Priyanka Dobriyal

Person

Hillsboro, OR, US

People

Patents Grantslast 30 patents

Information Patent Grant
Silicon photonic integrated lens compatible with wafer processing
- Patent number 11,894,474
- Issue date Feb 6, 2024
- Intel Corporation
- Priyanka Dobriyal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Decoupling layer to reduce underfill stress in semiconductor devices
- Patent number 11,715,928
- Issue date Aug 1, 2023
- Intel Corporation
- Priyanka Dobriyal
- G02 - OPTICS
Information Patent Grant
Apparatus and method for conformal coating of integrated circuit pa...
- Patent number 10,356,912
- Issue date Jul 16, 2019
- Intel Corporation
- Priyanka Dobriyal
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SELECTIVE PROTECTION OF INTEGRATED CIRCUIT CHIP SURFACE REGIONS FRO...
- Publication number 20230084375
- Publication date Mar 16, 2023
- Intel Corporation
- Priyanka Dobriyal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIPLE METAL LAYERS WITHIN A PHOTONICS INTEGRATED CIRCUIT FOR THE...
- Publication number 20220416503
- Publication date Dec 29, 2022
- Intel Corporation
- Priyanka DOBRIYAL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH BANDWIDTH OPTICAL INTERCONNECTION ARCHITECTURES
- Publication number 20220155539
- Publication date May 19, 2022
- Intel Corporation
- Srinivas V. PIETAMBARAM
- G02 - OPTICS
Information Patent Application
PHOTONIC PACKAGE LASER AREA MACRO-VOID PRESSURE RELIEF MICRO-CHANNELS
- Publication number 20210408339
- Publication date Dec 30, 2021
- Intel Corporation
- Ankur AGARWAL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING SOLUTIONS FOR HIGH BANDWIDTH NETWORKING APPLICATIONS
- Publication number 20210210478
- Publication date Jul 8, 2021
- Intel Corporation
- Susheel JADHAV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON PHOTONIC INTEGRATED LENS COMPATIBLE WITH WAFER PROCESSING
- Publication number 20210074866
- Publication date Mar 11, 2021
- Intel Corporation
- Priyanka DOBRIYAL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DECOUPLING LAYER TO REDUCE UNDERFILL STRESS IN SEMICONDUCTOR DEVICES
- Publication number 20210066882
- Publication date Mar 4, 2021
- Intel Corporation
- Priyanka Dobriyal
- G02 - OPTICS
Information Patent Application
CONFORMAL COATING OF INTEGRATED CIRCUIT PACKAGES
- Publication number 20180070456
- Publication date Mar 8, 2018
- Intel Corporation
- Priyanka Dobriyal
- H01 - BASIC ELECTRIC ELEMENTS

Priyanka Dobriyal

Person

Patents Grantslast 30 patents

Silicon photonic integrated lens compatible with wafer processing

Decoupling layer to reduce underfill stress in semiconductor devices

Apparatus and method for conformal coating of integrated circuit pa...

Patents Applicationslast 30 patents

SELECTIVE PROTECTION OF INTEGRATED CIRCUIT CHIP SURFACE REGIONS FRO...

MULTIPLE METAL LAYERS WITHIN A PHOTONICS INTEGRATED CIRCUIT FOR THE...

HIGH BANDWIDTH OPTICAL INTERCONNECTION ARCHITECTURES

PHOTONIC PACKAGE LASER AREA MACRO-VOID PRESSURE RELIEF MICRO-CHANNELS

PACKAGING SOLUTIONS FOR HIGH BANDWIDTH NETWORKING APPLICATIONS

SILICON PHOTONIC INTEGRATED LENS COMPATIBLE WITH WAFER PROCESSING

DECOUPLING LAYER TO REDUCE UNDERFILL STRESS IN SEMICONDUCTOR DEVICES

CONFORMAL COATING OF INTEGRATED CIRCUIT PACKAGES