Pyoung Gug Kim

Person

Gyeonggi-do, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Light emitting device package and backlight unit comprising the same
- Patent number RE48474
- Issue date Mar 16, 2021
- LUMENS CO., LTD.
- Seung Hyun Oh
Information Patent Grant
Quantum dot plate assembly and LED package and module comprising th...
- Patent number 10,879,432
- Issue date Dec 29, 2020
- LUMENS CO., LTD.
- Seung Hyun Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Communication terminal apparatus and method of performing communica...
- Patent number 10,439,942
- Issue date Oct 8, 2019
- Samsung Electronics Co., Ltd.
- Min-ho Lee
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Light emitting device package and backlight unit comprising the same
- Patent number RE47444
- Issue date Jun 18, 2019
- LUMENS CO., LTD.
- Seung Hyun Oh
Information Patent Grant
Audio processing device and audio processing method
- Patent number 10,296,284
- Issue date May 21, 2019
- Samsung Electronics Co., Ltd.
- Pyoung-yun Kim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Package for processing sensed-data, sensed-data processor, and syst...
- Patent number 10,105,102
- Issue date Oct 23, 2018
- Samsung Electronics Co., Ltd.
- Mitsuo Umemoto
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Image sensor package
- Patent number 9,793,309
- Issue date Oct 17, 2017
- Samsung Electronics Co., Ltd.
- Byoung-rim Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device including a lens at a predetermined position...
- Patent number 9,690,030
- Issue date Jun 27, 2017
- LUMENS CO., LTD.
- Seung Hyun Oh
- G02 - OPTICS
Information Patent Grant
Communication terminal apparatus and method of performing communica...
- Patent number 9,577,942
- Issue date Feb 21, 2017
- Samsung Electronics Co., Ltd.
- Min-ho Lee
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Light emitting device package and backlight unit comprising the same
- Patent number 9,142,747
- Issue date Sep 22, 2015
- LUMENS CO., LTD.
- Seung Hyun Oh
- G02 - OPTICS
Information Patent Grant
Semiconductor package having buried post in encapsulant and method...
- Patent number 8,846,446
- Issue date Sep 30, 2014
- Samsung Electronics Co., Ltd.
- Pyoung-Wan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Communication terminal apparatus and method of performing communica...
- Patent number 8,825,899
- Issue date Sep 2, 2014
- Samsung Electronics Co., Ltd.
- Min-ho Lee
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Chip stack package and method of fabricating the same
- Patent number 8,373,261
- Issue date Feb 12, 2013
- Samsung Electronics Co., Ltd.
- Pyoung-wan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and electronic device having the same
- Patent number 8,344,497
- Issue date Jan 1, 2013
- Samsung Electronics Co., Ltd.
- Pyoung-Wan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and methods of manufacturing the semiconducto...
- Patent number 8,154,122
- Issue date Apr 10, 2012
- Samsung Electronics Co., Ltd.
- Chul-Yong Jang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package having buried post in encapsulant and method...
- Patent number 8,093,703
- Issue date Jan 10, 2012
- Samsung Electronics Co., Ltd.
- Pyoung-Wan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip package, electronic device including the semicon...
- Patent number 8,008,771
- Issue date Aug 30, 2011
- Samsung Electronics Co., Ltd.
- Pyoung-Wan Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package having resin substrate with recess and method...
- Patent number 7,898,075
- Issue date Mar 1, 2011
- Samsung Electronics Co., Ltd.
- Chul-Yong Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of fabricating the same
- Patent number 7,807,512
- Issue date Oct 5, 2010
- Samsung Electronics Co., Ltd.
- Teak-Hoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package using chip-embedded interposer substrate
- Patent number 7,626,254
- Issue date Dec 1, 2009
- Samsung Electronics Co., Ltd.
- Min-Ho O
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip stack package and manufacturing method thereof
- Patent number 7,521,810
- Issue date Apr 21, 2009
- Samsung Electronics Co., Ltd.
- In-Ku Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrate and semiconductor package using the same
- Patent number 7,498,679
- Issue date Mar 3, 2009
- Samsung Electronics Co., Ltd.
- Jung-Seok Ryu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for joining lead frames in a package assembly, method for fo...
- Patent number 7,148,080
- Issue date Dec 12, 2006
- Samsung Electronics Co., Ltd.
- Pyoung Wan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor devices
- Patent number 6,946,328
- Issue date Sep 20, 2005
- Samsung Electronics Co. Ltd.
- Pyoung-Wan Kim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250105158
- Publication date Mar 27, 2025
- Samsung Electronics Co., Ltd.
- Sung Min MOON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR TRAINING FAKE IMAGE DISCRIMINATIVE MODEL
- Publication number 20230298332
- Publication date Sep 21, 2023
- SAMSUNG SDS CO., LTD.
- Do-Yeon KIM
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
APPARATUS FOR DEEP FAKE IMAGE DISCRIMINATION AND LEARNING METHOD TH...
- Publication number 20220383481
- Publication date Dec 1, 2022
- SAMSUNG SDS CO., LTD.
- Do-Yeon KIM
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
QUANTUM DOT PLATE ASSEMBLY AND LED PACKAGE AND MODULE COMPRISING TH...
- Publication number 20210091273
- Publication date Mar 25, 2021
- LUMENS CO., LTD
- Seung Hyun OH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
QUANTUM DOT PLATE ASSEMBLY AND LED PACKAGE AND MODULE COMPRISING TH...
- Publication number 20190296196
- Publication date Sep 26, 2019
- LUMENS CO., LTD
- Seung Hyun OH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AUDIO PROCESSING DEVICE AND AUDIO PROCESSING METHOD
- Publication number 20170228213
- Publication date Aug 10, 2017
- Samsung Electronics Co., Ltd.
- Pyoung-yun KIM
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
COMMUNICATION TERMINAL APPARATUS AND METHOD OF PERFORMING COMMUNICA...
- Publication number 20170126570
- Publication date May 4, 2017
- Samsung Electronics Co., Ltd.
- Min-ho LEE
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
PACKAGE FOR PROCESSING SENSED-DATA, SENSED-DATA PROCESSOR, AND SYST...
- Publication number 20160051197
- Publication date Feb 25, 2016
- Samsung Electronics Co., Ltd.
- Mitsuo UMEMOTO
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
IMAGE SENSOR PACKAGE
- Publication number 20150340397
- Publication date Nov 26, 2015
- FUREX CO., LTD.
- Byoung-rim SEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DEVICE AND BACKLIGHT UNIT COMPRISING SAME
- Publication number 20150316700
- Publication date Nov 5, 2015
- LUMENS CO., LTD.
- Seung Hyun OH
- G02 - OPTICS
Information Patent Application
COMMUNICATION TERMINAL APPARATUS AND METHOD OF PERFORMING COMMUNICA...
- Publication number 20140348001
- Publication date Nov 27, 2014
- Samsung Electronics Co., Ltd.
- Min-ho LEE
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
LIGHT EMITTING DEVICE PACKAGE AND BACKLIGHT UNIT COMPRISING THE SAME
- Publication number 20140328083
- Publication date Nov 6, 2014
- Seung Hyun Oh
- G02 - OPTICS
Information Patent Application
SEMICONDUCTOR APPARATUS AND IMAGE SENSOR PACKAGE USING THE SAME
- Publication number 20130193545
- Publication date Aug 1, 2013
- Samsung Electronics Co., Ltd.
- Young-Gyu Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING BURIED POST IN ENCAPSULANT AND METHOD...
- Publication number 20120077311
- Publication date Mar 29, 2012
- Pyoung-Wan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
E-BOOK DEVICE AND METHOD FOR PROVIDING INFORMATION ON MULTI-TASKING...
- Publication number 20110191701
- Publication date Aug 4, 2011
- Samsung Electronics Co., Ltd.
- Pyoung-yun KIM
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Chip stack package and method of fabricating the same
- Publication number 20100244233
- Publication date Sep 30, 2010
- SAMSUNG ELECTRONICS CO., LTD.
- Pyoung-wan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE WITH EMBEDDED INTERPOSER
- Publication number 20100081236
- Publication date Apr 1, 2010
- Samsung Electronics Co., Ltd.
- Se-Young Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20100013076
- Publication date Jan 21, 2010
- Samsung Electronics., Co., Ltd.
- Chul-Yong Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING SEMICONDUCTOR CHIP PACKAGE, SEMICONDUCTOR WAF...
- Publication number 20090298234
- Publication date Dec 3, 2009
- Teak-hoon Lee
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHODS OF MANUFACTURING THE SEMICONDUCTO...
- Publication number 20090289359
- Publication date Nov 26, 2009
- Samsung Electronics Co., Ltd.
- Chul-Yong Jang
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Semiconductor packages and methods of fabricating the same
- Publication number 20090239336
- Publication date Sep 24, 2009
- SAMSUNG ELECTRONICS CO., LTD.
- Teak-Hoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMMUNICATION TERMINAL APPARATUS AND METHOD OF PERFORMING COMMUNICA...
- Publication number 20090187674
- Publication date Jul 23, 2009
- Samsung Electronics Co., Ltd.
- Min-ho LEE
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
METHOD OF AND APPARATUS FOR MANAGING NEIGHBOR NODE HAVING SIMILAR C...
- Publication number 20090154420
- Publication date Jun 18, 2009
- Samsung Electronics Co., Ltd.
- Yong-ku KIM
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SEMICONDUCTOR PACKAGE, ELECTRONIC DEVICE INCLUDING THE SEMICONDUCTO...
- Publication number 20090134528
- Publication date May 28, 2009
- Samsung Electronics Co, Ltd.
- Teak-Hoon LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND ELECTRONIC DEVICE HAVING THE SAME
- Publication number 20090096071
- Publication date Apr 16, 2009
- Samsung Electronics Co., Ltd.
- Pyoung-Wan KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING RESIN SUBSTRATE WITH RECESS AND METHOD...
- Publication number 20090065919
- Publication date Mar 12, 2009
- Samsung Electronics Co., Ltd.
- Chul-Yong Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP PACKAGE, ELECTRONIC DEVICE INCLUDING THE SEMICON...
- Publication number 20090045513
- Publication date Feb 19, 2009
- Samsung Electronics Co., Ltd.
- Pyoung-Wan KIM
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING BURIED POST IN ENCAPSULANT AND METHOD...
- Publication number 20090039491
- Publication date Feb 12, 2009
- Samsung Electronics Co., Ltd.
- Pyoung-Wan KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE USING CHIP-EMBEDDED INTERPOSER SUBSTRATE
- Publication number 20080283996
- Publication date Nov 20, 2008
- Samsung Electronics Co., Ltd.
- Min-Ho O
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP PACKAGE AND METHOD OF MANUFACTURING THE MULTI-CHIP PACKAGE
- Publication number 20080265432
- Publication date Oct 30, 2008
- Samsung Electronics Co., Ltd.
- Min-Ho O
- H01 - BASIC ELECTRIC ELEMENTS

Pyoung Gug Kim

Person

Patents Grantslast 30 patents

Light emitting device package and backlight unit comprising the same

Quantum dot plate assembly and LED package and module comprising th...

Communication terminal apparatus and method of performing communica...

Light emitting device package and backlight unit comprising the same

Audio processing device and audio processing method

Package for processing sensed-data, sensed-data processor, and syst...

Image sensor package

Light emitting device including a lens at a predetermined position...

Communication terminal apparatus and method of performing communica...

Light emitting device package and backlight unit comprising the same

Semiconductor package having buried post in encapsulant and method...

Communication terminal apparatus and method of performing communica...

Chip stack package and method of fabricating the same

Semiconductor package and electronic device having the same

Semiconductor package and methods of manufacturing the semiconducto...

Semiconductor package having buried post in encapsulant and method...

Semiconductor chip package, electronic device including the semicon...

Semiconductor package having resin substrate with recess and method...

Semiconductor packages and methods of fabricating the same

Semiconductor package using chip-embedded interposer substrate

Chip stack package and manufacturing method thereof

Package substrate and semiconductor package using the same

Method for joining lead frames in a package assembly, method for fo...

Method for manufacturing semiconductor devices

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE

METHOD AND APPARATUS FOR TRAINING FAKE IMAGE DISCRIMINATIVE MODEL

APPARATUS FOR DEEP FAKE IMAGE DISCRIMINATION AND LEARNING METHOD TH...

QUANTUM DOT PLATE ASSEMBLY AND LED PACKAGE AND MODULE COMPRISING TH...

QUANTUM DOT PLATE ASSEMBLY AND LED PACKAGE AND MODULE COMPRISING TH...

AUDIO PROCESSING DEVICE AND AUDIO PROCESSING METHOD

COMMUNICATION TERMINAL APPARATUS AND METHOD OF PERFORMING COMMUNICA...

PACKAGE FOR PROCESSING SENSED-DATA, SENSED-DATA PROCESSOR, AND SYST...

IMAGE SENSOR PACKAGE

LIGHT EMITTING DEVICE AND BACKLIGHT UNIT COMPRISING SAME

COMMUNICATION TERMINAL APPARATUS AND METHOD OF PERFORMING COMMUNICA...

LIGHT EMITTING DEVICE PACKAGE AND BACKLIGHT UNIT COMPRISING THE SAME

SEMICONDUCTOR APPARATUS AND IMAGE SENSOR PACKAGE USING THE SAME

SEMICONDUCTOR PACKAGE HAVING BURIED POST IN ENCAPSULANT AND METHOD...

E-BOOK DEVICE AND METHOD FOR PROVIDING INFORMATION ON MULTI-TASKING...

Chip stack package and method of fabricating the same

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE WITH EMBEDDED INTERPOSER

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF FABRICATING THE SAME

METHOD OF FABRICATING SEMICONDUCTOR CHIP PACKAGE, SEMICONDUCTOR WAF...

SEMICONDUCTOR PACKAGE AND METHODS OF MANUFACTURING THE SEMICONDUCTO...

Semiconductor packages and methods of fabricating the same

COMMUNICATION TERMINAL APPARATUS AND METHOD OF PERFORMING COMMUNICA...

METHOD OF AND APPARATUS FOR MANAGING NEIGHBOR NODE HAVING SIMILAR C...

SEMICONDUCTOR PACKAGE, ELECTRONIC DEVICE INCLUDING THE SEMICONDUCTO...

SEMICONDUCTOR PACKAGE AND ELECTRONIC DEVICE HAVING THE SAME

SEMICONDUCTOR PACKAGE HAVING RESIN SUBSTRATE WITH RECESS AND METHOD...

SEMICONDUCTOR CHIP PACKAGE, ELECTRONIC DEVICE INCLUDING THE SEMICON...

SEMICONDUCTOR PACKAGE HAVING BURIED POST IN ENCAPSULANT AND METHOD...

SEMICONDUCTOR PACKAGE USING CHIP-EMBEDDED INTERPOSER SUBSTRATE

MULTI-CHIP PACKAGE AND METHOD OF MANUFACTURING THE MULTI-CHIP PACKAGE