Po-Cheng LAI

Person

TAIPEI CITY, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Package structure and method for forming the same
- Patent number 12,176,301
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Chen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-emitting device including photosensor for the detection of Mu...
- Patent number 12,155,013
- Issue date Nov 26, 2024
- Au Optronics Corporation
- Po-Chun Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transistor cells for longer channel transistors
- Patent number 12,132,081
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jaw-Juinn Horng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device package having dummy...
- Patent number 12,125,822
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Che-Chia Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure
- Patent number 12,113,033
- Issue date Oct 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Chen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-insulator-metal capacitors with thick intermediate electrode...
- Patent number 12,100,730
- Issue date Sep 24, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Po-Chia Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Digital low-dropout voltage regulator
- Patent number 12,093,065
- Issue date Sep 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Yu Lai
- G05 - CONTROLLING REGULATING
Information Patent Grant
Package structure with warpage-control element
- Patent number 12,087,705
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Sheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming semiconductor device
- Patent number 12,087,579
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chung-Yang Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure with multiple gap-filling layers and fabrica...
- Patent number 12,057,363
- Issue date Aug 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Chen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and formation method of chip package with reinforcing str...
- Patent number 12,040,285
- Issue date Jul 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Chen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with stress reduction design and method for f...
- Patent number 12,035,475
- Issue date Jul 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Kuei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method for forming the same
- Patent number 12,014,969
- Issue date Jun 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Chen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure with buffer structure and method for forming...
- Patent number 11,990,418
- Issue date May 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chin-Hua Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and method for forming the same
- Patent number 11,984,381
- Issue date May 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Chen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wearable device
- Patent number 11,984,649
- Issue date May 14, 2024
- Pegatron Corporation
- Kuo-Chi Cheng
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Structure and formation method of package containing chip structure...
- Patent number 11,978,722
- Issue date May 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Shen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sweep voltage generator and display panel
- Patent number 11,967,272
- Issue date Apr 23, 2024
- AUO Corporation
- Chih-Lung Lin
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Solder resist structure to mitigate solder bridge risk
- Patent number 11,967,547
- Issue date Apr 23, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chin-Hua Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip device and method of formation
- Patent number 11,967,582
- Issue date Apr 23, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chin-Hua Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded stress absorber in package
- Patent number 11,955,455
- Issue date Apr 9, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having first heat spreader and second heat spr...
- Patent number 11,915,991
- Issue date Feb 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Shen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package with stress reduction design and metho...
- Patent number 11,894,320
- Issue date Feb 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Shen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated antenna structure
- Patent number 11,894,607
- Issue date Feb 6, 2024
- Pegatron Corporation
- Po-Yen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages having conductive patterns of redistribution...
- Patent number 11,862,549
- Issue date Jan 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Kuei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacturing
- Patent number 11,854,837
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Po-Chen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structures and method for forming the same
- Patent number 11,830,859
- Issue date Nov 28, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chin-Hua Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device
- Patent number 11,783,747
- Issue date Oct 10, 2023
- AUO CORPORATION
- Po-Chun Lai
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Integrated fan-out package having stress release structure
- Patent number 11,742,322
- Issue date Aug 29, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Chih Yew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Digital low-dropout voltage regulator
- Patent number 11,733,724
- Issue date Aug 22, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Yu Lai
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METAL-INSULATOR-METAL CAPACITORS WITH THICK INTERMEDIATE ELECTRODE...
- Publication number 20240387609
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Po-Chia Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES WITH THERMAL LID AND METHODS OF FORMING THE...
- Publication number 20240387317
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Chen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE WITH DUMMY VIAS
- Publication number 20240387349
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chin-Hua WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME
- Publication number 20240387335
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Li-Ling Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE
- Publication number 20240387405
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Chen LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Hybrid organic and non-organic interposer with embedded component a...
- Publication number 20240379516
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Monsen Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSISTOR CELLS FOR LONGER CHANNEL TRANSISTORS
- Publication number 20240379757
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jaw-Juinn Horng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A SEMICONDUCTOR DEVICE PACKAGE HAVING DUMMY DIES
- Publication number 20240371829
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Che-Chia Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE WITH WARPAGE-CONTROL ELEMENT
- Publication number 20240371792
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Sheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIGITAL LOW-DROPOUT VOLTAGE REGULATOR
- Publication number 20240370045
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Yu LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING CHIP PACKAGE STRUCTURE WITH MULTIPLE GAP-FILLING...
- Publication number 20240347407
- Publication date Oct 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Chen LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING A SEMICONDUCTOR PACKAGE WITH STRESS REDUCTION DE...
- Publication number 20240334608
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Kuei HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE WITH REINFORCING STRUCTURES
- Publication number 20240332214
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Chen LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEFORMATION-RESISTANT INTERPOSER FOR A LOCAL SILICON INTERCONNECT A...
- Publication number 20240321758
- Publication date Sep 26, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Min-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE WITH BUFFER STRUCTURE
- Publication number 20240304559
- Publication date Sep 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chin-Hua WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20240297089
- Publication date Sep 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Chen LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP DEVICE AND METHOD OF FORMATION
- Publication number 20240274577
- Publication date Aug 15, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chin-Hua WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20240258193
- Publication date Aug 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Chen LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE CONTAINING CHIP STRUCTURE WITH INCLINED SIDEWALLS
- Publication number 20240250069
- Publication date Jul 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Shen YEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE WITH STRESS REDUCTION DESIGN
- Publication number 20240243076
- Publication date Jul 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Shen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER RESIST STRUCTURE TO MITIGATE SOLDER BRIDGE RISK
- Publication number 20240222247
- Publication date Jul 4, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chin-Hua Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED STRESS ABSORBER IN PACKAGE
- Publication number 20240213213
- Publication date Jun 27, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240136246
- Publication date Apr 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Shen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIGITAL LOW-DROPOUT VOLTAGE REGULATOR
- Publication number 20240085934
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Yu LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATING METHOD OF SEMICONDUCTOR DIE WITH TAPERED SIDEWALL IN PA...
- Publication number 20240088095
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chin-Hua WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-INSULATOR-METAL CAPACITORS AND METHODS OF FORMING THE SAME
- Publication number 20240063253
- Publication date Feb 22, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Po-Chia Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROSTATIC DISCHARGE TRIGGER CIRCUIT USING VOLTAGE DETECTION CIR...
- Publication number 20240063633
- Publication date Feb 22, 2024
- MEDIATEK INC.
- Po-Ya Lai
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240047441
- Publication date Feb 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chin-Hua Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SWEEP VOLTAGE GENERATOR AND DISPLAY PANEL
- Publication number 20240029630
- Publication date Jan 25, 2024
- AUO Corporation
- Chih-Lung Lin
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING PACKAGE SUBSTRATE WITH DUMMY VIA AN...
- Publication number 20240014147
- Publication date Jan 11, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chin-Hua Wang
- H01 - BASIC ELECTRIC ELEMENTS

Po-Cheng LAI

Person

Patents Grantslast 30 patents

Package structure and method for forming the same

Light-emitting device including photosensor for the detection of Mu...

Transistor cells for longer channel transistors

Method of manufacturing a semiconductor device package having dummy...

Chip package structure

Metal-insulator-metal capacitors with thick intermediate electrode...

Digital low-dropout voltage regulator

Package structure with warpage-control element

Method for forming semiconductor device

Chip package structure with multiple gap-filling layers and fabrica...

Structure and formation method of chip package with reinforcing str...

Semiconductor package with stress reduction design and method for f...

Package structure and method for forming the same

Chip package structure with buffer structure and method for forming...

Semiconductor package structure and method for forming the same

Wearable device

Structure and formation method of package containing chip structure...

Sweep voltage generator and display panel

Solder resist structure to mitigate solder bridge risk

Multi-chip device and method of formation

Embedded stress absorber in package

Semiconductor device having first heat spreader and second heat spr...

Semiconductor device package with stress reduction design and metho...

Integrated antenna structure

Semiconductor packages having conductive patterns of redistribution...

Semiconductor devices and methods of manufacturing

Package structures and method for forming the same

Display device

Integrated fan-out package having stress release structure

Digital low-dropout voltage regulator

Patents Applicationslast 30 patents

METAL-INSULATOR-METAL CAPACITORS WITH THICK INTERMEDIATE ELECTRODE...

SEMICONDUCTOR PACKAGES WITH THERMAL LID AND METHODS OF FORMING THE...

CHIP PACKAGE STRUCTURE WITH DUMMY VIAS

SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME

CHIP PACKAGE STRUCTURE

Hybrid organic and non-organic interposer with embedded component a...

TRANSISTOR CELLS FOR LONGER CHANNEL TRANSISTORS

METHOD OF FORMING A SEMICONDUCTOR DEVICE PACKAGE HAVING DUMMY DIES

PACKAGE STRUCTURE WITH WARPAGE-CONTROL ELEMENT

DIGITAL LOW-DROPOUT VOLTAGE REGULATOR

METHOD FOR FORMING CHIP PACKAGE STRUCTURE WITH MULTIPLE GAP-FILLING...

METHOD FOR FORMING A SEMICONDUCTOR PACKAGE WITH STRESS REDUCTION DE...

PACKAGE STRUCTURE WITH REINFORCING STRUCTURES

DEFORMATION-RESISTANT INTERPOSER FOR A LOCAL SILICON INTERCONNECT A...

CHIP PACKAGE STRUCTURE WITH BUFFER STRUCTURE

PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME

MULTI-CHIP DEVICE AND METHOD OF FORMATION

METHOD FOR FORMING SEMICONDUCTOR PACKAGE STRUCTURE

PACKAGE STRUCTURE CONTAINING CHIP STRUCTURE WITH INCLINED SIDEWALLS

SEMICONDUCTOR DEVICE PACKAGE WITH STRESS REDUCTION DESIGN

SOLDER RESIST STRUCTURE TO MITIGATE SOLDER BRIDGE RISK

EMBEDDED STRESS ABSORBER IN PACKAGE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

DIGITAL LOW-DROPOUT VOLTAGE REGULATOR

FABRICATING METHOD OF SEMICONDUCTOR DIE WITH TAPERED SIDEWALL IN PA...

METAL-INSULATOR-METAL CAPACITORS AND METHODS OF FORMING THE SAME

ELECTROSTATIC DISCHARGE TRIGGER CIRCUIT USING VOLTAGE DETECTION CIR...

PACKAGE STRUCTURE

SWEEP VOLTAGE GENERATOR AND DISPLAY PANEL

SEMICONDUCTOR PACKAGE INCLUDING PACKAGE SUBSTRATE WITH DUMMY VIA AN...