Prabhakar Subrahmanyam

Person

San Jose, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Self cooling adaptive flow branching heat exchanger system for cool...
- Patent number 12,213,288
- Issue date Jan 28, 2025
- Intel Corporation
- Prabhakar Subrahmanyam
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Optical leak detection of liquid cooling components within an elect...
- Patent number 12,169,180
- Issue date Dec 17, 2024
- Intel Corporation
- Prabhakar Subrahmanyam
- G01 - MEASURING TESTING
Information Patent Grant
Thermal control for processor-based devices
- Patent number 11,917,790
- Issue date Feb 27, 2024
- Intel Corporation
- Prabhakar Subrahmanyam
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Jet vectoring fluid impingement cooling using pivoting nozzles
- Patent number 11,439,037
- Issue date Sep 6, 2022
- Intel Corporation
- Prabhakar Subrahmanyam
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Reconfigurable thermal control of high-powered integrated circuitry
- Patent number 10,973,154
- Issue date Apr 6, 2021
- Intel Corporation
- Tong W. Chao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reconfigurable cooling assembly for integrated circuitry
- Patent number 10,930,575
- Issue date Feb 23, 2021
- Intel Corporation
- Prabhakar Subrahmanyam
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHODS AND APPARATUS TO IMPROVE THERMAL DISSIPATION AND MECHANICAL...
- Publication number 20250014967
- Publication date Jan 9, 2025
- Intel Corporation
- Kyle Jordan Arrington
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTIMIZED AND AUTOMATED DYNAMIC THERMAL REGULATION METHOD AND APPAR...
- Publication number 20240365513
- Publication date Oct 31, 2024
- Intel Corporation
- Prabhakar SUBRAHMANYAM
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHODS AND APPARATUS TO MITIGATE HOTSPOTS IN INTEGRATED CIRCUIT PA...
- Publication number 20240276675
- Publication date Aug 15, 2024
- Intel Corporation
- Prabhakar Subrahmanyam
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
HYBRID COOLER TO THERMALLY COOL SEMICONDUCTOR DEVICES INSIDE AND OU...
- Publication number 20240244800
- Publication date Jul 18, 2024
- Intel Corporation
- Prabhakar SUBRAHMANYAM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MITIGATION OF SEISMIC EVENT EFFECTS ON LIQUID IMMERSION COOLING SYS...
- Publication number 20240240688
- Publication date Jul 18, 2024
- Phil Geng
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Application
POWER BUDGETING FOR COMPUTER PERIPHERALS
- Publication number 20240126354
- Publication date Apr 18, 2024
- Intel Corporation
- Kunal Shah
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO MONITOR...
- Publication number 20240029539
- Publication date Jan 25, 2024
- Intel Corporation
- Prabhakar Subrahmanyam
- G08 - SIGNALLING
Information Patent Application
TECHNOLOGIES FOR ISOLATED HEAT DISSIPATING DEVICES
- Publication number 20230420338
- Publication date Dec 28, 2023
- Intel Corporation
- Prabhakar SUBRAHMANYAM
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
COLD PLATES FOR SECONDARY SIDE COMPONENTS OF PRINTED CIRCUIT BOARDS
- Publication number 20230422389
- Publication date Dec 28, 2023
- Intel Corporation
- Prabhakar Subrahmanyam
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPACT REAR MOUNTED HEAT EXCHANGERS AND RELATED METHODS
- Publication number 20230345677
- Publication date Oct 26, 2023
- Intel Corporation
- Shaorong Zhou
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
DIRECTLY IMPINGING PRESSURE MODULATED SPRAY COOLING AND METHODS OF...
- Publication number 20230260870
- Publication date Aug 17, 2023
- Intel Corporation
- Prabhakar SUBRAHMANYAM
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
METHODS AND APPARATUS FOR AN AUTONOMOUS STAGE-SWITCHING MULTI-STAGE...
- Publication number 20230025369
- Publication date Jan 26, 2023
- Prabhakar Subrahmanyam
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
FIELD REPLACEABLE FAN ASSEMBLIES FOR PERIPHERAL PROCESSING UNITS AN...
- Publication number 20230016098
- Publication date Jan 19, 2023
- Intel Corporation
- Navneeth Jayaraj
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
THIN FORM FACTOR ASSEMBLIES FOR COOLING DIMMS
- Publication number 20220225542
- Publication date Jul 14, 2022
- Intel Corporation
- Prabhakar SUBRAHMANYAM
- G11 - INFORMATION STORAGE
Information Patent Application
LOCKING TENSIONER COOLING ASSEMBLY FOR PLUGGABLE ELECTRONIC COMPONENT
- Publication number 20220210906
- Publication date Jun 30, 2022
- Intel Corporation
- Prabhakar SUBRAHMANYAM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIQUID COOLING SYSTEM LEAK DETECTION IMPROVEMENTS
- Publication number 20220196507
- Publication date Jun 23, 2022
- Intel Corporation
- Prabhakar SUBRAHMANYAM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIQUID COOLED COLD PLATE FOR MULTIPLE SEMICONDUCTOR CHIP PACKAGES
- Publication number 20220173015
- Publication date Jun 2, 2022
- Intel Corporation
- Prabhakar SUBRAHMANYAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENHANCED ELECTRONIC PACKAGE THERMAL DISSIPATION WITH IN-SITU TRANSP...
- Publication number 20220117112
- Publication date Apr 14, 2022
- Intel Corporation
- Prabhakar SUBRAHMANYAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TUNABLE STACK-UP DIMM FORM FACTOR COLD PLATE WITH EMBEDDED PELTIER...
- Publication number 20220077023
- Publication date Mar 10, 2022
- Intel Corporation
- Prabhakar SUBRAHMANYAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECTLY IMPINGING PRESSURE MODULATED SPRAY COOLING AND METHODS OF...
- Publication number 20210351106
- Publication date Nov 11, 2021
- Intel Corporation
- Prabhakar SUBRAHMANYAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-HEALING, TARGET TEMPERATURE LOAD BALANCING, AND RELATED TECHNO...
- Publication number 20210307199
- Publication date Sep 30, 2021
- Intel Corporation
- Prabhakar Subrahmanyam
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
THERMAL CONTROL FOR PROCESSOR-BASED DEVICES
- Publication number 20210289659
- Publication date Sep 16, 2021
- Intel Corporation
- Prabhakar SUBRAHMANYAM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SELF COOLING ADAPTIVE FLOW BRANCHING HEAT EXCHANGER SYSTEM FOR COOL...
- Publication number 20210120703
- Publication date Apr 22, 2021
- Intel Corporation
- Prabhakar SUBRAHMANYAM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
OPTICAL LEAK DETECTION OF LIQUID COOLING COMPONENTS WITHIN AN ELECT...
- Publication number 20210116391
- Publication date Apr 22, 2021
- Intel Corporation
- Prabhakar SUBRAHMANYAM
- G01 - MEASURING TESTING
Information Patent Application
RECONFIGURABLE THERMAL CONTROL OF HIGH-POWERED INTEGRATED CIRCUITRY
- Publication number 20200229325
- Publication date Jul 16, 2020
- Intel Corporation
- Tong W. CHAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RECONFIGURABLE COOLING ASSEMBLY FOR INTEGRATED CIRCUITRY
- Publication number 20200027808
- Publication date Jan 23, 2020
- Intel Corporation
- Prabhakar SUBRAHMANYAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
JET VECTORING FLUID IMPINGEMENT COOLING USING PIVOTING NOZZLES
- Publication number 20190364691
- Publication date Nov 28, 2019
- Intel Corporation
- Prabhakar Subrahmanyam
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Prabhakar Subrahmanyam

Person

Patents Grantslast 30 patents

Self cooling adaptive flow branching heat exchanger system for cool...

Optical leak detection of liquid cooling components within an elect...

Thermal control for processor-based devices

Jet vectoring fluid impingement cooling using pivoting nozzles

Reconfigurable thermal control of high-powered integrated circuitry

Reconfigurable cooling assembly for integrated circuitry

Patents Applicationslast 30 patents

METHODS AND APPARATUS TO IMPROVE THERMAL DISSIPATION AND MECHANICAL...

OPTIMIZED AND AUTOMATED DYNAMIC THERMAL REGULATION METHOD AND APPAR...

METHODS AND APPARATUS TO MITIGATE HOTSPOTS IN INTEGRATED CIRCUIT PA...

HYBRID COOLER TO THERMALLY COOL SEMICONDUCTOR DEVICES INSIDE AND OU...

MITIGATION OF SEISMIC EVENT EFFECTS ON LIQUID IMMERSION COOLING SYS...

POWER BUDGETING FOR COMPUTER PERIPHERALS

METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO MONITOR...

TECHNOLOGIES FOR ISOLATED HEAT DISSIPATING DEVICES

COLD PLATES FOR SECONDARY SIDE COMPONENTS OF PRINTED CIRCUIT BOARDS

COMPACT REAR MOUNTED HEAT EXCHANGERS AND RELATED METHODS

DIRECTLY IMPINGING PRESSURE MODULATED SPRAY COOLING AND METHODS OF...

METHODS AND APPARATUS FOR AN AUTONOMOUS STAGE-SWITCHING MULTI-STAGE...

FIELD REPLACEABLE FAN ASSEMBLIES FOR PERIPHERAL PROCESSING UNITS AN...

THIN FORM FACTOR ASSEMBLIES FOR COOLING DIMMS

LOCKING TENSIONER COOLING ASSEMBLY FOR PLUGGABLE ELECTRONIC COMPONENT

LIQUID COOLING SYSTEM LEAK DETECTION IMPROVEMENTS

LIQUID COOLED COLD PLATE FOR MULTIPLE SEMICONDUCTOR CHIP PACKAGES

ENHANCED ELECTRONIC PACKAGE THERMAL DISSIPATION WITH IN-SITU TRANSP...

TUNABLE STACK-UP DIMM FORM FACTOR COLD PLATE WITH EMBEDDED PELTIER...

DIRECTLY IMPINGING PRESSURE MODULATED SPRAY COOLING AND METHODS OF...

SELF-HEALING, TARGET TEMPERATURE LOAD BALANCING, AND RELATED TECHNO...

THERMAL CONTROL FOR PROCESSOR-BASED DEVICES

SELF COOLING ADAPTIVE FLOW BRANCHING HEAT EXCHANGER SYSTEM FOR COOL...

OPTICAL LEAK DETECTION OF LIQUID COOLING COMPONENTS WITHIN AN ELECT...

RECONFIGURABLE THERMAL CONTROL OF HIGH-POWERED INTEGRATED CIRCUITRY

RECONFIGURABLE COOLING ASSEMBLY FOR INTEGRATED CIRCUITRY

JET VECTORING FLUID IMPINGEMENT COOLING USING PIVOTING NOZZLES