PO-YUAN TENG

Person

HSINCHU CITY, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device, circuit board structure and manufacturing met...
- Patent number 12,205,923
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tin-Hao Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method of semiconductor pac...
- Patent number 12,166,015
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Kang Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packages with thick RDLs and thin RDLs stacked alternatingly
- Patent number 12,057,405
- Issue date Aug 6, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Po-Yuan Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method of package structure the...
- Patent number 12,051,666
- Issue date Jul 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Yuan Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure including a silicon substrate interposer and...
- Patent number 12,014,976
- Issue date Jun 18, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Kuo Lung Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of manufacturing the same
- Patent number 12,009,281
- Issue date Jun 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shih-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packages having support rings
- Patent number 11,990,381
- Issue date May 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Rong Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 11,848,233
- Issue date Dec 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Yuan Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including heat dissipation structure and fabri...
- Patent number 11,694,943
- Issue date Jul 4, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Yuan Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method of semiconductor pac...
- Patent number 11,646,296
- Issue date May 9, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Kang Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure including a silicon substrate interposer and...
- Patent number 11,646,255
- Issue date May 9, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Kuo Lung Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, circuit board structure and manufacturing met...
- Patent number 11,569,202
- Issue date Jan 31, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tin-Hao Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 11,508,671
- Issue date Nov 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Yuan Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packages with thick RDLs and thin RDLs stacked alternatingly
- Patent number 11,508,665
- Issue date Nov 22, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Po-Yuan Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method
- Patent number 11,502,013
- Issue date Nov 15, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Rong Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method of package structure the...
- Patent number 11,355,466
- Issue date Jun 7, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Yuan Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 11,289,373
- Issue date Mar 29, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Yuan Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a heat dissipation structure connected...
- Patent number 11,282,791
- Issue date Mar 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Yuan Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of manufacturing the same
- Patent number 11,239,135
- Issue date Feb 1, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shih-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including heat dissipation structure and fabri...
- Patent number 11,177,192
- Issue date Nov 16, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Yuan Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, circuit board structure and manufacturing met...
- Patent number 11,088,110
- Issue date Aug 10, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tin-Hao Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method of semiconductor pac...
- Patent number 11,004,827
- Issue date May 11, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei Kang Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method
- Patent number 11,004,758
- Issue date May 11, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Rong Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 10,985,115
- Issue date Apr 20, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Yuan Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 10,797,008
- Issue date Oct 6, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Yuan Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 10,734,328
- Issue date Aug 4, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Po-Yuan Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 10,510,686
- Issue date Dec 17, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Po-Yuan Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Graphene manufacturing method
- Patent number 10,060,029
- Issue date Aug 28, 2018
- National Tsing Hua University
- Po-Yuan Teng
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Layer by layer removal of graphene layers
- Patent number 9,183,971
- Issue date Nov 10, 2015
- National Tsing Hua University
- Wan-Chen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemical vapor deposition of graphene on dielectrics
- Patent number 8,871,302
- Issue date Oct 28, 2014
- National Tsing Hua University
- Po-Yuan Teng
- B82 - NANO-TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
PACKAGES WITH THICK RDLS AND THIN RDLS STACKED ALTERNATINGLY
- Publication number 20240355754
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Yuan Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF PACKAGE STRUCTURE AND PACKAGE STRUCTURE THE...
- Publication number 20240339427
- Publication date Oct 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Yuan Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME
- Publication number 20240304531
- Publication date Sep 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- RUI-WEN SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE INCLUDING A SILICON SUBSTRATE INTERPOSER AND...
- Publication number 20240290703
- Publication date Aug 29, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Kuo-Lung Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D Stacking Structure and Method of Fabricating the Same
- Publication number 20240282686
- Publication date Aug 22, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tzuan-Horng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING MARK, PACKAGING METHOD OF SEMICONDUCTOR DEVICE,...
- Publication number 20240178152
- Publication date May 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Wei CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Package and Method
- Publication number 20240113071
- Publication date Apr 4, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Shi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240063075
- Publication date Feb 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Pavithra Sriram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Alignment Mark Design for Wafer-Level Testing and Method Forming th...
- Publication number 20240019486
- Publication date Jan 18, 2024
- Taiwan Semiconductor Mamufacturing Co., Ltd.
- Cheng-Chieh Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE INCLUDING A SILICON SUBSTRATE INTERPOSER AND...
- Publication number 20230253300
- Publication date Aug 10, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Kuo Lung Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF SEMICONDUCTOR PAC...
- Publication number 20230223382
- Publication date Jul 13, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Kang Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, CIRCUIT BOARD STRUCTURE AND MANUFACTURING MET...
- Publication number 20230120191
- Publication date Apr 20, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tin-Hao Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Packages Having Support Rings
- Publication number 20230103560
- Publication date Apr 6, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Rong Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20220415737
- Publication date Dec 29, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Chieh Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packages with Thick RDLs and Thin RDLs Stacked Alternatingly
- Publication number 20220359403
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Co, LTD.
- Po-Yuan Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE INCLUDING A SILICON SUBSTRATE INTERPOSER AND...
- Publication number 20220302003
- Publication date Sep 22, 2022
- Taiwan Semiconductor Manufacturing Company Limited
- Kuo Lung PAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD OF PACKAGE STRUCTURE THE...
- Publication number 20220262758
- Publication date Aug 18, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Yuan Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20220216103
- Publication date Jul 7, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Yuan Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING A HEAT DISSIPATION STRUCTURE CONNECTED...
- Publication number 20220208680
- Publication date Jun 30, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Yuan Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD MANUFACTURING THE SAME
- Publication number 20220157689
- Publication date May 19, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING HEAT DISSIPATION STRUCTURE AND FABRI...
- Publication number 20220077024
- Publication date Mar 10, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Yuan Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packages with Thick RDLs and Thin RDLs Stacked Alternatingly
- Publication number 20210398905
- Publication date Dec 23, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Yuan Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, CIRCUIT BOARD STRUCTURE AND MANUFACTURING MET...
- Publication number 20210366872
- Publication date Nov 25, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tin-Hao Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDCUTOR PACKAGE AND MANUFACTURING METHOD OF SEMICONDCUTOR PAC...
- Publication number 20210305212
- Publication date Sep 30, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Kang Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Package and Method
- Publication number 20210265228
- Publication date Aug 26, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Rong Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD OF PACKAGE STRUCTURE THE...
- Publication number 20210242159
- Publication date Aug 5, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Yuan Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210020538
- Publication date Jan 21, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shih-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20200411439
- Publication date Dec 31, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Yuan Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20200402927
- Publication date Dec 24, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Yuan Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Package and Method
- Publication number 20200395257
- Publication date Dec 17, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Rong Chun
- H01 - BASIC ELECTRIC ELEMENTS

PO-YUAN TENG

Person

Patents Grantslast 30 patents

Semiconductor device, circuit board structure and manufacturing met...

Semiconductor package and manufacturing method of semiconductor pac...

Packages with thick RDLs and thin RDLs stacked alternatingly

Package structure and manufacturing method of package structure the...

Chip package structure including a silicon substrate interposer and...

Package structure and method of manufacturing the same

Integrated circuit packages having support rings

Semiconductor package and manufacturing method thereof

Semiconductor device including heat dissipation structure and fabri...

Semiconductor package and manufacturing method of semiconductor pac...

Chip package structure including a silicon substrate interposer and...

Semiconductor device, circuit board structure and manufacturing met...

Semiconductor package and manufacturing method thereof

Packages with thick RDLs and thin RDLs stacked alternatingly

Integrated circuit package and method

Package structure and manufacturing method of package structure the...

Semiconductor package and manufacturing method thereof

Semiconductor device having a heat dissipation structure connected...

Package structure and method of manufacturing the same

Semiconductor device including heat dissipation structure and fabri...

Semiconductor device, circuit board structure and manufacturing met...

Semiconductor package and manufacturing method of semiconductor pac...

Integrated circuit package and method

Semiconductor package and manufacturing method thereof

Semiconductor package and manufacturing method thereof

Semiconductor package and manufacturing method thereof

Semiconductor package and manufacturing method thereof

Graphene manufacturing method

Layer by layer removal of graphene layers

Chemical vapor deposition of graphene on dielectrics

Patents Applicationslast 30 patents

PACKAGES WITH THICK RDLS AND THIN RDLS STACKED ALTERNATINGLY

MANUFACTURING METHOD OF PACKAGE STRUCTURE AND PACKAGE STRUCTURE THE...

SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME

CHIP PACKAGE STRUCTURE INCLUDING A SILICON SUBSTRATE INTERPOSER AND...

3D Stacking Structure and Method of Fabricating the Same

METHOD FOR FORMING MARK, PACKAGING METHOD OF SEMICONDUCTOR DEVICE,...

Integrated Circuit Package and Method

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Alignment Mark Design for Wafer-Level Testing and Method Forming th...

CHIP PACKAGE STRUCTURE INCLUDING A SILICON SUBSTRATE INTERPOSER AND...

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF SEMICONDUCTOR PAC...

SEMICONDUCTOR DEVICE, CIRCUIT BOARD STRUCTURE AND MANUFACTURING MET...

Integrated Circuit Packages Having Support Rings

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Packages with Thick RDLs and Thin RDLs Stacked Alternatingly

CHIP PACKAGE STRUCTURE INCLUDING A SILICON SUBSTRATE INTERPOSER AND...

PACKAGE STRUCTURE AND MANUFACTURING METHOD OF PACKAGE STRUCTURE THE...

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE HAVING A HEAT DISSIPATION STRUCTURE CONNECTED...

PACKAGE STRUCTURE AND METHOD MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE INCLUDING HEAT DISSIPATION STRUCTURE AND FABRI...

Packages with Thick RDLs and Thin RDLs Stacked Alternatingly

SEMICONDUCTOR DEVICE, CIRCUIT BOARD STRUCTURE AND MANUFACTURING MET...

SEMICONDCUTOR PACKAGE AND MANUFACTURING METHOD OF SEMICONDCUTOR PAC...

Integrated Circuit Package and Method

PACKAGE STRUCTURE AND MANUFACTURING METHOD OF PACKAGE STRUCTURE THE...

PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

Integrated Circuit Package and Method