Pradip D. Patel

Person

Redwood City, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Proximity sensor device
- Patent number 9,372,264
- Issue date Jun 21, 2016
- Maxim Integrated Products, Inc.
- Pradip D. Patel
- G01 - MEASURING TESTING
Information Patent Grant
Bump I/O contact for semiconductor device
- Patent number 9,368,466
- Issue date Jun 14, 2016
- Maxim Integrated Products, Inc.
- Pradip D. Patel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Proximity sensor device
- Patent number 8,822,925
- Issue date Sep 2, 2014
- Maxim Integrated Products, Inc.
- Pradip D. Patel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Proximity sensor device
- Patent number 8,604,436
- Issue date Dec 10, 2013
- Maxim Integrated Products, Inc.
- Pradip Dhirajlal Patel
- G01 - MEASURING TESTING
Information Patent Grant
Bump I/O contact for semiconductor device
- Patent number 8,269,345
- Issue date Sep 18, 2012
- Maxim Integrated Products, Inc.
- Pradip D. Patel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and process utilizing pre-formed mold cap and...
- Patent number 7,436,060
- Issue date Oct 14, 2008
- LSI Corporation
- Pradip Patel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having a thermally and electrically connected...
- Patent number 6,933,602
- Issue date Aug 23, 2005
- LSI Logic Corporation
- Pradip Patel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electromagnetic interference package protection
- Patent number 6,867,480
- Issue date Mar 15, 2005
- LSI Logic Corporation
- Severino A. Legaspi, Jr.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic organic substrate
- Patent number 6,801,437
- Issue date Oct 5, 2004
- LSI Logic Corporation
- Maurice O. Othieno
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic substrate
- Patent number 6,603,201
- Issue date Aug 5, 2003
- LSI Logic Corporation
- Manickam Thavarajah
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit package via
- Patent number 6,555,914
- Issue date Apr 29, 2003
- LSI Logic Corporation
- Aritharan Thurairajaratnam
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Burn-in technologies for unpackaged integrated circuits
- Patent number 5,541,524
- Issue date Jul 30, 1996
- nCHIP, Inc.
- David B. Tuckerman
- G01 - MEASURING TESTING
Information Patent Grant
Burn-in technologies for unpackaged integrated circuits
- Patent number 5,397,997
- Issue date Mar 14, 1995
- nCHIP, Inc.
- David Tuckerman
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
BUMP I/O CONTACT FOR SEMICONDUCTOR DEVICE
- Publication number 20130015574
- Publication date Jan 17, 2013
- Maxim Integrated Products, Inc.
- Pradip D. Patel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bump I/O Contact for Semiconductor Device
- Publication number 20090096092
- Publication date Apr 16, 2009
- Pradip D. Patel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package and process utilizing pre-formed mold cap and...
- Publication number 20050275086
- Publication date Dec 15, 2005
- LSI Logic Corporation
- Pradip Patel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electromagnetic interference package protection
- Publication number 20040251522
- Publication date Dec 16, 2004
- Severino A. Legaspi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic organic substrate
- Publication number 20040142556
- Publication date Jul 22, 2004
- Maurice O. Othieno
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Solder mask on bonding ring
- Publication number 20040041252
- Publication date Mar 4, 2004
- Maurice Othieno
- H01 - BASIC ELECTRIC ELEMENTS

Pradip D. Patel

Person

Patents Grantslast 30 patents

Proximity sensor device

Bump I/O contact for semiconductor device

Proximity sensor device

Proximity sensor device

Bump I/O contact for semiconductor device

Semiconductor package and process utilizing pre-formed mold cap and...

Semiconductor package having a thermally and electrically connected...

Electromagnetic interference package protection

Electronic organic substrate

Electronic substrate

Integrated circuit package via

Burn-in technologies for unpackaged integrated circuits

Burn-in technologies for unpackaged integrated circuits

Patents Applicationslast 30 patents

BUMP I/O CONTACT FOR SEMICONDUCTOR DEVICE

Bump I/O Contact for Semiconductor Device

Semiconductor package and process utilizing pre-formed mold cap and...

Electromagnetic interference package protection

Electronic organic substrate

Solder mask on bonding ring