Poh Leng EU

Person

Petaling Jaya, MY

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device with bond wire reinforcement structure
- Patent number 11,056,457
- Issue date Jul 6, 2021
- NXP USA, INC.
- Boon Yew Low
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC device having patterned, non-conductive substrate
- Patent number 9,646,853
- Issue date May 9, 2017
- FREESCALE SEMICONDUCTOR, INC.
- Kai Yun Yow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with stress relief and heat spreader
- Patent number 9,196,576
- Issue date Nov 24, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Kai Yun Yow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with die attached heat spreader
- Patent number 9,165,855
- Issue date Oct 20, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Kai Yun Yow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mold cap for semiconductor device
- Patent number 9,030,000
- Issue date May 12, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Poh Leng Eu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor sensor device with over-molded lid
- Patent number 8,643,169
- Issue date Feb 4, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Kai Yun Yow
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of assembling pressure sensor device
- Patent number 8,501,517
- Issue date Aug 6, 2013
- FREESCALE SEMICONDUCTOR, INC.
- Kai Yun Yow
- G01 - MEASURING TESTING
Information Patent Grant
Mold and substrate for use with mold
- Patent number 8,198,143
- Issue date Jun 12, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Poh Leng Eu
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Self monitoring braking system for vehicles
- Patent number 8,078,353
- Issue date Dec 13, 2011
- FREESCALE SEMICONDUCTOR, INC.
- Kai Yun Yow
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Solder ball attachment ring and method of use
- Patent number 7,985,672
- Issue date Jul 26, 2011
- FREESCALE SEMICONDUCTOR, INC.
- Poh Leng Eu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mold and substrate for use with mold
- Patent number 7,956,471
- Issue date Jun 7, 2011
- FREESCALE SEMICONDUCTOR, INC.
- Poh Leng Eu
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Semiconductor substrate and method of connecting semiconductor die...
- Patent number 7,868,449
- Issue date Jan 11, 2011
- FREESCALE SEMICONDUCTOR, INC.
- Kai Yun Yow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit die, integrated circuit package, and packaging m...
- Patent number 7,759,753
- Issue date Jul 20, 2010
- FREESCALE SEMICONDUCTOR, INC.
- Poh Leng Eu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE WITH BOND WIRE REINFORCEMMENT STRUCTURE
- Publication number 20200105709
- Publication date Apr 2, 2020
- NXP USA, Inc.
- Boon Yew Low
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC DEVICE HAVING PATTERNED, NON-CONDUCTIVE SUBSTRATE
- Publication number 20170110339
- Publication date Apr 20, 2017
- FREESCALE SEMICONDUCTOR, INC.
- KAI YUN YOW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING METHOD WITH TWO STEP FREE AIR BALL FORMATION
- Publication number 20150235981
- Publication date Aug 20, 2015
- Poh Leng Eu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH STRESS RELIEF AND HEAT SPREADER
- Publication number 20150084169
- Publication date Mar 26, 2015
- Kai Yun Yow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRESSURE SENSOR DEVICE AND ASSEMBLY METHOD
- Publication number 20150054099
- Publication date Feb 26, 2015
- Kai Yun Yow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRESSURE SENSOR HAVING DOWN-SET FLAG
- Publication number 20150014793
- Publication date Jan 15, 2015
- Kai Yun Yow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING METHOD FOR FLEXIBLE SUBSTRATES
- Publication number 20140374151
- Publication date Dec 25, 2014
- Jia Lin Yap
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MOLD CAP FOR SEMICONDUCTOR DEVICE
- Publication number 20140367840
- Publication date Dec 18, 2014
- Poh Leng Eu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING APPARATUS AND METHOD
- Publication number 20140263584
- Publication date Sep 18, 2014
- Jia Lin Yap
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD FOR CLEANING BOND WIRE
- Publication number 20140110461
- Publication date Apr 24, 2014
- Mohd Rusli Ibrahim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR SENSOR DEVICE AND METHOD OF PACKAGING SAME
- Publication number 20130113054
- Publication date May 9, 2013
- FREESCALE SEMICONDUCTOR, INC.
- Kai Yun Yow
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE WITH EXPOSED PAD
- Publication number 20120074549
- Publication date Mar 29, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Kai Yun YOW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLD AND SUBSTRATE FOR USE WITH MOLD
- Publication number 20110244637
- Publication date Oct 6, 2011
- FREESCALE SEMICONDUCTOR, INC.
- Poh Leng Eu
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE WITH INTEGRATED STAND-OFF
- Publication number 20110084375
- Publication date Apr 14, 2011
- FREESCALE SEMICONDUCTOR, INC.
- Poh Leng EU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DIE
- Publication number 20110084411
- Publication date Apr 14, 2011
- FREESCALE SEMICONDUCTOR, INC.
- Poh Leng Eu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH PRE-FORMED BALL BONDS
- Publication number 20110068469
- Publication date Mar 24, 2011
- FREESCALE SEMICONDUCTOR, INC.
- Kai Yun Yow
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SELF MONITORING BRAKING SYSTEM FOR VEHICLES
- Publication number 20110066347
- Publication date Mar 17, 2011
- FREESCALE SEMICONDUCTOR, INC.
- Kai Yun YOW
- B60 - VEHICLES IN GENERAL
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE WITH DOWN-SET LEADS
- Publication number 20110062569
- Publication date Mar 17, 2011
- FREESCALE SEMICONDUCTOR, INC.
- Kai Yun YOW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING TAPE BALL GRID ARRAY PACKAGE
- Publication number 20110059579
- Publication date Mar 10, 2011
- FREESCALE SEMICONDUCTOR, INC.
- Poh Leng Eu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT SPREADER FOR SEMICONDUCTOR PACKAGE
- Publication number 20110012257
- Publication date Jan 20, 2011
- FREESCALE SEMICONDUCTOR, INC.
- Poh Leng EU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR SUBSTRATE AND METHOD OF CONNECTING SEMICONDUCTOR DIE...
- Publication number 20100295169
- Publication date Nov 25, 2010
- FREESCALE SEMICONDUCTOR, INC.
- Kai Yun YOW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLD AND SUBSTRATE FOR USE WITH MOLD
- Publication number 20100117202
- Publication date May 13, 2010
- FREESCALE SEMICONDUCTOR, INC.
- Poh Leng Eu
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
INTEGRATED CIRCUIT DIE, INTEGRATED CIRCUIT PACKAGE, AND PACKAGING M...
- Publication number 20090200562
- Publication date Aug 13, 2009
- Poh Leng Eu
- G02 - OPTICS
Information Patent Application
SOLDER BALL ATTACHMENT RING AND METHOD OF USE
- Publication number 20090134207
- Publication date May 28, 2009
- Poh Leng EU
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Poh Leng EU

Person

Patents Grantslast 30 patents

Semiconductor device with bond wire reinforcement structure

IC device having patterned, non-conductive substrate

Semiconductor package with stress relief and heat spreader

Semiconductor device with die attached heat spreader

Mold cap for semiconductor device

Semiconductor sensor device with over-molded lid

Method of assembling pressure sensor device

Mold and substrate for use with mold

Self monitoring braking system for vehicles

Solder ball attachment ring and method of use

Mold and substrate for use with mold

Semiconductor substrate and method of connecting semiconductor die...

Integrated circuit die, integrated circuit package, and packaging m...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE WITH BOND WIRE REINFORCEMMENT STRUCTURE

IC DEVICE HAVING PATTERNED, NON-CONDUCTIVE SUBSTRATE

WIRE BONDING METHOD WITH TWO STEP FREE AIR BALL FORMATION

SEMICONDUCTOR PACKAGE WITH STRESS RELIEF AND HEAT SPREADER

PRESSURE SENSOR DEVICE AND ASSEMBLY METHOD

PRESSURE SENSOR HAVING DOWN-SET FLAG

WIRE BONDING METHOD FOR FLEXIBLE SUBSTRATES

MOLD CAP FOR SEMICONDUCTOR DEVICE

WIRE BONDING APPARATUS AND METHOD

SYSTEM AND METHOD FOR CLEANING BOND WIRE

SEMICONDUCTOR SENSOR DEVICE AND METHOD OF PACKAGING SAME

SEMICONDUCTOR DEVICE WITH EXPOSED PAD

MOLD AND SUBSTRATE FOR USE WITH MOLD

SEMICONDUCTOR DEVICE PACKAGE WITH INTEGRATED STAND-OFF

SEMICONDUCTOR DIE

SEMICONDUCTOR PACKAGE WITH PRE-FORMED BALL BONDS

SELF MONITORING BRAKING SYSTEM FOR VEHICLES

SEMICONDUCTOR DEVICE PACKAGE WITH DOWN-SET LEADS

METHOD OF FORMING TAPE BALL GRID ARRAY PACKAGE

HEAT SPREADER FOR SEMICONDUCTOR PACKAGE

SEMICONDUCTOR SUBSTRATE AND METHOD OF CONNECTING SEMICONDUCTOR DIE...

MOLD AND SUBSTRATE FOR USE WITH MOLD

INTEGRATED CIRCUIT DIE, INTEGRATED CIRCUIT PACKAGE, AND PACKAGING M...

SOLDER BALL ATTACHMENT RING AND METHOD OF USE