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Bangkok, TH
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Patents Grants
last 30 patents
Information
Patent Grant
Semiconductor wafer dicing method
Patent number
10,297,500
Issue date
May 21, 2019
Nexperia B.V.
Crispulo Estira Lictao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of assembling semiconductor devices of varying thicknesses
Patent number
9,812,339
Issue date
Nov 7, 2017
NXP B.V.
Pimpa Boonyatee
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
NON-LEADED DEVICE SINGULATION
Publication number
20190252256
Publication date
Aug 15, 2019
NXP B.V.
Pimpa Boonyatee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DIE SEPARATION USING ADHESIVE-LAYER LASER SCRIBING
Publication number
20190164784
Publication date
May 30, 2019
NXP B.V.
Siriluck Wongratanaporngoorn
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR WAFER DICING METHOD
Publication number
20180174907
Publication date
Jun 21, 2018
Nexperia B.V.
Crispulo Estira Lictao
H01 - BASIC ELECTRIC ELEMENTS