Po-Chin Nien

Person

Hsin-Chu, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Chemical mechanical planarization using nano-abrasive slurry
- Patent number 11,189,497
- Issue date Nov 30, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Chin Nien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Planarization control in semiconductor manufacturing process
- Patent number 10,541,139
- Issue date Jan 21, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Chin Nien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Doped poly-silicon for PolyCMP planarity improvement
- Patent number 10,068,988
- Issue date Sep 4, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- William Weilun Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface treatment in a chemical mechanical process
- Patent number 9,941,109
- Issue date Apr 10, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Wen Liu
- B24 - GRINDING POLISHING
Information Patent Grant
Asymmetric application of pressure to a wafer during a CMP process
- Patent number 9,922,837
- Issue date Mar 20, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Wen Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Doped poly-silicon for polyCMP planarity improvement
- Patent number 9,871,115
- Issue date Jan 16, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- William Weilun Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for semiconductor planarization
- Patent number 9,721,831
- Issue date Aug 1, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Chin Nien
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SYSTEM AND METHOD FOR REMOVING IMPURITIES DURING CHEMICAL MECHANICA...
- Publication number 20240412977
- Publication date Dec 12, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Te-Chien HOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming the Same
- Publication number 20230154762
- Publication date May 18, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Wei Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD FOR REMOVING IMPURITIES DURING CHEMICAL MECHANICA...
- Publication number 20220415665
- Publication date Dec 29, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Te-Chien HOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHEMICAL MECHANICAL PLANARIZATION USING NANO-ABRASIVE SLURRY
- Publication number 20200365413
- Publication date Nov 19, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Chin Nien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOPED POLY-SILICON FOR POLYCMP PLANARITY IMPROVEMENT
- Publication number 20180145152
- Publication date May 24, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- William Weilun Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Surface Treatment in a Chemical Mechanical Process
- Publication number 20180005840
- Publication date Jan 4, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Wen Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Doped Poly-Silicon for PolyCMP Planarity Improvement
- Publication number 20180006134
- Publication date Jan 4, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- William Weilun Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Planarization Control in Semiconductor Manufacturing Process
- Publication number 20170278712
- Publication date Sep 28, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Chin Nien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Asymmetric Application of Pressure to a Wafer During a CMP Process
- Publication number 20170256414
- Publication date Sep 7, 2017
- Taiwan Semiconductor Manufacturing Co., LTD
- Chih-Wen Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Apparatus for Semiconductor Planarization
- Publication number 20170162432
- Publication date Jun 8, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Chin Nien
- H01 - BASIC ELECTRIC ELEMENTS

Po-Chin Nien

Person

Patents Grantslast 30 patents

Chemical mechanical planarization using nano-abrasive slurry

Planarization control in semiconductor manufacturing process

Doped poly-silicon for PolyCMP planarity improvement

Surface treatment in a chemical mechanical process

Asymmetric application of pressure to a wafer during a CMP process

Doped poly-silicon for polyCMP planarity improvement

Method and apparatus for semiconductor planarization

Patents Applicationslast 30 patents

SYSTEM AND METHOD FOR REMOVING IMPURITIES DURING CHEMICAL MECHANICA...

Semiconductor Device and Method of Forming the Same

SYSTEM AND METHOD FOR REMOVING IMPURITIES DURING CHEMICAL MECHANICA...

CHEMICAL MECHANICAL PLANARIZATION USING NANO-ABRASIVE SLURRY

DOPED POLY-SILICON FOR POLYCMP PLANARITY IMPROVEMENT

Surface Treatment in a Chemical Mechanical Process

Doped Poly-Silicon for PolyCMP Planarity Improvement

Planarization Control in Semiconductor Manufacturing Process

Asymmetric Application of Pressure to a Wafer During a CMP Process

Method and Apparatus for Semiconductor Planarization