Purakh Raj Verma

Person

Casablanca, SG

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit device
- Patent number 12,249,545
- Issue date Mar 11, 2025
- United Microelectronics Corp.
- Purakh Raj Verma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-finger transistor structure and method of manufacturing the same
- Patent number 12,191,367
- Issue date Jan 7, 2025
- United Microelectronics Corp.
- Su Xing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating an air gap
- Patent number 12,191,195
- Issue date Jan 7, 2025
- United Microelectronics Corp.
- Bo Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device and fabrication method thereof
- Patent number 12,132,011
- Issue date Oct 29, 2024
- United Microelectronics Corp.
- Purakh Raj Verma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure with heat dissipation structure and method...
- Patent number 12,131,976
- Issue date Oct 29, 2024
- United Microelectronics Corp.
- Purakh Raj Verma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating an integrated circuit device
- Patent number 12,087,712
- Issue date Sep 10, 2024
- United Microelectronics Corp.
- Purakh Raj Verma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method of wafer bonding
- Patent number 12,080,622
- Issue date Sep 3, 2024
- United Microelectronics Corp.
- Chia-Liang Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 12,046,659
- Issue date Jul 23, 2024
- United Microelectronics Corp.
- Purakh Raj Verma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Parallel-connected trench capacitor structure with multiple electro...
- Patent number 11,955,292
- Issue date Apr 9, 2024
- United Microelectronics Corp.
- Purakh Raj Verma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Parallel-connected trench capacitor structure with multiple electro...
- Patent number 11,929,213
- Issue date Mar 12, 2024
- United Microelectronics Corp.
- Purakh Raj Verma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure
- Patent number 11,923,373
- Issue date Mar 5, 2024
- United Microelectronics Corp.
- Bo Tao
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device and method of fabricating the same
- Patent number 11,881,529
- Issue date Jan 23, 2024
- United Microelectronics Corp.
- Purakh Raj Verma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure with an air gap
- Patent number 11,848,253
- Issue date Dec 19, 2023
- United Microelectronics Corp.
- Ching-Pin Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Varactor with meander diffusion region
- Patent number 11,721,772
- Issue date Aug 8, 2023
- United Microelectronics Corp.
- Purakh Raj Verma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,721,757
- Issue date Aug 8, 2023
- United Microelectronics Corp.
- Purakh Raj Verma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of radiofrequency device including mold compou...
- Patent number 11,715,709
- Issue date Aug 1, 2023
- United Microelectronics Corp.
- Purakh Raj Verma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inductor module and method for fabricating the same
- Patent number 11,676,992
- Issue date Jun 13, 2023
- United Microelectronics Corporation
- Purakh Raj Verma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method of wafer bonding
- Patent number 11,670,567
- Issue date Jun 6, 2023
- United Microelectronics Corp.
- Chia-Liang Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High resistivity wafer with heat dissipation structure and method o...
- Patent number 11,658,087
- Issue date May 23, 2023
- United Microelectronics Corp.
- Purakh Raj Verma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transistor structure in low noise amplifier
- Patent number 11,658,118
- Issue date May 23, 2023
- United Microelectronics Corp.
- Purakh Raj Verma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High resistivity wafer with heat dissipation structure and method o...
- Patent number 11,652,017
- Issue date May 16, 2023
- United Microelectronics Corp.
- Purakh Raj Verma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating an integrated circuit device
- Patent number 11,637,080
- Issue date Apr 25, 2023
- United Microelectronics Corp.
- Purakh Raj Verma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device comprising a deep trench isolation structure a...
- Patent number 11,521,891
- Issue date Dec 6, 2022
- United Microelectronics Corp.
- Purakh Raj Verma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Varactor structure with relay conductive layers
- Patent number 11,508,855
- Issue date Nov 22, 2022
- United Microelectronics Corp.
- Purakh Raj Verma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of fabricating the same
- Patent number 11,476,363
- Issue date Oct 18, 2022
- United Microelectronics Corp.
- Purakh Raj Verma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transistor structure in low noise amplifier
- Patent number 11,476,192
- Issue date Oct 18, 2022
- United Microelectronics Corp.
- Purakh Raj Verma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device and fabrication method thereof
- Patent number 11,462,489
- Issue date Oct 4, 2022
- United Microelectronics Corp.
- Purakh Raj Verma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Seal ring structure
- Patent number 11,448,318
- Issue date Sep 20, 2022
- United Microelectronics Corp.
- Hai Biao Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,398,548
- Issue date Jul 26, 2022
- United Microelectronics Corp.
- Wen-Shen Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radiofrequency device and manufacturing method thereof
- Patent number 11,362,048
- Issue date Jun 14, 2022
- United Microelectronics Corp.
- Purakh Raj Verma
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MULTI-FINGER TRANSISTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250072092
- Publication date Feb 27, 2025
- UNITED MICROELECTRONICS CORP.
- Su Xing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE WITH HEAT DISSIPATION STRUCTURE AND METHOD...
- Publication number 20240379492
- Publication date Nov 14, 2024
- UNITED MICROELECTRONICS CORP.
- Purakh Raj Verma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240332201
- Publication date Oct 3, 2024
- United Microelectronics Corp.
- Purakh Raj Verma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20240170490
- Publication date May 23, 2024
- UNITED MICROELECTRONICS CORP.
- BO TAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20240162093
- Publication date May 16, 2024
- UNITED MICROELECTRONICS CORP.
- Chu-Chun Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ON SILICON-ON-INSULATOR SUBSTRATE
- Publication number 20240063282
- Publication date Feb 22, 2024
- UNITED MICROELECTRONICS CORP.
- Purakh Raj Verma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING PROTECTIVE LAYER UTILIZED IN SILICON REMOVE PROCESS
- Publication number 20240047266
- Publication date Feb 8, 2024
- UNITED MICROELECTRONICS CORP.
- Chia-Liang Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240038832
- Publication date Feb 1, 2024
- United Microelectronics Corp.
- Purakh Raj Verma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240038693
- Publication date Feb 1, 2024
- United Microelectronics Corp.
- Purakh Raj Verma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230299174
- Publication date Sep 21, 2023
- United Microelectronics Corp.
- Purakh Raj Verma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING INDUCTOR MODULE
- Publication number 20230268375
- Publication date Aug 24, 2023
- UNITED MICROELECTRONICS CORPORATION
- Purakh Raj Verma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF WAFER BONDING
- Publication number 20230268246
- Publication date Aug 24, 2023
- UNITED MICROELECTRONICS CORP.
- Chia-Liang Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING AN INTEGRATED CIRCUIT DEVICE
- Publication number 20230230938
- Publication date Jul 20, 2023
- UNITED MICROELECTRONICS CORP.
- Purakh Raj Verma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Finger Transistor Structure and Method of Manufacturing the Same
- Publication number 20230163184
- Publication date May 25, 2023
- UNITED MICROELECTRONICS CORP.
- Su Xing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20230082878
- Publication date Mar 16, 2023
- UNITED MICROELECTRONICS CORP.
- BO TAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PARALLEL-CONNECTED CAPACITOR STRUCTURE AND METHOD OF FABRICATING TH...
- Publication number 20230071686
- Publication date Mar 9, 2023
- UNITED MICROELECTRONICS CORP.
- Purakh Raj Verma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING AN AIR GAP
- Publication number 20230058468
- Publication date Feb 23, 2023
- UNITED MICROELECTRONICS CORP.
- BO TAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20220416081
- Publication date Dec 29, 2022
- UNITED MICROELECTRONICS CORP.
- Purakh Raj Verma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20220415831
- Publication date Dec 29, 2022
- United Microelectronics Corp.
- Purakh Raj Verma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION METHOD OF VARACTOR STRUCTURE
- Publication number 20220328700
- Publication date Oct 13, 2022
- United Microelectronics Corp.
- Purakh Raj Verma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20220270973
- Publication date Aug 25, 2022
- UNITED MICROELECTRONICS CORP.
- Purakh Raj Verma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF RADIOFREQUENCY DEVICE
- Publication number 20220230975
- Publication date Jul 21, 2022
- UNITED MICROELECTRONICS CORP.
- Purakh Raj Verma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE WITH AN AIR GAP
- Publication number 20220068766
- Publication date Mar 3, 2022
- UNITED MICROELECTRONICS CORP.
- Ching-Pin Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDUCTOR MODULE AND METHOD FOR FABRICATING THE SAME
- Publication number 20220069064
- Publication date Mar 3, 2022
- UNITED MICROELECTRONICS CORPORATION
- Purakh Raj Verma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220059459
- Publication date Feb 24, 2022
- UNITED MICROELECTRONICS CORP.
- Purakh Raj Verma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF WAFER BONDING
- Publication number 20220013430
- Publication date Jan 13, 2022
- UNITED MICROELECTRONICS CORP.
- Chia-Liang Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE
- Publication number 20210384093
- Publication date Dec 9, 2021
- UNITED MICROELECTRONICS CORP.
- Purakh Raj Verma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE AND FABRICATION METHOD THEREOF
- Publication number 20210384146
- Publication date Dec 9, 2021
- UNITED MICROELECTRONICS CORP.
- Purakh Raj Verma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE AND FABRICATION METHOD THEREOF
- Publication number 20210375793
- Publication date Dec 2, 2021
- UNITED MICROELECTRONICS CORP.
- Purakh Raj Verma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING AN INTEGRATED CIRCUIT DEVICE
- Publication number 20210375800
- Publication date Dec 2, 2021
- UNITED MICROELECTRONICS CORP.
- Purakh Raj Verma
- H01 - BASIC ELECTRIC ELEMENTS

Purakh Raj Verma

Person

Patents Grantslast 30 patents

Integrated circuit device

Multi-finger transistor structure and method of manufacturing the same

Method of fabricating an air gap

Integrated circuit device and fabrication method thereof

Semiconductor structure with heat dissipation structure and method...

Method for fabricating an integrated circuit device

Semiconductor structure and method of wafer bonding

Semiconductor structure and manufacturing method thereof

Parallel-connected trench capacitor structure with multiple electro...

Parallel-connected trench capacitor structure with multiple electro...

Semiconductor structure

Semiconductor device and method of fabricating the same

Semiconductor structure with an air gap

Varactor with meander diffusion region

Semiconductor device

Manufacturing method of radiofrequency device including mold compou...

Inductor module and method for fabricating the same

Semiconductor structure and method of wafer bonding

High resistivity wafer with heat dissipation structure and method o...

Transistor structure in low noise amplifier

High resistivity wafer with heat dissipation structure and method o...

Method for fabricating an integrated circuit device

Semiconductor device comprising a deep trench isolation structure a...

Varactor structure with relay conductive layers

Semiconductor device and method of fabricating the same

Transistor structure in low noise amplifier

Integrated circuit device and fabrication method thereof

Seal ring structure

Semiconductor device

Radiofrequency device and manufacturing method thereof

Patents Applicationslast 30 patents

MULTI-FINGER TRANSISTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR STRUCTURE WITH HEAT DISSIPATION STRUCTURE AND METHOD...

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR STRUCTURE

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR DEVICE ON SILICON-ON-INSULATOR SUBSTRATE

METHOD OF FORMING PROTECTIVE LAYER UTILIZED IN SILICON REMOVE PROCESS

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

METHOD FOR FABRICATING INDUCTOR MODULE

SEMICONDUCTOR STRUCTURE AND METHOD OF WAFER BONDING

METHOD FOR FABRICATING AN INTEGRATED CIRCUIT DEVICE

Multi-Finger Transistor Structure and Method of Manufacturing the Same

SEMICONDUCTOR STRUCTURE

PARALLEL-CONNECTED CAPACITOR STRUCTURE AND METHOD OF FABRICATING TH...

METHOD OF FABRICATING AN AIR GAP

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

FABRICATION METHOD OF VARACTOR STRUCTURE

BONDED SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME

MANUFACTURING METHOD OF RADIOFREQUENCY DEVICE

SEMICONDUCTOR STRUCTURE WITH AN AIR GAP

INDUCTOR MODULE AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR DEVICE

SEMICONDUCTOR STRUCTURE AND METHOD OF WAFER BONDING

INTEGRATED CIRCUIT DEVICE

INTEGRATED CIRCUIT DEVICE AND FABRICATION METHOD THEREOF

INTEGRATED CIRCUIT DEVICE AND FABRICATION METHOD THEREOF

METHOD FOR FABRICATING AN INTEGRATED CIRCUIT DEVICE