Pompeo V. UMALI

Person

Kwai Chung, HK

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method of manufacture
- Patent number 11,094,562
- Issue date Aug 17, 2021
- Nexperia B.V.
- Leung Chi Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method with clip arrangement in IC package
- Patent number 10,825,757
- Issue date Nov 3, 2020
- Nexperia B.V.
- Haibo Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 10,658,274
- Issue date May 19, 2020
- Nexperia B.V.
- Tim Boettcher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,529,644
- Issue date Jan 7, 2020
- Nexperia B.V.
- Shun Tik Yeung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level semiconductor device with wettable flanks
- Patent number 10,410,941
- Issue date Sep 10, 2019
- Nexperia B.V.
- Chi Ho Leung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and method of making same
- Patent number 10,304,759
- Issue date May 28, 2019
- Nexperia B.V.
- Kan Wae Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reversible semiconductor die
- Patent number 10,262,926
- Issue date Apr 16, 2019
- Nexperia B.V.
- Kan Wae Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and lead frame therefor
- Patent number 10,256,168
- Issue date Apr 9, 2019
- Nexperia B.V.
- Shun Tik Yeung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of making a semiconductor device
- Patent number 9,947,632
- Issue date Apr 17, 2018
- Nexperia B.V.
- Chi Ho Leung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Built-up lead frame package and method of making thereof
- Patent number 9,640,463
- Issue date May 2, 2017
- Nexperia B.V.
- Kan Wae Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with multiple I/O side-solderable terminals
- Patent number 9,425,130
- Issue date Aug 23, 2016
- NXP B.V.
- Chi Ho Leung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Built-up lead frame QFN and DFN packages and method of making thereof
- Patent number 9,391,007
- Issue date Jul 12, 2016
- NXP B.V.
- Shun Tik Yeung
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC DEVICE
- Publication number 20190189545
- Publication date Jun 20, 2019
- NEXPERIA B.V.
- Tim BOETTCHER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE
- Publication number 20190189468
- Publication date Jun 20, 2019
- NEXPERIA B.V.
- Leung CHI HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD WITH CLIP ARRANGEMENT IN IC PACKAGE
- Publication number 20180174951
- Publication date Jun 21, 2018
- Nexperia B.V.
- Haibo Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAME-LESS SURFACE MOUNT SEMICONDUCTOR DEVICE
- Publication number 20180102287
- Publication date Apr 12, 2018
- Nexperia B.V.
- EUGENE PUMANES SANTOS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REVERSIBLE SEMICONDUCTOR DIE
- Publication number 20180096916
- Publication date Apr 5, 2018
- Kan Wae Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL SEMICONDUCTOR DEVICE WITH WETTABLE FLANKS
- Publication number 20180068920
- Publication date Mar 8, 2018
- Nexperia B.V.
- Chi Ho Leung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND LEAD FRAME THEREFOR
- Publication number 20170358514
- Publication date Dec 14, 2017
- Nexperia B.V.
- Shun Tik Yeung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREFOR
- Publication number 20170170103
- Publication date Jun 15, 2017
- Nexperia B.V.
- SHUN TIK YEUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MAKING A SEMICONDUCTOR DEVICE
- Publication number 20170133335
- Publication date May 11, 2017
- NXP B.V.
- Chi Ho Leung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND METHOD OF MAKING SAME
- Publication number 20170053855
- Publication date Feb 23, 2017
- NXP B.V.
- KAN WAE LAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUILT-UP LEAD FRAME PACKAGE AND METHOD OF MAKING THEREOF
- Publication number 20160372403
- Publication date Dec 22, 2016
- NXP B.V.
- Kan Wae Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20160260651
- Publication date Sep 8, 2016
- NXP B.V.
- Shun Tik YEUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH MULTIPLE I/O SIDE-SOLDERABLE TERMINALS
- Publication number 20160126162
- Publication date May 5, 2016
- NXP B.V.
- Chi Ho Leung
- H01 - BASIC ELECTRIC ELEMENTS

Pompeo V. UMALI

Person

Patents Grantslast 30 patents

Semiconductor device and method of manufacture

Semiconductor device and method with clip arrangement in IC package

Electronic device

Semiconductor device

Wafer level semiconductor device with wettable flanks

Electronic device and method of making same

Reversible semiconductor die

Semiconductor device and lead frame therefor

Semiconductor device and method of making a semiconductor device

Built-up lead frame package and method of making thereof

Package with multiple I/O side-solderable terminals

Built-up lead frame QFN and DFN packages and method of making thereof

Patents Applicationslast 30 patents

ELECTRONIC DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE

SEMICONDUCTOR DEVICE AND METHOD WITH CLIP ARRANGEMENT IN IC PACKAGE

LEADFRAME-LESS SURFACE MOUNT SEMICONDUCTOR DEVICE

REVERSIBLE SEMICONDUCTOR DIE

WAFER LEVEL SEMICONDUCTOR DEVICE WITH WETTABLE FLANKS

SEMICONDUCTOR DEVICE AND LEAD FRAME THEREFOR

ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREFOR

SEMICONDUCTOR DEVICE AND METHOD OF MAKING A SEMICONDUCTOR DEVICE

ELECTRONIC DEVICE AND METHOD OF MAKING SAME

BUILT-UP LEAD FRAME PACKAGE AND METHOD OF MAKING THEREOF

SEMICONDUCTOR DEVICE

PACKAGE WITH MULTIPLE I/O SIDE-SOLDERABLE TERMINALS