Qi Deng

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Shanghai, CN

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device including vertical wire bonds
- Patent number 11,749,647
- Issue date Sep 5, 2023
- Western Digital Technologies, Inc.
- Xiaofeng Di
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated electronic element module, semiconductor package, and me...
- Patent number 11,456,279
- Issue date Sep 27, 2022
- Western Digital Technologies, Inc.
- Cong Zhang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING VERTICAL WIRE BONDS
- Publication number 20210366875
- Publication date Nov 25, 2021
- Western Digital Technologies, Inc.
- Xiaofeng Di
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED ELECTRONIC ELEMENT MODULE, SEMICONDUCTOR PACKAGE, AND ME...
- Publication number 20210043602
- Publication date Feb 11, 2021
- Western Digital Technologies, Inc.
- Cong Zhang
- H01 - BASIC ELECTRIC ELEMENTS