Pradeep Kumar Rai

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Jangipur, IN

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Patents Grantslast 30 patents

Information Patent Grant
Spacer layer for embedding semiconductor die
- Patent number 9,462,694
- Issue date Oct 4, 2016
- SanDisk Semiconductor (Shanghai) Co. Ltd.
- Junrong Yan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Non-uniform vacuum profile die attach tip
- Patent number 9,038,264
- Issue date May 26, 2015
- SanDisk Semiconductor (Shanghai) Co., Ltd.
- Pradeep Kumar Rai
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
BRIDGE STRUCTURE FOR EMBEDDING SEMICONDUCTOR DIE
- Publication number 20170179101
- Publication date Jun 22, 2017
- Sandisk Semiconductor (Shanghai) Co., Ltd.
- Junrong Yan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPACER LAYER FOR EMBEDDING SEMICONDUCTOR DIE
- Publication number 20150187421
- Publication date Jul 2, 2015
- Sandisk Semiconductor (Shanghai) Co., Ltd.
- Junrong Yan
- G11 - INFORMATION STORAGE
Information Patent Application
BRIDGE STRUCTURE FOR EMBEDDING SEMICONDUCTOR DIE
- Publication number 20150155247
- Publication date Jun 4, 2015
- Sandisk Semiconductor (Shanghai) Co., Ltd.
- Junrong Yan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NON-UNIFORM VACUUM PROFILE DIE ATTACH TIP
- Publication number 20120216396
- Publication date Aug 30, 2012
- Pradeep Kumar Rai
- H01 - BASIC ELECTRIC ELEMENTS