Priyal Shah

Person

San Jose, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Low temperature hybrid bonding
- Patent number 11,911,839
- Issue date Feb 27, 2024
- Advanced Micro Devices, Inc.
- Priyal Shah
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bond pads for low temperature hybrid bonding
- Patent number 11,810,891
- Issue date Nov 7, 2023
- Advanced Micro Devices, Inc.
- Priyal Shah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out package with reinforcing rivets
- Patent number 11,742,301
- Issue date Aug 29, 2023
- Advanced Micro Devices, Inc.
- Rahul Agarwal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip with reduced pitch conductive pillars
- Patent number 11,676,924
- Issue date Jun 13, 2023
- Advanced Micro Devices, Inc.
- Priyal Shah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded chip package with anchor structures
- Patent number 11,367,628
- Issue date Jun 21, 2022
- Advanced Micro Devices, Inc.
- Priyal Shah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip with reduced pitch conductive pillars
- Patent number 10,943,880
- Issue date Mar 9, 2021
- Advanced Micro Devices, Inc.
- Priyal Shah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond pads for low temperature hybrid bonding
- Patent number 10,937,755
- Issue date Mar 2, 2021
- Advanced Micro Devices, Inc.
- Priyal Shah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out package with multi-layer redistribution layer structure
- Patent number 10,593,620
- Issue date Mar 17, 2020
- Advanced Micro Devices, Inc.
- Rahul Agarwal
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LOW TEMPERATURE HYBRID BONDING
- Publication number 20230201952
- Publication date Jun 29, 2023
- ADVANCED MICRO DEVICES, INC.
- PRIYAL SHAH
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE WITH ANNULAR PACKAGE LID STRUCTURE
- Publication number 20230093924
- Publication date Mar 30, 2023
- Priyal Shah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED CHIP PACKAGE WITH ANCHOR STRUCTURES
- Publication number 20220319871
- Publication date Oct 6, 2022
- ADVANCED MICRO DEVICES, INC.
- PRIYAL SHAH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURAL THERMAL INTERFACING FOR LIDDED SEMICONDUCTOR PACKAGES
- Publication number 20220199429
- Publication date Jun 23, 2022
- ADVANCED MICRO DEVICES, INC.
- PRIYAL SHAH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED SEMICONDUCTOR CHIP PACKAGE WITH STAIR-STEP MOLDING LAYER
- Publication number 20210296194
- Publication date Sep 23, 2021
- ADVANCED MICRO DEVICES, INC.
- Priyal Shah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP WITH REDUCED PITCH CONDUCTIVE PILLARS
- Publication number 20210193604
- Publication date Jun 24, 2021
- ADVANCED MICRO DEVICES, INC.
- PRIYAL SHAH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND PADS FOR LOW TEMPERATURE HYBRID BONDING
- Publication number 20210183810
- Publication date Jun 17, 2021
- ADVANCED MICRO DEVICES, INC.
- PRIYAL SHAH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT PACKAGE WITH REINFORCING RIVETS
- Publication number 20210057352
- Publication date Feb 25, 2021
- ADVANCED MICRO DEVICES, INC.
- Rahul Agarwal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED CHIP PACKAGE WITH ANCHOR STRUCTURES
- Publication number 20210020459
- Publication date Jan 21, 2021
- ADVANCED MICRO DEVICES, INC.
- Priyal Shah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP WITH REDUCED PITCH CONDUCTIVE PILLARS
- Publication number 20200365543
- Publication date Nov 19, 2020
- ADVANCED MICRO DEVICES, INC.
- Priyal Shah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND PADS FOR LOW TEMPERATURE HYBRID BONDING
- Publication number 20200006280
- Publication date Jan 2, 2020
- Priyal Shah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT PACKAGE WITH MULTI-LAYER REDISTRIBUTION LAYER STRUCTURE
- Publication number 20190333851
- Publication date Oct 31, 2019
- Rahul Agarwal
- H01 - BASIC ELECTRIC ELEMENTS

Priyal Shah

Person

Patents Grantslast 30 patents

Low temperature hybrid bonding

Bond pads for low temperature hybrid bonding

Fan-out package with reinforcing rivets

Semiconductor chip with reduced pitch conductive pillars

Molded chip package with anchor structures

Semiconductor chip with reduced pitch conductive pillars

Bond pads for low temperature hybrid bonding

Fan-out package with multi-layer redistribution layer structure

Patents Applicationslast 30 patents

LOW TEMPERATURE HYBRID BONDING

SEMICONDUCTOR PACKAGE WITH ANNULAR PACKAGE LID STRUCTURE

MOLDED CHIP PACKAGE WITH ANCHOR STRUCTURES

STRUCTURAL THERMAL INTERFACING FOR LIDDED SEMICONDUCTOR PACKAGES

MOLDED SEMICONDUCTOR CHIP PACKAGE WITH STAIR-STEP MOLDING LAYER

SEMICONDUCTOR CHIP WITH REDUCED PITCH CONDUCTIVE PILLARS

BOND PADS FOR LOW TEMPERATURE HYBRID BONDING

FAN-OUT PACKAGE WITH REINFORCING RIVETS

MOLDED CHIP PACKAGE WITH ANCHOR STRUCTURES

SEMICONDUCTOR CHIP WITH REDUCED PITCH CONDUCTIVE PILLARS

BOND PADS FOR LOW TEMPERATURE HYBRID BONDING

FAN-OUT PACKAGE WITH MULTI-LAYER REDISTRIBUTION LAYER STRUCTURE