Pingliang Tu

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Kwai Chung, HK

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Patents Grantslast 30 patents

Information Patent Grant
Heating of a substrate for epoxy deposition
- Patent number 10,861,714
- Issue date Dec 8, 2020
- ASM Technology Singapore Pte. Ltd.
- Pak Lun Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die attachment apparatus and method utilizing activated forming gas
- Patent number 10,399,170
- Issue date Sep 3, 2019
- ASM Technology Singapore Pte. Ltd.
- Kui Kam Lam
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
HEATING OF A SUBSTRATE FOR EPOXY DEPOSITION
- Publication number 20200227281
- Publication date Jul 16, 2020
- ASM Technology Singapore Pte Ltd
- Pak Lun CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE ATTACHMENT APPARATUS AND METHOD UTILIZING ACTIVATED FORMING GAS
- Publication number 20150072473
- Publication date Mar 12, 2015
- Kui Kam LAM
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEM FOR DISPENSING SOFT SOLDER FOR MOUNTING SEMICONDUCTOR CHIPS...
- Publication number 20130119113
- Publication date May 16, 2013
- ASM Assembly Automation Ltd
- Kui Kam LAM
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEM FOR DISPENSING SOFT SOLDER FOR MOUNTING SEMICONDUCTOR CHIPS...
- Publication number 20110272452
- Publication date Nov 10, 2011
- Kui Kam Lam
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR