QI JIE PENG

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Patents Grantslast 30 patents

Information Patent Grant
Adhesive-less substrate bonding to carrier plate
- Patent number 10,847,400
- Issue date Nov 24, 2020
- Applied Materials, Inc.
- Sriskantharajah Thirunavukarasu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHODS AND APPARATUS FOR CONTACTLESS SUBSTRATE WARPAGE CORRECTION
- Publication number 20210057238
- Publication date Feb 25, 2021
- Applied Materials, Inc.
- CHIN WEI TAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR SUBSTRATE WARPAGE CORRECTION
- Publication number 20210035795
- Publication date Feb 4, 2021
- Applied Materials, Inc.
- Qi Jie PENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR REMOVING ABRASIVE PARTICLES
- Publication number 20200306931
- Publication date Oct 1, 2020
- Applied Materials, Inc.
- PRAYUDI LIANTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE-LESS SUBSTRATE BONDING TO CARRIER PLATE
- Publication number 20200211883
- Publication date Jul 2, 2020
- Applied Materials, Inc.
- SRISKANTHARAJAH THIRUNAVUKARASU
- H01 - BASIC ELECTRIC ELEMENTS