Poh Boon Khoo

Person

PERAI, MY

People

Patents Grantslast 30 patents

Information Patent Grant
Stripped redistrubution-layer fabrication for package-top embedded...
- Patent number 11,908,793
- Issue date Feb 20, 2024
- Intel Corporation
- Jiun Hann Sir
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Organic mold interconnects in shielded interconnects frames for int...
- Patent number 11,699,644
- Issue date Jul 11, 2023
- Intel Corporation
- Jiun Hann Sir
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stripped redistrubution-layer fabrication for package-top embedded...
- Patent number 11,658,111
- Issue date May 23, 2023
- Intel Corporation
- Jiun Hann Sir
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Top-to-bottom interconnects with molded lead-frame module for integ...
- Patent number 11,322,434
- Issue date May 3, 2022
- Intel Corporation
- Jiun Hann Sir
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Organic mold interconnects in shielded interconnects frames for int...
- Patent number 11,205,613
- Issue date Dec 21, 2021
- Intel Corporation
- Jiun Hann Sir
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stripped redistrubution-layer fabrication for package-top embedded...
- Patent number 10,998,262
- Issue date May 4, 2021
- Intel Corporation
- Jiun Hann Sir
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTERPOSER POWER CORRIDOR
- Publication number 20240145394
- Publication date May 2, 2024
- Intel Corporation
- Poh Boon KHOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRIPPED REDISTRUBUTION-LAYER FABRICATION FOR PACKAGE-TOP EMBEDDED...
- Publication number 20240136278
- Publication date Apr 25, 2024
- Intel Corporation
- Jiun Hann Sir
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DYNAMIC RANDOM-ACCESS MEMORY IN A MOLDING BENEATH A DIE
- Publication number 20240113033
- Publication date Apr 4, 2024
- Intel Corporation
- Eng Huat GOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTOR TO ELECTRICALLY COUPLE MULTIPLE SUBSTRATES
- Publication number 20240106139
- Publication date Mar 28, 2024
- Intel Corporation
- Jiun Hann SIR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH STIFFENER BASKET PORTION
- Publication number 20240071948
- Publication date Feb 29, 2024
- Intel Corporation
- Jiun Hann SIR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHIELDING ASSEMBLY FOR SEMICONDUCTOR PACKAGES
- Publication number 20240006338
- Publication date Jan 4, 2024
- Intel Corporation
- Poh Boon KHOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE BOTTOM SIDE THERMAL SOLUTION WITH DISCRETE HAT-SHAPED COPPE...
- Publication number 20230397323
- Publication date Dec 7, 2023
- Intel Corporation
- Min Suet LIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED INTERCONNECT MEMORY ON PACKAGE
- Publication number 20230369232
- Publication date Nov 16, 2023
- Intel Corporation
- Hazwani Jaffar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS TO REDUCE THICKNESS OF ON-PACKAGE MEMORY ARCH...
- Publication number 20230178502
- Publication date Jun 8, 2023
- Intel Corporation
- Eng Huat Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES WITH ON PACKAGE MEMORY ARCHITECTURES
- Publication number 20230091395
- Publication date Mar 23, 2023
- Intel Corporation
- Eng Huat Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRIPPED REDISTRUBUTION-LAYER FABRICATION FOR PACKAGE-TOP EMBEDDED...
- Publication number 20220230958
- Publication date Jul 21, 2022
- Intel Corporation
- Jiun Hann Sir
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ORGANIC MOLD INTERCONNECTS IN SHIELDED INTERCONNECTS FRAMES FOR INT...
- Publication number 20220077047
- Publication date Mar 10, 2022
- Intel Corporation
- Jiun Hann Sir
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRIPPED REDISTRUBUTION-LAYER FABRICATION FOR PACKAGE-TOP EMBEDDED...
- Publication number 20210202380
- Publication date Jul 1, 2021
- Intel Corporation
- Jiun Hann Sir
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ORGANIC MOLD INTERCONNECTS IN SHIELDED INTERCONNECTS FRAMES FOR INT...
- Publication number 20210098352
- Publication date Apr 1, 2021
- Jiun Hann Sir
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TOP-TO-BOTTOM INTERCONNECTS WITH MOLDED LEAD-FRAME MODULE FOR INTEG...
- Publication number 20210057318
- Publication date Feb 25, 2021
- Jiun Hann Sir
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRIPPED REDISTRUBUTION-LAYER FABRICATION FOR PACKAGE-TOP EMBEDDED...
- Publication number 20200328151
- Publication date Oct 15, 2020
- Intel Corporation
- Jiun Hann Sir
- H01 - BASIC ELECTRIC ELEMENTS

Poh Boon Khoo

Person

Patents Grantslast 30 patents

Stripped redistrubution-layer fabrication for package-top embedded...

Organic mold interconnects in shielded interconnects frames for int...

Stripped redistrubution-layer fabrication for package-top embedded...

Top-to-bottom interconnects with molded lead-frame module for integ...

Organic mold interconnects in shielded interconnects frames for int...

Stripped redistrubution-layer fabrication for package-top embedded...

Patents Applicationslast 30 patents

INTERPOSER POWER CORRIDOR

STRIPPED REDISTRUBUTION-LAYER FABRICATION FOR PACKAGE-TOP EMBEDDED...

DYNAMIC RANDOM-ACCESS MEMORY IN A MOLDING BENEATH A DIE

CONNECTOR TO ELECTRICALLY COUPLE MULTIPLE SUBSTRATES

SEMICONDUCTOR PACKAGE WITH STIFFENER BASKET PORTION

SHIELDING ASSEMBLY FOR SEMICONDUCTOR PACKAGES

PACKAGE BOTTOM SIDE THERMAL SOLUTION WITH DISCRETE HAT-SHAPED COPPE...

MOLDED INTERCONNECT MEMORY ON PACKAGE

METHODS AND APPARATUS TO REDUCE THICKNESS OF ON-PACKAGE MEMORY ARCH...

INTEGRATED CIRCUIT PACKAGES WITH ON PACKAGE MEMORY ARCHITECTURES

STRIPPED REDISTRUBUTION-LAYER FABRICATION FOR PACKAGE-TOP EMBEDDED...

ORGANIC MOLD INTERCONNECTS IN SHIELDED INTERCONNECTS FRAMES FOR INT...

STRIPPED REDISTRUBUTION-LAYER FABRICATION FOR PACKAGE-TOP EMBEDDED...

ORGANIC MOLD INTERCONNECTS IN SHIELDED INTERCONNECTS FRAMES FOR INT...

TOP-TO-BOTTOM INTERCONNECTS WITH MOLDED LEAD-FRAME MODULE FOR INTEG...

STRIPPED REDISTRUBUTION-LAYER FABRICATION FOR PACKAGE-TOP EMBEDDED...