Purushotham Kaushik Muthur Srinath

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Laser ablation-based surface property modification and contaminatio...
- Patent number 12,362,340
- Issue date Jul 15, 2025
- Intel Corporation
- Denis Myasishchev
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronics package comprising a package-on-package (PoP) arch...
- Patent number 12,347,743
- Issue date Jul 1, 2025
- Intel Corporation
- Elizabeth Nofen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronics package comprising a package-on-package (POP) arch...
- Patent number 12,315,777
- Issue date May 27, 2025
- Intel Corporation
- Elizabeth Nofen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through mold interconnect drill feature
- Patent number 11,705,383
- Issue date Jul 18, 2023
- Intel Corporation
- Robert M. Nickerson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and device for failure analysis using RF-based thermometry
- Patent number 11,551,956
- Issue date Jan 10, 2023
- Intel Corporation
- Chandrashekara Shashank Kaira
- G01 - MEASURING TESTING
Information Patent Grant
Method of sample preparation using dual ion beam trenching
- Patent number 11,476,120
- Issue date Oct 18, 2022
- Intel Corporation
- Purushotham Kaushik Muthur Srinath
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems, methods, and apparatuses for implementing a thermal soluti...
- Patent number 10,607,909
- Issue date Mar 31, 2020
- Intel Corporation
- Purushotham Kaushik Muthur Srinath
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic assembly using bismuth-rich solder
- Patent number 10,361,167
- Issue date Jul 23, 2019
- Intel Corporation
- Pilin Liu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Device, system and method for alignment of an integrated circuit as...
- Patent number 9,625,256
- Issue date Apr 18, 2017
- Intel Corporation
- Purushotham Kaushik Muthur Srinath
- G01 - MEASURING TESTING
Information Patent Grant
Methods to prevent filler entrapment in microelectronic device to m...
- Patent number 9,230,833
- Issue date Jan 5, 2016
- Intel Corporation
- Manish Dubey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods to prevent filler entrapment in microelectronic device to m...
- Patent number 8,999,765
- Issue date Apr 7, 2015
- Intel Corporation
- Manish Dubey
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MICROELECTRONICS PACKAGE COMPRISING A PACKAGE-ON-PACKAGE (POP) ARCH...
- Publication number 20240128152
- Publication date Apr 18, 2024
- Intel Corporation
- Elizabeth NOFEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER ABLATION-BASED SURFACE PROPERTY MODIFICATION AND CONTAMINATIO...
- Publication number 20240128253
- Publication date Apr 18, 2024
- Intel Corporation
- Denis MYASISHCHEV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONICS PACKAGE COMPRISING A PACKAGE-ON-PACKAGE (POP) ARCH...
- Publication number 20240021493
- Publication date Jan 18, 2024
- Intel Corporation
- Elizabeth NOFEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH MOLD INTERCONNECT DRILL FEATURE
- Publication number 20240021500
- Publication date Jan 18, 2024
- Intel Corporation
- Robert M. NICKERSON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONICS PACKAGE COMPRISING A PACKAGE-ON-PACKAGE (POP) ARCH...
- Publication number 20240014097
- Publication date Jan 11, 2024
- Intel Corporation
- Elizabeth NOFEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH MOLD INTERCONNECT DRILL FEATURE
- Publication number 20230290708
- Publication date Sep 14, 2023
- Intel Corporation
- Robert M. NICKERSON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND DEVICE FOR FAILURE ANALYSIS USING RF-BASED THERMOMETRY
- Publication number 20210407833
- Publication date Dec 30, 2021
- Intel Corporation
- Chandrashekara Shashank Kaira
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONICS PACKAGE COMPRISING A PACKAGE-ON-PACKAGE (POP) ARCH...
- Publication number 20210066155
- Publication date Mar 4, 2021
- Intel Corporation
- Elizabeth NOFEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH MOLD INTERCONNECT DRILL FEATURE
- Publication number 20210066167
- Publication date Mar 4, 2021
- Intel Corporation
- Robert M. NICKERSON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER ABLATION-BASED SURFACE PROPERTY MODIFICATION AND CONTAMINATIO...
- Publication number 20210066273
- Publication date Mar 4, 2021
- Intel Corporation
- Denis MYASISHCHEV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF SAMPLE PREPARATION USING DUAL ION BEAM TRENCHING
- Publication number 20200098554
- Publication date Mar 26, 2020
- Intel Corporation
- Purushotham Kaushik MUTHUR SRINATH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS, METHODS, AND APPARATUSES FOR IMPLEMENTING A THERMAL SOLUTI...
- Publication number 20190043772
- Publication date Feb 7, 2019
- Intel Corporation
- Purushotham Kaushik MUTHUR SRINATH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAVELENGTH MODULATABLE INTERFEROMETER
- Publication number 20180283845
- Publication date Oct 4, 2018
- Intel Corporation
- Mario Pacheco
- G01 - MEASURING TESTING
Information Patent Application
ELECTRONIC ASSEMBLY USING BISMUTH-RICH SOLDER
- Publication number 20180254256
- Publication date Sep 6, 2018
- Pilin Liu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS TO PREVENT FILLER ENTRAPMENT IN MICROELECTRONIC DEVICE TO M...
- Publication number 20140377916
- Publication date Dec 25, 2014
- Manish Dubey
- H01 - BASIC ELECTRIC ELEMENTS

Purushotham Kaushik Muthur Srinath

Person

Patents Grantslast 30 patents

Laser ablation-based surface property modification and contaminatio...

Microelectronics package comprising a package-on-package (PoP) arch...

Microelectronics package comprising a package-on-package (POP) arch...

Through mold interconnect drill feature

Method and device for failure analysis using RF-based thermometry

Method of sample preparation using dual ion beam trenching

Systems, methods, and apparatuses for implementing a thermal soluti...

Electronic assembly using bismuth-rich solder

Device, system and method for alignment of an integrated circuit as...

Methods to prevent filler entrapment in microelectronic device to m...

Methods to prevent filler entrapment in microelectronic device to m...

Patents Applicationslast 30 patents

MICROELECTRONICS PACKAGE COMPRISING A PACKAGE-ON-PACKAGE (POP) ARCH...

LASER ABLATION-BASED SURFACE PROPERTY MODIFICATION AND CONTAMINATIO...

MICROELECTRONICS PACKAGE COMPRISING A PACKAGE-ON-PACKAGE (POP) ARCH...

THROUGH MOLD INTERCONNECT DRILL FEATURE

MICROELECTRONICS PACKAGE COMPRISING A PACKAGE-ON-PACKAGE (POP) ARCH...

THROUGH MOLD INTERCONNECT DRILL FEATURE

METHOD AND DEVICE FOR FAILURE ANALYSIS USING RF-BASED THERMOMETRY

MICROELECTRONICS PACKAGE COMPRISING A PACKAGE-ON-PACKAGE (POP) ARCH...

THROUGH MOLD INTERCONNECT DRILL FEATURE

LASER ABLATION-BASED SURFACE PROPERTY MODIFICATION AND CONTAMINATIO...

METHOD OF SAMPLE PREPARATION USING DUAL ION BEAM TRENCHING

SYSTEMS, METHODS, AND APPARATUSES FOR IMPLEMENTING A THERMAL SOLUTI...

WAVELENGTH MODULATABLE INTERFEROMETER

ELECTRONIC ASSEMBLY USING BISMUTH-RICH SOLDER

METHODS TO PREVENT FILLER ENTRAPMENT IN MICROELECTRONIC DEVICE TO M...