Poh Boon Khoo

Person

PERAI, MY

People

Patents Grantslast 30 patents

Information Patent Grant
Stripped redistrubution-layer fabrication for package-top embedded...
- Patent number 11,908,793
- Issue date Feb 20, 2024
- Intel Corporation
- Jiun Hann Sir
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Organic mold interconnects in shielded interconnects frames for int...
- Patent number 11,699,644
- Issue date Jul 11, 2023
- Intel Corporation
- Jiun Hann Sir
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stripped redistrubution-layer fabrication for package-top embedded...
- Patent number 11,658,111
- Issue date May 23, 2023
- Intel Corporation
- Jiun Hann Sir
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Top-to-bottom interconnects with molded lead-frame module for integ...
- Patent number 11,322,434
- Issue date May 3, 2022
- Intel Corporation
- Jiun Hann Sir
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Organic mold interconnects in shielded interconnects frames for int...
- Patent number 11,205,613
- Issue date Dec 21, 2021
- Intel Corporation
- Jiun Hann Sir
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stripped redistrubution-layer fabrication for package-top embedded...
- Patent number 10,998,262
- Issue date May 4, 2021
- Intel Corporation
- Jiun Hann Sir
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
TECHNOLOGIES FOR AN ELECTROMAGNETIC INTERFERENCE SHIELD
- Publication number 20250113428
- Publication date Apr 3, 2025
- Intel Corporation
- Min Suet Lim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS AND APPARATUS TO MANAGE NOISE FOR TIMING CIRCUITRY
- Publication number 20250107003
- Publication date Mar 27, 2025
- Intel Corporation
- Chin Mian Choong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package Substrates with Stiffener Interposers
- Publication number 20250096154
- Publication date Mar 20, 2025
- Intel Corporation
- Chin Mian CHOONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROSTRIP ROUTING ON EMBEDDED HIGH-K DIELECTRIC
- Publication number 20250006666
- Publication date Jan 2, 2025
- Intel Corporation
- Jiun Hann SIR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PASSIVE COOLING HEAT SPREADER WITH PHASE CHANGE MATERIAL INFUSED MESH
- Publication number 20250006588
- Publication date Jan 2, 2025
- Intel Corporation
- Jiun Hann SIR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REVERSED OVERHANG MEMORY ON PACKAGE (MOP) ARCHITECTURE
- Publication number 20240355792
- Publication date Oct 24, 2024
- Intel Corporation
- Poh Boon Khoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW-PROFILE MEMORY APPARATUS COMPATIBLE WITH SYSTEM THERMAL SOLUTIO...
- Publication number 20240290680
- Publication date Aug 29, 2024
- Intel Corporation
- Jiun Hann SIR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER POWER CORRIDOR
- Publication number 20240145394
- Publication date May 2, 2024
- Intel Corporation
- Poh Boon KHOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRIPPED REDISTRUBUTION-LAYER FABRICATION FOR PACKAGE-TOP EMBEDDED...
- Publication number 20240136278
- Publication date Apr 25, 2024
- Intel Corporation
- Jiun Hann Sir
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DYNAMIC RANDOM-ACCESS MEMORY IN A MOLDING BENEATH A DIE
- Publication number 20240113033
- Publication date Apr 4, 2024
- Intel Corporation
- Eng Huat GOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTOR TO ELECTRICALLY COUPLE MULTIPLE SUBSTRATES
- Publication number 20240106139
- Publication date Mar 28, 2024
- Intel Corporation
- Jiun Hann SIR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH STIFFENER BASKET PORTION
- Publication number 20240071948
- Publication date Feb 29, 2024
- Intel Corporation
- Jiun Hann SIR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHIELDING ASSEMBLY FOR SEMICONDUCTOR PACKAGES
- Publication number 20240006338
- Publication date Jan 4, 2024
- Intel Corporation
- Poh Boon KHOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE BOTTOM SIDE THERMAL SOLUTION WITH DISCRETE HAT-SHAPED COPPE...
- Publication number 20230397323
- Publication date Dec 7, 2023
- Intel Corporation
- Min Suet LIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED INTERCONNECT MEMORY ON PACKAGE
- Publication number 20230369232
- Publication date Nov 16, 2023
- Intel Corporation
- Hazwani Jaffar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS TO REDUCE THICKNESS OF ON-PACKAGE MEMORY ARCH...
- Publication number 20230178502
- Publication date Jun 8, 2023
- Intel Corporation
- Eng Huat Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES WITH ON PACKAGE MEMORY ARCHITECTURES
- Publication number 20230091395
- Publication date Mar 23, 2023
- Intel Corporation
- Eng Huat Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRIPPED REDISTRUBUTION-LAYER FABRICATION FOR PACKAGE-TOP EMBEDDED...
- Publication number 20220230958
- Publication date Jul 21, 2022
- Intel Corporation
- Jiun Hann Sir
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ORGANIC MOLD INTERCONNECTS IN SHIELDED INTERCONNECTS FRAMES FOR INT...
- Publication number 20220077047
- Publication date Mar 10, 2022
- Intel Corporation
- Jiun Hann Sir
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRIPPED REDISTRUBUTION-LAYER FABRICATION FOR PACKAGE-TOP EMBEDDED...
- Publication number 20210202380
- Publication date Jul 1, 2021
- Intel Corporation
- Jiun Hann Sir
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ORGANIC MOLD INTERCONNECTS IN SHIELDED INTERCONNECTS FRAMES FOR INT...
- Publication number 20210098352
- Publication date Apr 1, 2021
- Jiun Hann Sir
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TOP-TO-BOTTOM INTERCONNECTS WITH MOLDED LEAD-FRAME MODULE FOR INTEG...
- Publication number 20210057318
- Publication date Feb 25, 2021
- Jiun Hann Sir
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRIPPED REDISTRUBUTION-LAYER FABRICATION FOR PACKAGE-TOP EMBEDDED...
- Publication number 20200328151
- Publication date Oct 15, 2020
- Intel Corporation
- Jiun Hann Sir
- H01 - BASIC ELECTRIC ELEMENTS

Poh Boon Khoo

Person

Patents Grantslast 30 patents

Stripped redistrubution-layer fabrication for package-top embedded...

Organic mold interconnects in shielded interconnects frames for int...

Stripped redistrubution-layer fabrication for package-top embedded...

Top-to-bottom interconnects with molded lead-frame module for integ...

Organic mold interconnects in shielded interconnects frames for int...

Stripped redistrubution-layer fabrication for package-top embedded...

Patents Applicationslast 30 patents

TECHNOLOGIES FOR AN ELECTROMAGNETIC INTERFERENCE SHIELD

METHODS AND APPARATUS TO MANAGE NOISE FOR TIMING CIRCUITRY

Package Substrates with Stiffener Interposers

MICROSTRIP ROUTING ON EMBEDDED HIGH-K DIELECTRIC

PASSIVE COOLING HEAT SPREADER WITH PHASE CHANGE MATERIAL INFUSED MESH

REVERSED OVERHANG MEMORY ON PACKAGE (MOP) ARCHITECTURE

LOW-PROFILE MEMORY APPARATUS COMPATIBLE WITH SYSTEM THERMAL SOLUTIO...

INTERPOSER POWER CORRIDOR

STRIPPED REDISTRUBUTION-LAYER FABRICATION FOR PACKAGE-TOP EMBEDDED...

DYNAMIC RANDOM-ACCESS MEMORY IN A MOLDING BENEATH A DIE

CONNECTOR TO ELECTRICALLY COUPLE MULTIPLE SUBSTRATES

SEMICONDUCTOR PACKAGE WITH STIFFENER BASKET PORTION

SHIELDING ASSEMBLY FOR SEMICONDUCTOR PACKAGES

PACKAGE BOTTOM SIDE THERMAL SOLUTION WITH DISCRETE HAT-SHAPED COPPE...

MOLDED INTERCONNECT MEMORY ON PACKAGE

METHODS AND APPARATUS TO REDUCE THICKNESS OF ON-PACKAGE MEMORY ARCH...

INTEGRATED CIRCUIT PACKAGES WITH ON PACKAGE MEMORY ARCHITECTURES

STRIPPED REDISTRUBUTION-LAYER FABRICATION FOR PACKAGE-TOP EMBEDDED...

ORGANIC MOLD INTERCONNECTS IN SHIELDED INTERCONNECTS FRAMES FOR INT...

STRIPPED REDISTRUBUTION-LAYER FABRICATION FOR PACKAGE-TOP EMBEDDED...

ORGANIC MOLD INTERCONNECTS IN SHIELDED INTERCONNECTS FRAMES FOR INT...

TOP-TO-BOTTOM INTERCONNECTS WITH MOLDED LEAD-FRAME MODULE FOR INTEG...

STRIPPED REDISTRUBUTION-LAYER FABRICATION FOR PACKAGE-TOP EMBEDDED...