUIT STRUCTURE
- Publication number 20240126017
- Publication date Apr 18, 2024
- ProMOS Technologies Inc.
- Ping Ming Liu
- G02 - OPTICS
Information Patent Application
INTEGRATE RINSE MODULE IN HYBRID BONDING PLATFORM
- Publication number 20240087879
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Xin-Hua Huang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
DEPOSITION SYSTEM FOR HIGH ACCURACY PATTERNING
- Publication number 20230371354
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ping-Yin Liu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SIMULTANEOUS BONDING APPROACH FOR HIGH QUALITY WAFER STACKING APPLI...
- Publication number 20230238268
- Publication date Jul 27, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Xin-Hua Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRASONIC TRANSDUCER ARRAY COMBINATION AND ULTRASONIC IMAGING SYST...
- Publication number 20230125844
- Publication date Apr 27, 2023
- Qisda Corporation
- Ping-Yang Liu
- G01 - MEASURING TESTING
Information Patent Application
PATTERNING A TRANSPARENT WAFER TO FORM AN ALIGNMENT MARK IN THE TRA...
- Publication number 20220375872
- Publication date Nov 24, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Xin-Hua Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D Integrated Circuit and Methods of Forming the Same
- Publication number 20220310449
- Publication date Sep 29, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsun-Chung Kuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrate Rinse Module in Hybrid Bonding Platform
- Publication number 20220216052
- Publication date Jul 7, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Xin-Hua Huang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
3D Integrated Circuit and Methods of Forming the Same
- Publication number 20220208607
- Publication date Jun 30, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsun-Chung Kuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A MEMS DEVICE BY FIRST HYBRID BONDING A CM...
- Publication number 20220204340
- Publication date Jun 30, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Hua Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PATTERNING A TRANSPARENT WAFER TO FORM AN ALIGNMENT MARK IN THE TRA...
- Publication number 20210375780
- Publication date Dec 2, 2021
- Taiwan Semiconductor Manufacturing Co., LTD
- Xin-Hua Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIMULTANEOUS BONDING APPROACH FOR HIGH QUALITY WAFER STACKING APPLI...
- Publication number 20210335646
- Publication date Oct 28, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Xin-Hua Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PERFORMING FINGERPRINT SENSING, ELECTRONIC MODULE CAPABL...
- Publication number 20210303817
- Publication date Sep 30, 2021
- NOVATEK MICROELECTRONICS CORP.
- PING LIU
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Dual Facing BSI Image Sensors With Wafer Level Stacking
- Publication number 20210305292
- Publication date Sep 30, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ping-Yin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR BOND WAVE PROPAGATION CONTROL
- Publication number 20210272928
- Publication date Sep 2, 2021
- Taiwan Semiconductor Manufacturing Co., LTD
- Xin-Hua Huang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
DEPOSITION SYSTEM FOR HIGH ACCURACY PATTERNING
- Publication number 20210273167
- Publication date Sep 2, 2021
- Taiwan Semiconductor Manufacturing Co., LTD
- Ping-Yin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for controlling display panel and control circuit using the...
- Publication number 20210224505
- Publication date Jul 22, 2021
- NOVATEK MICROELECTRONICS CORP.
- Ping Liu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
3D Integrated Circuit and Methods of Forming the Same
- Publication number 20210151353
- Publication date May 20, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsun-Chung Kuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPERATING METHOD OF AN OPTICAL FINGERPRINT CAPTURE APPARATUS AND OP...
- Publication number 20210073508
- Publication date Mar 11, 2021
- NOVATEK MICROELECTRONICS CORP.
- Chun-Yen LIN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
3D Integrated Circuit and Methods of Forming the Same
- Publication number 20210013098
- Publication date Jan 14, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsun-Chung Kuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIMULTANEOUS BONDING APPROACH FOR HIGH QUALITY WAFER STACKING APPLI...
- Publication number 20200381283
- Publication date Dec 3, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Xin-Hua Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR ALIGNMENT, PROCESS TOOL AND METHOD FOR WAFER-LEVEL ALIGN...
- Publication number 20200227298
- Publication date Jul 16, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Ching-Hung Wang
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR STRUCTURE AND ASSOCIATED MANUFACTURING METHOD
- Publication number 20200185369
- Publication date Jun 11, 2020
- Taiwan Semiconductor Manufacturing company Ltd.
- PING-YIN LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NOVEL APPROACH FOR ULTRA THIN-FILM TRANSFER AND HANDLING
- Publication number 20200064730
- Publication date Feb 27, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Ping-Yin Liu
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
Dual Facing BSI Image Sensors with Wafer Level Stacking
- Publication number 20200052014
- Publication date Feb 13, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ping-Yin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR BOND WAVE PROPAGATION CONTROL
- Publication number 20200051950
- Publication date Feb 13, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Xin-Hua Huang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF FORMING SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE
- Publication number 20200002161
- Publication date Jan 2, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-wen CHENG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Integrate Rinse Module in Hybrid Bonding Platform
- Publication number 20200006052
- Publication date Jan 2, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Xin-Hua Huang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Ping-Yin Liu

Person

Patents Grantslast 30 patents

Simultaneous bonding approach for high quality wafer stacking

MEMS device having a metallization structure embedded in a dielectr...

Dual facing BSI image sensors with wafer level stacking

Integrate rinse module in hybrid bonding platform

Patterning a transparent wafer to form an alignment mark in the tra...

Deposition system for high accuracy patterning

Apparatus for bond wave propagation control

Patterning a transparent wafer to form an alignment mark in the tra...

Simultaneous bonding approach for high quality wafer stacking appli...

Method of fingerprint recognition and related fingerprint sensing c...

Low contamination chamber for surface activation

Method for performing fingerprint sensing, electronic module capabl...

Method for controlling display panel and control circuit using the...

Method for manufacturing a MEMS device by first hybrid bonding a CM...

Integrate rinse module in hybrid bonding platform

Method for alignment, process tool and method for wafer-level align...

Semiconductor structure and associated manufacturing method

Simultaneous bonding approach for high quality wafer stacking appli...

Dual facing BSI image sensors with wafer level stacking

Apparatus for bond wave propagation control

Method of forming semiconductor package and semiconductor package

Operating method of an optical fingerprint capture apparatus and op...

Fingerprint recognition apparatus

Approach for ultra thin-film transfer and handling

3D integrated circuit and methods of forming the same

Method of manufacturing semiconductor structure

Integrate rinse module in hybrid bonding platform

Method for alignment, process tool and method for wafer-level align...

Stacked LED structure and associated manufacturing method

Approach for ultra thin-film transfer and handling

Patents Applicationslast 30 patents

DUAL FACING BSI IMAGE SENSORS WITH WAFER LEVEL STACKING

PHOTONIC INTEGRATED CIRCUIT STRUCTURE

PHOTONIC INTEGRATED CIRCUIT STRUCTURE

INTEGRATE RINSE MODULE IN HYBRID BONDING PLATFORM

DEPOSITION SYSTEM FOR HIGH ACCURACY PATTERNING

SIMULTANEOUS BONDING APPROACH FOR HIGH QUALITY WAFER STACKING APPLI...

ULTRASONIC TRANSDUCER ARRAY COMBINATION AND ULTRASONIC IMAGING SYST...

PATTERNING A TRANSPARENT WAFER TO FORM AN ALIGNMENT MARK IN THE TRA...

3D Integrated Circuit and Methods of Forming the Same

Integrate Rinse Module in Hybrid Bonding Platform

3D Integrated Circuit and Methods of Forming the Same

METHOD FOR MANUFACTURING A MEMS DEVICE BY FIRST HYBRID BONDING A CM...

PATTERNING A TRANSPARENT WAFER TO FORM AN ALIGNMENT MARK IN THE TRA...

SIMULTANEOUS BONDING APPROACH FOR HIGH QUALITY WAFER STACKING APPLI...

METHOD FOR PERFORMING FINGERPRINT SENSING, ELECTRONIC MODULE CAPABL...

Dual Facing BSI Image Sensors With Wafer Level Stacking

APPARATUS FOR BOND WAVE PROPAGATION CONTROL

DEPOSITION SYSTEM FOR HIGH ACCURACY PATTERNING

Method for controlling display panel and control circuit using the...

3D Integrated Circuit and Methods of Forming the Same

OPERATING METHOD OF AN OPTICAL FINGERPRINT CAPTURE APPARATUS AND OP...

3D Integrated Circuit and Methods of Forming the Same

SIMULTANEOUS BONDING APPROACH FOR HIGH QUALITY WAFER STACKING APPLI...

METHOD FOR ALIGNMENT, PROCESS TOOL AND METHOD FOR WAFER-LEVEL ALIGN...

SEMICONDUCTOR STRUCTURE AND ASSOCIATED MANUFACTURING METHOD

NOVEL APPROACH FOR ULTRA THIN-FILM TRANSFER AND HANDLING

Dual Facing BSI Image Sensors with Wafer Level Stacking

APPARATUS FOR BOND WAVE PROPAGATION CONTROL

METHOD OF FORMING SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE

Integrate Rinse Module in Hybrid Bonding Platform