Predrag Drljaca

Person

Neuchatel, CH

People

Patents Grantslast 30 patents

Information Patent Grant
Sensor unit and method of interconnecting a substrate and a carrier
- Patent number 11,662,262
- Issue date May 30, 2023
- TE CONNECTIVITY SOLUTIONS GmbH
- Ismael Brunner
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Differential pressure sensor device having channel in fluid communi...
- Patent number 11,231,338
- Issue date Jan 25, 2022
- TE CONNECTIVITY SOLUTIONS GmbH
- Ismael Brunner
- G01 - MEASURING TESTING
Information Patent Grant
Pressure sensor assemblies with protective pressure feature of a pr...
- Patent number 11,193,842
- Issue date Dec 7, 2021
- TE CONNECTIVITY SOLUTIONS GmbH
- Martin Pfeiffer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sensor system, sensor arrangement, and assembly method using solder...
- Patent number 11,146,893
- Issue date Oct 12, 2021
- TE CONNECTIVITY SOLUTIONS GmbH
- Predrag Drljaca
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Pressure sensor assemblies with protective pressure feature
- Patent number 11,118,992
- Issue date Sep 14, 2021
- Measurement Specialties, Inc.
- Martin Pfeiffer
- G01 - MEASURING TESTING
Information Patent Grant
Pressure sensor
- Patent number 10,548,492
- Issue date Feb 4, 2020
- MEAS Switzerland S.a.r.l.
- Thomas Arnold
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Method of manufacturing a sensor
- Patent number 10,144,636
- Issue date Dec 4, 2018
- MEAS Switzerland S.a.r.l.
- Jean-Francois le Neal
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Capacitive sensor integrated onto semiconductor circuit
- Patent number 9,239,310
- Issue date Jan 19, 2016
- MEAS France
- Jean-Paul Guillemet
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
PRESSURE SENSOR ASSEMBLIES WITH PROTECTIVE PRESSURE FEATURE
- Publication number 20200386641
- Publication date Dec 10, 2020
- TE Connectivity Solutions GmbH
- Martin Pfeiffer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PRESSURE SENSOR ASSEMBLIES WITH PROTECTIVE PRESSURE FEATURE
- Publication number 20200386645
- Publication date Dec 10, 2020
- TE Connectivity Solutions GmbH
- Martin Pfeiffer
- G01 - MEASURING TESTING
Information Patent Application
Sensor Unit And Method Of Interconnecting A Substrate And A Carrier
- Publication number 20200225107
- Publication date Jul 16, 2020
- TE Connectivity Solutions GmbH
- Ismael Brunner
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DIFFERENTIAL PRESSURE SENSOR DEVICE
- Publication number 20200158587
- Publication date May 21, 2020
- TE Connectivity Solutions GmbH
- Ismael Brunner
- G01 - MEASURING TESTING
Information Patent Application
Sensor System, Sensor Arrangement, And Assembly Method Using Solder...
- Publication number 20190090065
- Publication date Mar 21, 2019
- MEAS Switzerland S.a.r.l.
- Predrag Drljaca
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PRESSURE SENSOR
- Publication number 20180160922
- Publication date Jun 14, 2018
- MEAS Switzerland S.a.r.l.
- Thomas Arnold
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
METHOD OF MANUFACTURING A SENSOR
- Publication number 20180086626
- Publication date Mar 29, 2018
- MEAS Switzerland S.a.r.l.
- Jean-Francois LE NEAL
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CAPACITIVE SENSOR INTEGRATED ONTO SEMICONDUCTOR CIRCUIT
- Publication number 20140197500
- Publication date Jul 17, 2014
- Jean-Paul Guillemet
- G01 - MEASURING TESTING

Predrag Drljaca

Person

Patents Grantslast 30 patents

Sensor unit and method of interconnecting a substrate and a carrier

Differential pressure sensor device having channel in fluid communi...

Pressure sensor assemblies with protective pressure feature of a pr...

Sensor system, sensor arrangement, and assembly method using solder...

Pressure sensor assemblies with protective pressure feature

Pressure sensor

Method of manufacturing a sensor

Capacitive sensor integrated onto semiconductor circuit

Patents Applicationslast 30 patents

PRESSURE SENSOR ASSEMBLIES WITH PROTECTIVE PRESSURE FEATURE

PRESSURE SENSOR ASSEMBLIES WITH PROTECTIVE PRESSURE FEATURE

Sensor Unit And Method Of Interconnecting A Substrate And A Carrier

DIFFERENTIAL PRESSURE SENSOR DEVICE

Sensor System, Sensor Arrangement, And Assembly Method Using Solder...

PRESSURE SENSOR

METHOD OF MANUFACTURING A SENSOR

CAPACITIVE SENSOR INTEGRATED ONTO SEMICONDUCTOR CIRCUIT