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Kaohsiung, TW
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Patents Grants
last 30 patents
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Patent Grant
Semiconductor device package and a method of manufacturing the same
Patent number
11,837,557
Issue date
Dec 5, 2023
Advanced Semiconductor Engineering, Inc.
Peng Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device package and a method of manufacturing the same
Patent number
11,189,576
Issue date
Nov 30, 2021
Advanced Semiconductor Engineering, Inc.
Peng Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Molding for large panel fan-out package
Patent number
10,453,764
Issue date
Oct 22, 2019
Advanced Semiconductor Engineering, Inc.
Shao-An Chen
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
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Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND A METHOD OF MANUFACTURING THE SAME
Publication number
20240128206
Publication date
Apr 18, 2024
Advanced Semiconductor Engineering, Inc.
Peng YANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND A METHOD OF MANUFACTURING THE SAME
Publication number
20220084958
Publication date
Mar 17, 2022
Advanced Semiconductor Engineering, Inc.
Peng YANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND A METHOD OF MANUFACTURING THE SAME
Publication number
20180061776
Publication date
Mar 1, 2018
Advanced Semiconductor Engineering, Inc.
Peng YANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MOLDING FOR LARGE PANEL FAN-OUT PACKAGE
Publication number
20180047651
Publication date
Feb 15, 2018
Advanced Semiconductor Engineering, Inc.
Shao-An CHEN
H01 - BASIC ELECTRIC ELEMENTS