Pooja Chilukuri

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Morrisville, NC, US

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Patents Grantslast 30 patents

Information Patent Grant
Solder structures including barrier layers with nickel and/or copper
- Patent number 7,839,000
- Issue date Nov 23, 2010
- Unitive International Limited
- J. Daniel Mis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming lead free solder bumps
- Patent number 7,547,623
- Issue date Jun 16, 2009
- Unitive International Limited
- J. Daniel Mis
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Solder Structures Including Barrier Layers with Nickel and/or Copper
- Publication number 20090212427
- Publication date Aug 27, 2009
- UNITIVE INTERNATIONAL LIMITED
- J. Daniel Mis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of forming lead free solder bumps and related structures
- Publication number 20060030139
- Publication date Feb 9, 2006
- J. Daniel Mis
- H01 - BASIC ELECTRIC ELEMENTS