Po Yuan CHIANG

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Shanghai, CN

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Patents Grantslast 30 patents

Information Patent Grant
Fabrication method of packaging structure
- Patent number 10,950,525
- Issue date Mar 16, 2021
- Semiconductor Manufacturing International (Shanghai) Corporation
- Li Zhong Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging structure and fabrication method thereof
- Patent number 10,446,474
- Issue date Oct 15, 2019
- Semiconductor Manufacturing International (Shanghai) Corporation
- Li Zhong Jin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FABRICATION METHOD OF PACKAGING STRUCTURE
- Publication number 20190393134
- Publication date Dec 26, 2019
- Semiconductor Manufacturing International (Shanghai) Corporation
- Li Zhong JIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER DICING METHOD
- Publication number 20190181045
- Publication date Jun 13, 2019
- Semiconductor Manufacturing International (Beijing) Corporation
- Lihui Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP, AND FABRICATION AND PACKAGING METHODS THEREOF
- Publication number 20180337143
- Publication date Nov 22, 2018
- Semiconductor Manufacturing International (Shanghai) Corporation
- Li Hui LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20180182690
- Publication date Jun 28, 2018
- Semiconductor Manufacturing International (Shanghai) Corporation
- Li Zhong JIN
- H01 - BASIC ELECTRIC ELEMENTS