Po-Han Huang

Person

Tainan, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Deep learning model inference for dynamic input shapes
- Patent number 12,223,300
- Issue date Feb 11, 2025
- Mediatek Inc.
- Meng-Hsuan Yang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method of forming backside power rails
- Patent number 12,224,324
- Issue date Feb 11, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna effect protection and electrostatic discharge protection fo...
- Patent number 12,224,482
- Issue date Feb 11, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Hsiang Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-silicon via in integrated circuit packaging
- Patent number 12,223,252
- Issue date Feb 11, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Fong-yuan Chang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
System and method for generating layout diagram including wiring ar...
- Patent number 12,216,981
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Fong-Yuan Chang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Power supplying device, method and secure system
- Patent number 12,200,098
- Issue date Jan 14, 2025
- Nuvoton Technology Corporation
- Po-Hsuan Huang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Info packages including thermal dissipation blocks
- Patent number 12,159,791
- Issue date Dec 3, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ching-Yi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nitrogen plasma treatment for improving interface between etch stop...
- Patent number 12,159,830
- Issue date Dec 3, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hui Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat dissipation structures for three-dimensional system on integra...
- Patent number 12,154,842
- Issue date Nov 26, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Po-Hsiang Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Different via configurations for different via interface requirements
- Patent number 12,142,565
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shih-Che Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Depth analyzer and shading rate controller
- Patent number 12,118,653
- Issue date Oct 15, 2024
- Mediatek Inc.
- Po-Yu Huang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electronic package and manufacturing method thereof
- Patent number 12,113,004
- Issue date Oct 8, 2024
- Siliconware Precision Industries Co., Ltd.
- Chung-Yu Ke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat transfer element, method for forming the same and semiconducto...
- Patent number 12,111,114
- Issue date Oct 8, 2024
- Advanced Semiconductor Engineering, Inc.
- Hung-Hsien Huang
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Heater device with memory unit and operation method thereof
- Patent number 12,090,757
- Issue date Sep 17, 2024
- Innolux Corporation
- Po-Han Huang
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Integrated circuit having a high cell density
- Patent number 12,087,690
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Sheng-Hsiung Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Mobile robot and stabilization method for the mobile robot
- Patent number 12,083,679
- Issue date Sep 10, 2024
- Delta Electronics, Inc.
- Cheng-Hao Huang
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Cell region including portion of conductor of another cell region a...
- Patent number 12,079,561
- Issue date Sep 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Fong-Yuan Chang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Contact structure with silicide and method for forming the same
- Patent number 12,080,769
- Issue date Sep 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kai-Hsuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat dissipation in semiconductor packages and methods of forming same
- Patent number 12,074,148
- Issue date Aug 27, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Fong-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside via with a low-k spacer
- Patent number 12,068,200
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Back-end-of-line devices
- Patent number 12,068,377
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Hsiang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices with backside via and methods thereof
- Patent number 12,068,378
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit including a first semiconductor wafer and a seco...
- Patent number 12,062,641
- Issue date Aug 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Lin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three dimensional integrated circuit and fabrication thereof
- Patent number 12,057,447
- Issue date Aug 6, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chenming Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pin modification for standard cells
- Patent number 12,056,432
- Issue date Aug 6, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Fong-yuan Chang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Conductive features having varying resistance
- Patent number 12,057,392
- Issue date Aug 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jia-En Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Out-of-order buffer and associated management method
- Patent number 12,056,049
- Issue date Aug 6, 2024
- RDC Semiconductor Co., Ltd.
- Jyun-Yan Li
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor devices having conductive pad structures with multi-b...
- Patent number 12,051,659
- Issue date Jul 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Hsun Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices with reduced capacitances
- Patent number 12,046,506
- Issue date Jul 23, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Hsin Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Managing peripheral component interconnect express slots of an info...
- Patent number 12,032,507
- Issue date Jul 9, 2024
- Dell Products L.P.
- Ting-Chiang Huang
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
Wafer Map Recognition Method Using Artificial Intelligence AND Comp...
- Publication number 20250054130
- Publication date Feb 13, 2025
- MEDIATEK INC.
- En Jen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
HDR Tone Mapping System and Method with Semantic Segmentation
- Publication number 20250054119
- Publication date Feb 13, 2025
- MEDIATEK INC.
- Huei-Han Jhuang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
INFO PACKAGES INCLUDING THERMAL DISSIPATION BLOCKS
- Publication number 20250054775
- Publication date Feb 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ching-Yi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MATERIAL RECOGNITION SYSTEM AND METHOD
- Publication number 20250035593
- Publication date Jan 30, 2025
- Delta Electronics, Inc.
- Chia-Ju PENG
- G01 - MEASURING TESTING
Information Patent Application
BISPECIFIC ANTIBODIES TARGETING CD137 AND USES THEREOF FOR ANTI-CAN...
- Publication number 20250026841
- Publication date Jan 23, 2025
- AP Biosciences, Inc.
- Jeng-Horng Her
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
ANTENNA STRUCTURE
- Publication number 20250030167
- Publication date Jan 23, 2025
- ONEWAVE TECHNOLOGY CO., LTD.
- Yun-Chan TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OFFSET OVERLAP TYPE OF MODULATED FERROMAGNETIC POLE PIECE RING AND...
- Publication number 20250023439
- Publication date Jan 16, 2025
- National Cheng Kung University
- Mi-ching TSAI
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
Backside Via and Dual Side Power Rail For Epitaxial Source/Drain St...
- Publication number 20250006557
- Publication date Jan 2, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heat Dissipation Structures
- Publication number 20240413052
- Publication date Dec 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Hsiang HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEATER DEVICE WITH MEMORY UNIT AND OPERATION METHOD THEREOF
- Publication number 20240399744
- Publication date Dec 5, 2024
- InnoLux Corporation
- Po-Han HUANG
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
CAMERA MODULE CARRYING DEVICE
- Publication number 20240402581
- Publication date Dec 5, 2024
- Rayprus Technology (Foshan) Co., Ltd.
- PO-HSIANG HUANG
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
Integrated Circuit Having a High Cell Density
- Publication number 20240387373
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Sheng-Hsiung Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ONE-TIME-PROGRAMMABLE DEVICE STRUCTURE
- Publication number 20240387365
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Hsiang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPUTING SYSTEM AND METHOD FOR GRAPHICS PROCESSOR BOOSTING
- Publication number 20240386523
- Publication date Nov 21, 2024
- MEDIATEK INC.
- Po-Yu HUANG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Disposable Hard Mask for Interconnect Formation
- Publication number 20240387660
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Che Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20240387626
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Hsuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE ANTENNA STRUCTURE
- Publication number 20240387986
- Publication date Nov 21, 2024
- ONEWAVE TECHNOLOGY CO., LTD.
- Yun-Chan TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PERFORMING AUTOMATIC ACTIVATION CONTROL REGARDING VARIAB...
- Publication number 20240386648
- Publication date Nov 21, 2024
- MEDIATEK INC.
- Po-Yu HUANG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
THROUGH-SILICON VIAS IN INTEGRATED CIRCUIT PACKAGING
- Publication number 20240386183
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Fong-yuan CHANG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE
- Publication number 20240387377
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Fong-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHODS FOR THREE DIMENSIONAL RETICLE DEFECT SMART RE...
- Publication number 20240379464
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Chien HUANG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SELF-ALIGNED INTERCONNECT STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20240379436
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cai-Ling Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Nitrogen Plasma Treatment For Improving Interface Between Etch Stop...
- Publication number 20240379541
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Hui Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR PROCESSING A SUBSTRATE
- Publication number 20240379380
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sheng-chun YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HOMOGENEOUS SOURCE/DRAIN CONTACT STRUCTURE
- Publication number 20240379412
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ya-Ching Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Back-End-Of-Line Devices
- Publication number 20240371948
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Hsiang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT STRUCTURE WITH SILICIDE AND METHOD FOR FORMING THE SAME
- Publication number 20240371955
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Hsuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT MANUFACTURING METHOD
- Publication number 20240370633
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Fong-Yuan CHANG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD FOR PERFORMING COEXISTENCE CONTROL BASED ON ADAPTIVE THRESHO...
- Publication number 20240373243
- Publication date Nov 7, 2024
- MEDIATEK INC.
- Chang-Yi Hsu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Heat Dissipation in Semiconductor Packages and Methods of Forming Same
- Publication number 20240371839
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Fong-yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS

Po-Han Huang

Person

Patents Grantslast 30 patents

Deep learning model inference for dynamic input shapes

Method of forming backside power rails

Antenna effect protection and electrostatic discharge protection fo...

Through-silicon via in integrated circuit packaging

System and method for generating layout diagram including wiring ar...

Power supplying device, method and secure system

Info packages including thermal dissipation blocks

Nitrogen plasma treatment for improving interface between etch stop...

Heat dissipation structures for three-dimensional system on integra...

Different via configurations for different via interface requirements

Depth analyzer and shading rate controller

Electronic package and manufacturing method thereof

Heat transfer element, method for forming the same and semiconducto...

Heater device with memory unit and operation method thereof

Integrated circuit having a high cell density

Mobile robot and stabilization method for the mobile robot

Cell region including portion of conductor of another cell region a...

Contact structure with silicide and method for forming the same

Heat dissipation in semiconductor packages and methods of forming same

Backside via with a low-k spacer

Back-end-of-line devices

Semiconductor devices with backside via and methods thereof

Integrated circuit including a first semiconductor wafer and a seco...

Three dimensional integrated circuit and fabrication thereof

Pin modification for standard cells

Conductive features having varying resistance

Out-of-order buffer and associated management method

Semiconductor devices having conductive pad structures with multi-b...

Devices with reduced capacitances

Managing peripheral component interconnect express slots of an info...

Patents Applicationslast 30 patents

Wafer Map Recognition Method Using Artificial Intelligence AND Comp...

HDR Tone Mapping System and Method with Semantic Segmentation

INFO PACKAGES INCLUDING THERMAL DISSIPATION BLOCKS

MATERIAL RECOGNITION SYSTEM AND METHOD

BISPECIFIC ANTIBODIES TARGETING CD137 AND USES THEREOF FOR ANTI-CAN...

ANTENNA STRUCTURE

OFFSET OVERLAP TYPE OF MODULATED FERROMAGNETIC POLE PIECE RING AND...

Backside Via and Dual Side Power Rail For Epitaxial Source/Drain St...

Heat Dissipation Structures

HEATER DEVICE WITH MEMORY UNIT AND OPERATION METHOD THEREOF

CAMERA MODULE CARRYING DEVICE

Integrated Circuit Having a High Cell Density

ONE-TIME-PROGRAMMABLE DEVICE STRUCTURE

COMPUTING SYSTEM AND METHOD FOR GRAPHICS PROCESSOR BOOSTING

Disposable Hard Mask for Interconnect Formation

SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME

FLEXIBLE ANTENNA STRUCTURE

METHOD FOR PERFORMING AUTOMATIC ACTIVATION CONTROL REGARDING VARIAB...

THROUGH-SILICON VIAS IN INTEGRATED CIRCUIT PACKAGING

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE

APPARATUS AND METHODS FOR THREE DIMENSIONAL RETICLE DEFECT SMART RE...

SELF-ALIGNED INTERCONNECT STRUCTURE AND METHOD OF FORMING THE SAME

Nitrogen Plasma Treatment For Improving Interface Between Etch Stop...

SYSTEMS AND METHODS FOR PROCESSING A SUBSTRATE

HOMOGENEOUS SOURCE/DRAIN CONTACT STRUCTURE

Back-End-Of-Line Devices

CONTACT STRUCTURE WITH SILICIDE AND METHOD FOR FORMING THE SAME

INTEGRATED CIRCUIT MANUFACTURING METHOD

METHOD FOR PERFORMING COEXISTENCE CONTROL BASED ON ADAPTIVE THRESHO...

Heat Dissipation in Semiconductor Packages and Methods of Forming Same