Po-Lu Tsai

Person

Tainan City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Dummy structure of stacked and bonded semiconductor device
- Patent number 12,237,291
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Company
- Li-Hui Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with improved interposer structure
- Patent number 12,237,262
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Wen Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out package with cavity substrate
- Patent number 12,199,084
- Issue date Jan 14, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 12,191,287
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacturing
- Patent number 12,176,337
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yi-Wen Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor package
- Patent number 12,132,021
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Kuei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterogeneous fan-out structure and method of manufacture
- Patent number 12,131,984
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming chip package structure
- Patent number 12,100,666
- Issue date Sep 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming package structure
- Patent number 12,094,819
- Issue date Sep 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Caster with a breaking unit
- Patent number 12,083,824
- Issue date Sep 10, 2024
- JENP-JOU ENTERPRISE CO., LTD.
- Po-Chuan Tsai
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Keyboard
- Patent number 12,087,517
- Issue date Sep 10, 2024
- Darfon Electronics Corp.
- Po-Wei Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 12,087,745
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Seal ring structure with zigzag patterns and method forming same
- Patent number 12,087,648
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kuan-Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Keyboard
- Patent number 12,087,518
- Issue date Sep 10, 2024
- Darfon Electronics Corp.
- Po-Wei Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backlight module and keyboard thereof
- Patent number 12,087,522
- Issue date Sep 10, 2024
- Darfon Electronics Corp.
- Po-Wei Tsai
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for forming 2-D material semiconductor device with improved...
- Patent number 12,080,557
- Issue date Sep 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shih-Yen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packages with ring-shaped substrates
- Patent number 12,074,104
- Issue date Aug 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out package structures with recesses in molding comp...
- Patent number 12,057,432
- Issue date Aug 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump integration with redistribution layer
- Patent number 12,057,423
- Issue date Aug 6, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ting-Li Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Passivation layer and planarization layer and method of forming the...
- Patent number 12,051,622
- Issue date Jul 30, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ming-Da Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for monitoring transport vehicle and maintenance thereof
- Patent number 12,050,153
- Issue date Jul 30, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chun-Jung Huang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for an ion implantation process employing an ion-collecting...
- Patent number 12,051,593
- Issue date Jul 30, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chun-Jung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and method for forming semiconducto...
- Patent number 12,051,632
- Issue date Jul 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package with redistribution structure having multiple chips
- Patent number 12,046,548
- Issue date Jul 23, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacture
- Patent number 12,021,045
- Issue date Jun 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterogeneous antenna in fan-out package
- Patent number 11,996,606
- Issue date May 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Yao Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacture
- Patent number 11,996,372
- Issue date May 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Yao Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming package structure with cavity substrate
- Patent number 11,967,579
- Issue date Apr 23, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package component with stepped passivation layer
- Patent number 11,961,762
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ming-Da Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 11,955,423
- Issue date Apr 9, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ting-Li Yang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Heterogeneous Fan-Out Structure and Method of Manufacture
- Publication number 20250038087
- Publication date Jan 30, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME
- Publication number 20250022943
- Publication date Jan 16, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Yen LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASTIC BOARD AND KEYBOARD THEREOF
- Publication number 20240404770
- Publication date Dec 5, 2024
- DARFON ELECTRONICS CORP.
- Po-Wei Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDISTRIBUTION LINES HAVING NANO COLUMNS AND METHOD FORMING SAME
- Publication number 20240387433
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
KEY STRUCTURE
- Publication number 20240379306
- Publication date Nov 14, 2024
- DARFON ELECTRONICS CORP.
- Hsun-Kun PENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID MICRO-BUMP INTEGRATION WITH REDISTRIBUTION LAYER
- Publication number 20240379605
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacaturing Co., Ltd.
- Ting-Li Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE WITH PULL-IN PLANARIZATION LAYER AND METHOD...
- Publication number 20240379428
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Da Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20240379577
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shin-Puu JENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME
- Publication number 20240371944
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Yen LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240371840
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240363533
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP INTEGRATION WITH REDISTRIBUTION LAYER
- Publication number 20240363569
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ting-Li Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Seal Ring Structure with Zigzag Patterns and Method Forming Same
- Publication number 20240363457
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuan-Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20240355692
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Hao TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE HAVING MULTIPLE CHIPS
- Publication number 20240347439
- Publication date Oct 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shin-Puu JENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR ION IMPLANTATION THAT ADJUSTS A TARGET'S TILT ANGLE BASE...
- Publication number 20240347341
- Publication date Oct 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Jung HUANG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE
- Publication number 20240304572
- Publication date Sep 12, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heterogeneous Antenna in Fan-Out Package
- Publication number 20240297432
- Publication date Sep 5, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Yao Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE
- Publication number 20240250046
- Publication date Jul 25, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Yao Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method
- Publication number 20240250019
- Publication date Jul 25, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ting-Li Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE WITH CAVITY SUBSTRATE
- Publication number 20240234368
- Publication date Jul 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Hao TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING SEMICONDUCTOR DEVICE HAVING REDUCED BUMP HEIGHT VA...
- Publication number 20240222318
- Publication date Jul 4, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng LIN
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE COMPONENT WITH STEPPED PASSIVATION LAYER
- Publication number 20240222194
- Publication date Jul 4, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Da Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CASTER WITH A BREAKING UNIT
- Publication number 20240208265
- Publication date Jun 27, 2024
- JENP-JOU ENTERPRISE CO., LTD.
- Po-Chuan TSAI
- B60 - VEHICLES IN GENERAL
Information Patent Application
CHIP PACKAGE WITH FAN-OUT FEATURE AND METHOD FOR FORMING THE SAME
- Publication number 20240203893
- Publication date Jun 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Hao TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
InFO-POP Structures with TIVs Having Cavities
- Publication number 20240136298
- Publication date Apr 25, 2024
- Taiwan Semiconductor Manufacturing Dp., Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
KEYSWITCH AND KEYBOARD THEREOF
- Publication number 20240120160
- Publication date Apr 11, 2024
- DARFON ELECTRONICS CORP.
- Po-Wei Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240107903
- Publication date Mar 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Yen LIN
Information Patent Application
Fan-Out Package with Cavity Substrate
- Publication number 20240105705
- Publication date Mar 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE
- Publication number 20240096816
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Dummy structure of stacked and bonded semiconductor device

Semiconductor package with improved interposer structure

Fan-out package with cavity substrate

Package structure

Semiconductor devices and methods of manufacturing

Method for fabricating semiconductor package

Heterogeneous fan-out structure and method of manufacture

Method for forming chip package structure

Method for forming package structure

Caster with a breaking unit

Keyboard

Package structure and manufacturing method thereof

Seal ring structure with zigzag patterns and method forming same

Keyboard

Backlight module and keyboard thereof

Method for forming 2-D material semiconductor device with improved...

Integrated circuit packages with ring-shaped substrates

Integrated fan-out package structures with recesses in molding comp...

Bump integration with redistribution layer

Passivation layer and planarization layer and method of forming the...

Method for monitoring transport vehicle and maintenance thereof

Method for an ion implantation process employing an ion-collecting...

Semiconductor package structure and method for forming semiconducto...

Chip package with redistribution structure having multiple chips

Semiconductor device and method of manufacture

Heterogeneous antenna in fan-out package

Semiconductor device and method of manufacture

Method for forming package structure with cavity substrate

Package component with stepped passivation layer

Semiconductor device and method

Patents Applicationslast 30 patents

Heterogeneous Fan-Out Structure and Method of Manufacture

SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME

PLASTIC BOARD AND KEYBOARD THEREOF

REDISTRIBUTION LINES HAVING NANO COLUMNS AND METHOD FORMING SAME

KEY STRUCTURE

HYBRID MICRO-BUMP INTEGRATION WITH REDISTRIBUTION LAYER

SEMICONDUCTOR STRUCTURE WITH PULL-IN PLANARIZATION LAYER AND METHOD...

CHIP PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

PACKAGE STRUCTURE

BUMP INTEGRATION WITH REDISTRIBUTION LAYER

Seal Ring Structure with Zigzag Patterns and Method Forming Same

SEMICONDUCTOR PACKAGE STRUCTURE

CHIP PACKAGE HAVING MULTIPLE CHIPS

METHOD FOR ION IMPLANTATION THAT ADJUSTS A TARGET'S TILT ANGLE BASE...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE

Heterogeneous Antenna in Fan-Out Package

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE

Semiconductor Device and Method

PACKAGE STRUCTURE WITH CAVITY SUBSTRATE

METHOD OF MAKING SEMICONDUCTOR DEVICE HAVING REDUCED BUMP HEIGHT VA...

PACKAGE COMPONENT WITH STEPPED PASSIVATION LAYER

CASTER WITH A BREAKING UNIT

CHIP PACKAGE WITH FAN-OUT FEATURE AND METHOD FOR FORMING THE SAME

InFO-POP Structures with TIVs Having Cavities

KEYSWITCH AND KEYBOARD THEREOF

MEMORY DEVICE AND MANUFACTURING METHOD THEREOF

Fan-Out Package with Cavity Substrate

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE