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Prasad RAMANATHAN
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Chandler, AZ, US
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Patents Grants
last 30 patents
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Patent Grant
Backside metallization (BSM) on stacked die packages and external s...
Patent number
11,705,417
Issue date
Jul 18, 2023
Intel Corporation
Chandra Mohan Jha
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Thermal bump networks for integrated circuit device assemblies
Patent number
11,587,843
Issue date
Feb 21, 2023
Intel Corporation
Prasad Ramanathan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Architecture and processes to enable high capacity memory packages...
Patent number
11,456,281
Issue date
Sep 27, 2022
Intel Corporation
Yí Li
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
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Patent Application
BACKSIDE METALLIZATION (BSM) ON STACKED DIE PACKAGES AND EXTERNAL S...
Publication number
20210104484
Publication date
Apr 8, 2021
Intel Corporation
Chandra Mohan JHA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THERMAL BUMP NETWORKS FOR INTEGRATED CIRCUIT DEVICE ASSEMBLIES
Publication number
20200194330
Publication date
Jun 18, 2020
Intel Corporation
Prasad Ramanathan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ARCHITECTURE AND PROCESSES TO ENABLE HIGH CAPACITY MEMORY PACKAGES...
Publication number
20200105719
Publication date
Apr 2, 2020
Intel Corporation
Yi LI
H01 - BASIC ELECTRIC ELEMENTS