Pompeo Umali

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Hong Kong, CN

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Patents Grantslast 30 patents

Information Patent Grant
Singulation of IC packages
- Patent number 8,809,121
- Issue date Aug 19, 2014
- NXP B.V.
- Martin Ka Shing Li
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SINGULATION OF IC PACKAGES
- Publication number 20130302945
- Publication date Nov 14, 2013
- NXP B.V.
- Martin Ka Shing Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAME AND METHOD FOR PACKAGING SEMICONDUCTOR DIE
- Publication number 20120286399
- Publication date Nov 15, 2012
- NXP B.V.
- Tim BOETTCHER
- H01 - BASIC ELECTRIC ELEMENTS