Po-Wen CHUANG

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Jhubei City, TW

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Patents Grantslast 30 patents

Information Patent Grant
Die stacking method
- Patent number 10,083,950
- Issue date Sep 25, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd
- Larry Jann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die stacking apparatus and method
- Patent number 9,536,814
- Issue date Jan 3, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd
- Larry Jann
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DIE STACKING METHOD
- Publication number 20170098639
- Publication date Apr 6, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Larry JANN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE STACKING APPARATUS AND METHOD
- Publication number 20150243630
- Publication date Aug 27, 2015
- Taiwan Semiconductor Manufacturing Co., LTD
- Larry JANN
- H01 - BASIC ELECTRIC ELEMENTS