Pui Yin Yu

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Hong Kong, CN

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Patents Grantslast 30 patents

Information Patent Grant
Resin flow restriction process and structure
- Patent number 11,317,521
- Issue date Apr 26, 2022
- Pui Yin Yu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
PCB with coin and dielectric layer
- Patent number 11,122,674
- Issue date Sep 14, 2021
- Pui Yin Yu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
CIRCUIT BOARD WITH SOLDER MASK ON INTERNAL COPPER PAD
- Publication number 20230328896
- Publication date Oct 12, 2023
- DSBJ PTE. LTD.
- Pui Yin YU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RESIN FLOW RESTRICTION PROCESS AND STRUCTURE
- Publication number 20210385952
- Publication date Dec 9, 2021
- Multek Technologies Limited
- Pui Yin Yu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR