Prosenjit Sen

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Bangalore, IN

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Patents Applicationslast 30 patents

Information Patent Application
WAFER LEVEL HERMETIC BOND USING METAL ALLOY WITH RAISED FEATURE AND...
- Publication number 20150266726
- Publication date Sep 24, 2015
- Innovative Micro Technology
- Christopher S. GUDEMAN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method for forming through wafer vias
- Publication number 20150069618
- Publication date Mar 12, 2015
- Innovative Micro Technology
- Christopher S. Gudeman
- H01 - BASIC ELECTRIC ELEMENTS