Prithu SHARMA

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Santa Clara, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Liner and barrier applications for subtractive metal integration
- Patent number 10,199,235
- Issue date Feb 5, 2019
- Lam Research Corporation
- Hui-Jung Wu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Liner and barrier applications for subtractive metal integration
- Patent number 9,899,234
- Issue date Feb 20, 2018
- Lam Research Corporation
- Hui-Jung Wu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method to etch copper barrier film
- Patent number 9,570,320
- Issue date Feb 14, 2017
- Lam Research Corporation
- Meihua Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to etch non-volatile metal materials
- Patent number 9,391,267
- Issue date Jul 12, 2016
- Lam Research Corporation
- Meihua Shen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method to etch non-volatile metal materials
- Patent number 9,130,158
- Issue date Sep 8, 2015
- Lam Research Corporation
- Meihua Shen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LINER AND BARRIER APPLICATIONS FOR SUBTRACTIVE METAL INTEGRATION
- Publication number 20180211846
- Publication date Jul 26, 2018
- LAM RESEARCH CORPORATION
- Hui-Jung Wu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
NOVEL METHOD TO ETCH COPPER BARRIER FILM
- Publication number 20160104630
- Publication date Apr 14, 2016
- LAM RESEARCH CORPORATION
- Meihua SHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LINER AND BARRIER APPLICATIONS FOR SUBTRACTIVE METAL INTEGRATION
- Publication number 20150380272
- Publication date Dec 31, 2015
- LAM RESEARCH CORPORATION
- Hui-Jung Wu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD TO ETCH NON-VOLATILE METAL MATERIALS
- Publication number 20150340603
- Publication date Nov 26, 2015
- LAM RESEARCH CORPORATION
- Meihua SHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD TO ETCH NON-VOLATILE METAL MATERIALS
- Publication number 20150280114
- Publication date Oct 1, 2015
- LAM RESEARCH CORPORATION
- Meihua SHEN
- H01 - BASIC ELECTRIC ELEMENTS