Pyung Hwa HAN

Person

  • Suwon-si, KR

Patents Grantslast 30 patents

  • Information Patent Grant

    Semiconductor package

    • Patent number 11,189,567
    • Issue date Nov 30, 2021
    • Samsung Electronics Co., Ltd.
    • Pyung Hwa Han
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor package

    • Patent number 11,094,660
    • Issue date Aug 17, 2021
    • Samsung Electronics Co., Ltd.
    • Jung Soo Kim
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor package having mark with identification information

    • Patent number 10,825,778
    • Issue date Nov 3, 2020
    • Samsung Electronics Co., Ltd.
    • Sung Hawn Bae
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Fan-out semiconductor package

    • Patent number 10,515,916
    • Issue date Dec 24, 2019
    • Samsung Electronics Co., Ltd.
    • Dae Jung Byun
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Fan-out semiconductor package

    • Patent number 10,157,868
    • Issue date Dec 18, 2018
    • Samsung Electro-Mechanics Co., Ltd.
    • Dae Jung Byun
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

  • Information Patent Application

    SEMICONDUCTOR PACKAGE

    • Publication number 20200118959
    • Publication date Apr 16, 2020
    • Samsung Electronics Co., Ltd.
    • Jung Soo KIM
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE

    • Publication number 20200111742
    • Publication date Apr 9, 2020
    • Samsung Electronics Co., Ltd.
    • Pyung Hwa HAN
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE

    • Publication number 20200105679
    • Publication date Apr 2, 2020
    • Samsung Electronics Co., Ltd.
    • Sung Hawn Bae
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    FAN-OUT SEMICONDUCTOR PACKAGE

    • Publication number 20180308815
    • Publication date Oct 25, 2018
    • Samsung Electro-Mechanics Co., Ltd.
    • Dae Jung BYUN
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    FAN-OUT SEMICONDUCTOR PACKAGE

    • Publication number 20180061795
    • Publication date Mar 1, 2018
    • Samsung Electro-Mechanics Co., Ltd.
    • Dae Jung BYUN
    • H01 - BASIC ELECTRIC ELEMENTS